EP0768808A1 - Matériau pour cadre de conducteur d'un transducteur électro-acoustique - Google Patents

Matériau pour cadre de conducteur d'un transducteur électro-acoustique Download PDF

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Publication number
EP0768808A1
EP0768808A1 EP96306952A EP96306952A EP0768808A1 EP 0768808 A1 EP0768808 A1 EP 0768808A1 EP 96306952 A EP96306952 A EP 96306952A EP 96306952 A EP96306952 A EP 96306952A EP 0768808 A1 EP0768808 A1 EP 0768808A1
Authority
EP
European Patent Office
Prior art keywords
lead frame
lead
electroacoustic transducer
frame material
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96306952A
Other languages
German (de)
English (en)
Inventor
Takahiro Star Micronics Co. Ltd. Sone
Kazushi Star Micronics Co. Ltd. Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Star Micronics Co Ltd
Original Assignee
Star Micronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Micronics Co Ltd filed Critical Star Micronics Co Ltd
Publication of EP0768808A1 publication Critical patent/EP0768808A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads

Definitions

  • the present invention relates to a lead frame material for an electroacoustic transducer, forming a lead terminal of the electroacoustic transducer that converts an electric signal into an acoustic wave.
  • the electroacoustic transducer converts an electric signal into an oscillating magnetic field, and converts it into an acoustic wave.
  • the electroacoustic transducer is covered with a case made of a synthetic resin, inside of which an electromagnetic converting portion is incorporated.
  • This electromagnetic converting portion converts an electric signal into an oscillating magnetic field, and converts the oscillating magnetic field into an aerial vibration.
  • the lead terminal is to connect this electromagnetic converting portion to an outer circuit.
  • the electroacoustic transducer is built in a portable phone, etc., and used in announcement for receiving. To cope with the miniaturization of various electronic equipment such as a portable phone, the electroacoustic transducer has been devised to be made thin, small, and light. This kind of electroacoustic transducer trends toward a flat lead terminal that can be used in surface mounting, in replacement of a conventional lead wire system. And, this kind of flat lead terminal is formed by a lead flame material provided with plural lead terminal parts.
  • Alloys of brass, phosphor bronze and the like have generally been used in the conventional lead flame material. Copper alloy is characterized by being inexpensive, having a high thermal conductivity, having a good solderability, and the like. A high thermal conductivity leads to an advantage to give a good heat radiation when used in an electronic component.
  • the lead frame used in assembling an electroacoustic transducer has a form such that the lead terminals project into a space surrounded by frame guide rails.
  • this form of lead frame is made of a material having a high thermal conductivity and coil terminals of the electroacoustic transducer are soldered to the lead terminals, heat diffuses into the frame guide rails from the lead terminals so that the localized heating on the lead terminals for connecting the coil terminals is difficult to be achieved.
  • soldering of the coil terminals to the lead terminals is difficult in normal heating, and it needs to raise the heating temperature or extend the heating time, which can create a risk of a damage by the heat to a resin close to the land of the soldering .
  • the lead frame needs to have a thickness that gains a mechanical strength required for an assembly work and after an outer lead forming; conventionally, the thickness is made comparably thick about 0.2 mm.
  • this thick lead frame increases the heat radiation from the lead terminals to the frame guide rails, making the soldering of the coil terminals more difficult.
  • this thickness of the lead frame leads to increasing the weight of the electroacoustic transducer as a product, which hinders the electroacoustic transducer from being made smaller and lighter.
  • copper alloy composing the lead frame material contains components such as Zn and Be that deteriorate soldering wettability, and these components are separated out with time on the solder plating layer to deteriorate soldering wettability.
  • a double layer plating of Ni and Cu becomes necessary.
  • the present invention provides a lead frame material for the electroacoustic transducer that does not deteriorate soldering wettability and enables localized heating through decreasing thermal conductivity.
  • the lead frame material for the electroacoustic transducer according to the first aspect of the present invention is to form lead terminals (10A, 10B, 10C, 10D) of the electroacoustic transducer, which is an alloy that contains 32 to 55% Ni by weight with Fe as the primary component and has a crystal grain size of 7.0 or more by the grain size number.
  • This composition lowers thermal conductivity and heat radiation to enable a localized heating required for soldering. A prolonged heating at a high temperature becomes unnecessary so that a damage to the case made of a resin can be prevented, thereby enhancing the reliability of the electroacoustic transducer. Further, the lead frame material can be made thin, lowering heat radiation, facilitating local heating in soldering, and reducing the material usage per product.
  • the lead frame material for the electroacoustic transducer according to the second aspect of the present invention is to form lead terminals (10A, 10B, 10C, 10D) of the electroacoustic transducer, which is an alloy that contains 32 to 55% Ni by weight, 1.0% or less Mn by weight, 1.0% or less Si by weight, and 0.05% or less C by weight, with Fe as the primary component, having a crystal grain size of 7.0 or more by the grain size number.
  • This composition does not contain a component to deteriorate soldering wettability, which facilitates a substrate plating to enhance a barrier effect, and reduces the double layers of Ni-plating and Cu-plating to a single layer of Ni-plating.
  • the frame material for the electroacoustic transducer is an alloy that contains 32 to 55% Ni by weight, 1.0% or less Mn by weight, 1.0% or less Si by weight, 0.05% or less C by weight, and other unavoidable impurities, Fe being as the primary component of the remainder, and has a crystal grain size of 7.0 or more by the grain size number.
  • one or more of Al, Ti, V, Nb, Ta, Cr, Co, Cu, Mo, W, and B may be added by 0.01 to 2.0% in total. Adding these substances can increase the mechanical strength of the alloy composing the lead frame material, thereby decreasing the thickness to about 0.13 mm without deformation.
  • the crystal grain size is defined as 7.0 or more by the grain size number so as to prevent deformation in a fine press work after the lead frame material of the electroacoustic transducer is thinly made.
  • an Fe - Ni alloy containing 36% Ni, 42% Ni, and 50% Ni as the basic components is fused in vacuum, which thereafter are processed through casting, forging and hot rolling, and then cold rolling and annealing are repeatedly applied to form 0.13 mm thick rolled materials.
  • an Fe-Ni alloy containing 29% Ni and 17% Co as primary ingredients is fused in vacuum to form a rolled material of 0.13 mm by repeatedly applying cold rolling and annealing after casting, forging and hot rolling.
  • a lead frame is formed by applying a press work to the rolled material produced by the foregoing process.
  • Fig. 1 shows the lead frame as one example.
  • the lead frame 2 is applied with an electroless plating as a substrate plating, on the surface of which solder plating is applied.
  • This lead frame 2 is provided with the frame guide rails 4 on both the outer edges, guide holes 6, a space 8 sandwiched between the frame guide rails 4, and plural lead terminal parts 10A, 10B, 10C, and 10D projecting into the space 8.
  • the lead terminal parts 10A to 10D are processed into the lead terminals.
  • a base part 12 is formed on the lead frame 2. That is, the lead frame 2 is mounted on the mold, and a yoke 14 and the lead terminals 10A, 10B, 10C, and 10D are formed by the insert molding. In this case, the surface of the yoke 14 and the soldering surfaces of the lead terminals 10A, 10B, 10C, and 10D are exposed above the base part 12. And, the yoke 14 is provided with a pole 16 in advance.
  • a coil 18 is wounded around the pole 16 on the lead frame 2.
  • the supporting ring 20, magnet 22, and diaphragm 24 are made in advance.
  • the supporting ring 20 is glued inside the base part 12 molded on the lead frame 2, and the magnet 22 is mounted inside of the supporting ring 20, and the diaphragm 24 is mounted on the supporting ring 20.
  • the coil terminals 26A, 26B are soldered on the lead terminals 10A, 10B as shown in Fig. 5.
  • a case 28 is molded of a synthetic resin, and placed on the base part 12 on the lead frame 2 as shown in Fig. 6. And, as shown in Fig, 7, the case 28 is joined on the base 12 by the ultrasonic bonding. This bonding may be replaced by glue.
  • the electroacoustic transducer is produced on the lead frame 2, as shown in Fig. 8, by this bonding.
  • the lead terminal parts 10A, 10B, 10C, and 10D are cut off from the lead frame 2, which thereafter be formed as the lead terminals of the electroacoustic transducer, thus completing the electroacoustic transducer.
  • Test pieces are made of the lead frame material obtained at the process a for a material property test. Electroacoustic transducers are made according to the processes a to f for performing an evaluation test. The test piece is made in a strip form of 10 mm width in the rolling direction and 100 mm length. These are shown in the embodiment 1 to 4 in Table 1.
  • the lead frame material of the present invention has a higher mechanical strength than the conventional lead frame material using Cu alloy, and deformation, etc., at press work and assembly is not caused. Since the thermal conductivity is lower than that of a Cu alloy, quantity of heat during soldering the coil terminals can be reduced, which prevents damages to the resin case.
  • the soldering time is actually reduced to be 1.6 seconds compared with 2.5 seconds required for the conventional products, that is, about 64% saving of time for processing.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
EP96306952A 1995-09-28 1996-09-24 Matériau pour cadre de conducteur d'un transducteur électro-acoustique Withdrawn EP0768808A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP276276/95 1995-09-28
JP27627695A JP3463777B2 (ja) 1995-09-28 1995-09-28 電気音響変換器用リードフレーム材及び電気音響変換器

Publications (1)

Publication Number Publication Date
EP0768808A1 true EP0768808A1 (fr) 1997-04-16

Family

ID=17567194

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96306952A Withdrawn EP0768808A1 (fr) 1995-09-28 1996-09-24 Matériau pour cadre de conducteur d'un transducteur électro-acoustique

Country Status (2)

Country Link
EP (1) EP0768808A1 (fr)
JP (1) JP3463777B2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279418B2 (en) 2003-12-12 2007-10-09 Commissariat A L'energie Atomique Plastically deformable irreversible storage medium and method of producing one such medium

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011922B2 (ja) * 2012-09-20 2016-10-25 大日本印刷株式会社 カメラモジュールの駆動機構用板バネおよびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144157A (ja) * 1984-08-09 1986-03-03 Nippon Mining Co Ltd プレス打抜き性に優れたＦｅ−Ｎｉ系合金
JPH02100354A (ja) * 1988-10-07 1990-04-12 Hitachi Metals Ltd Ｉｃリード用部材
JPH02285054A (ja) * 1989-04-26 1990-11-22 Hitachi Metals Ltd エッチング加工性に優れたリードフレーム用Ｆｅ―Ｎｉ系合金
JPH04221020A (ja) * 1990-12-23 1992-08-11 Nikko Kyodo Co Ltd リ−ドフレ−ム材の製造方法
JPH04231419A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd リードフレーム材の製造方法
EP0650308A1 (fr) * 1993-10-25 1995-04-26 Star Micronics Co., Ltd. Transducteur électroacoustique et sa méthode de fabrication

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144157A (ja) * 1984-08-09 1986-03-03 Nippon Mining Co Ltd プレス打抜き性に優れたＦｅ−Ｎｉ系合金
JPH02100354A (ja) * 1988-10-07 1990-04-12 Hitachi Metals Ltd Ｉｃリード用部材
JPH02285054A (ja) * 1989-04-26 1990-11-22 Hitachi Metals Ltd エッチング加工性に優れたリードフレーム用Ｆｅ―Ｎｉ系合金
JPH04221020A (ja) * 1990-12-23 1992-08-11 Nikko Kyodo Co Ltd リ−ドフレ−ム材の製造方法
JPH04231419A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd リードフレーム材の製造方法
EP0650308A1 (fr) * 1993-10-25 1995-04-26 Star Micronics Co., Ltd. Transducteur électroacoustique et sa méthode de fabrication

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 8615, Derwent World Patents Index; Class L03, AN 86-098321 *
DATABASE WPI Section Ch Week 9021, Derwent World Patents Index; Class L03, AN 90-159436 *
DATABASE WPI Section Ch Week 9102, Derwent World Patents Index; Class L03, AN 91-011672 *
DATABASE WPI Section Ch Week 9238, Derwent World Patents Index; Class L03, AN 92-313559 *
DATABASE WPI Section Ch Week 9240, Derwent World Patents Index; Class L03, AN 92-326884 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 203 (C - 360) 16 July 1986 (1986-07-16) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 308 (E - 0947) 3 July 1990 (1990-07-03) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 056 (C - 0804) 8 February 1991 (1991-02-08) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 566 (C - 1009) 8 December 1992 (1992-12-08) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 581 (C - 1012) 21 December 1992 (1992-12-21) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279418B2 (en) 2003-12-12 2007-10-09 Commissariat A L'energie Atomique Plastically deformable irreversible storage medium and method of producing one such medium

Also Published As

Publication number Publication date
JPH0998498A (ja) 1997-04-08
JP3463777B2 (ja) 2003-11-05

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