EP0702378B1 - Chip-Induktivität - Google Patents

Chip-Induktivität Download PDF

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Publication number
EP0702378B1
EP0702378B1 EP95114392A EP95114392A EP0702378B1 EP 0702378 B1 EP0702378 B1 EP 0702378B1 EP 95114392 A EP95114392 A EP 95114392A EP 95114392 A EP95114392 A EP 95114392A EP 0702378 B1 EP0702378 B1 EP 0702378B1
Authority
EP
European Patent Office
Prior art keywords
contact elements
chip inductor
winding
inductor according
core part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95114392A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0702378A3 (enrdf_load_stackoverflow
EP0702378A2 (de
Inventor
Uwe Dipl.-Phys. Hildebrandt
Wilfried Dipl.-Ing.(FH) Scherer
Manfred Dipl.-Phys. Espenhain
Ralf Dr. Ing. Humke
Hans-Dieter Dipl.-Ing. Eckardt
Winfried Dipl.-Ing. Grauer
Lothar Hock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP0702378A2 publication Critical patent/EP0702378A2/de
Publication of EP0702378A3 publication Critical patent/EP0702378A3/xx
Application granted granted Critical
Publication of EP0702378B1 publication Critical patent/EP0702378B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire

Definitions

  • the invention relates to a chip inductance, in particular Air coil, choke or transformer, with a solid core made of ferromagnetic or electrically non-conductive Material, especially ferrite, ceramic or plastic, with one can be wound in one or more layers and in parallel Front ends of the core part of the changing room, at of the winding ends with contact elements arranged on the end face are welded.
  • Such a chip inductance is known from EP-0177759-B1 known.
  • the core part has in the area of the front ends arranged recesses for receiving platelet-shaped Contact elements are determined to which the winding wires be welded on.
  • the one required for ultrasonic welding leads minimum welding time of approx. 0.5 s even with automatic Feeding of component and welding sonotrodes at cycle times of approx. 1 s.
  • DE-3307773-A1 also describes an indirect method Laser welding of contact springs is known in the thin insulated winding wires by a plate against the direct Shielding laser radiation (sandwich technology), where the plate and the winding point on the component are different Parts are.
  • the material of the winding point is so neither shielding nor welding material.
  • DE-2946626-A1 describes another indirect method Laser welding described. Thereby, lead wires that e.g. are the winding ends of a coil to the connector pins contacted a carrier or printed circuit board, the connecting pins Parts of one contained in the carrier plate punched circuit or in the circuit of a circuit board are welded in.
  • this process is in SMT technology not applicable because the contacting of windings to connections on a board with the known High performance placement machines is not possible.
  • the winding on the electrical Connections of the component can be contacted.
  • the in the DE-2946626-A1 not included, to be wrapped pins on the component connections are due to the required small dimensions for chip inductors because of technical requirements for winding and because of the cost of the associated winding machines cannot be realized.
  • the object of the present invention is a chip inductance of the type mentioned at the beginning, the winding ends are welded to the contact elements, and with Cycle times under 1s can be produced in automated production are.
  • the contact elements are attached that the contact elements have a coating of a solder metal, and are designed such that they can be used both as shielding and as Welding material used in indirect laser welding and that Contact elements (2) have a recess (7) which as The winding and unwinding point is designed.
  • the 1 to 3 is a solid core part 4 with a Changing room 5 shown.
  • the winding 6 is in the winding space 5 the chip inductance arranged, which preferably consists of a There is copper wire with high temperature resistant enamel insulation.
  • Contact elements 2, which are part of a system carrier 1, are attached to the end faces 8 of the core part 4, preferably glued.
  • the system carrier 1, for example made of CuSn6 consists of a surface coating of a solder metal, preferably tin or a tin-lead alloy.
  • the contact elements have a recess 7, which in addition as the winding and unwinding point of the ends 9 of the winding 6 serves. Furthermore, the contact elements 2 are designed such that they are used as both shielding and welding material serve indirect laser welding. How especially out 3 shows the ends 9 of the winding 6 guided in the contact element 2 that they in the area of Recess 7 sandwiched between the contact elements 2 arranged parts come to rest. In this area the weld 10 attached.
  • the contact elements 2 have one Slot 3 on that the three-dimensional positioning of the Core part 4 is retained in the system carrier 1, but the Contact elements 2 in the slot 3 are interrupted.
  • chip inductors with system carrier 1 avoids the wrapping of winding and unwinding pins on the Component.
  • Sandwich technology with contact elements 2, which serve as shielding and welding material at the same time, avoids the positioning effort for separate shielding plates.
  • the contact elements 2 with slot 3 and recess 7 result in higher quality values for the chip inductance in comparison to uninterrupted contact elements with cutouts, which act as short-circuit winding.
  • the surface of the contact elements 2 made of solder is today required by the user as state of the art, and the Welded joint is stronger than a soldered joint and allows the use of winding wires with warm or highly heat-resistant paint insulation for the use of components Temperatures> 125 ° C. It is also encapsulated with high-temperature thermoplastics possible, as in DE-4023141-A1 is described. After all, laser welding only needs Welding times in the order of ms and enables thus cycle times under 1s, which are necessary for cost reasons are.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
EP95114392A 1994-09-14 1995-09-13 Chip-Induktivität Expired - Lifetime EP0702378B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4432740A DE4432740A1 (de) 1994-09-14 1994-09-14 Chip-Induktivität
DE4432740 1994-09-14

Publications (3)

Publication Number Publication Date
EP0702378A2 EP0702378A2 (de) 1996-03-20
EP0702378A3 EP0702378A3 (enrdf_load_stackoverflow) 1996-04-24
EP0702378B1 true EP0702378B1 (de) 2004-08-18

Family

ID=6528209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95114392A Expired - Lifetime EP0702378B1 (de) 1994-09-14 1995-09-13 Chip-Induktivität

Country Status (4)

Country Link
EP (1) EP0702378B1 (enrdf_load_stackoverflow)
JP (1) JP3961036B2 (enrdf_load_stackoverflow)
DE (2) DE4432740A1 (enrdf_load_stackoverflow)
FI (1) FI954320L (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710462C2 (de) * 1997-03-13 1999-05-20 Siemens Matsushita Components Elektrisches Bauelement, insbesondere Chipinduktivität
DE19713147C2 (de) * 1997-03-27 1999-09-09 Siemens Matsushita Components Chip-Induktivität
DE202005019497U1 (de) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Induktives Miniatur-Bauelement für SMD-Montage
DE202005019496U1 (de) * 2005-12-14 2007-04-26 Neosid Pemetzrieder Gmbh & Co Kg Induktives Miniatur-Bauelement für SMD-Montage

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1596509A (enrdf_load_stackoverflow) * 1968-07-18 1970-06-22
DE2636674A1 (de) * 1976-08-14 1978-02-16 Bosch Gmbh Robert Verfahren zur herstellung einer draht-anschlusselement-verbindung
DE2946626C2 (de) * 1979-11-19 1982-04-08 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur Ankontaktierung von dünnen elektrischen Leitungsdrähten
JPS57114207A (en) * 1981-01-08 1982-07-16 Toshiba Corp Electromagnetic coil and manufacture thereof
JPS57132306A (en) * 1981-02-10 1982-08-16 Toshiba Corp Electromagnetic coil and manufacture therefor
JPS57153419A (en) * 1981-03-18 1982-09-22 Toshiba Corp Laser welding method
DE3307773A1 (de) 1983-03-04 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserschweissen von duennen draehten und folien
US4704592A (en) 1984-09-13 1987-11-03 Siemens Aktiengesellschaft Chip inductor electronic component
DE3513435A1 (de) 1985-04-15 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abreisssicheren kontaktieren lackisolierter draehte, insbesondere zur anwendung bei elektronischen bauteilen
DE8620265U1 (de) * 1986-07-29 1986-11-20 Weiner, René, 5275 Bergneustadt Lötstützpunkt mit Drahtklemme für Kleinstspulenkörper
EP0410211A1 (de) 1989-07-28 1991-01-30 Siemens Aktiengesellschaft Verfahren zur Herstellung einer elektrisch leitenden Verbindung zwischen Kupferlackdrähten und Anschlusselementen
DE4023141A1 (de) * 1990-07-20 1992-01-30 Siemens Matsushita Components Verfahren zum herstellen einer quaderaehnlichen umhuellten induktivitaet zur oberflaechenmontage
DE4039527C1 (enrdf_load_stackoverflow) 1990-12-11 1992-06-25 Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De
JPH04369811A (ja) * 1991-04-05 1992-12-22 Matsushita Electric Works Ltd コイル端末処理方法
DE4139437A1 (de) * 1991-11-29 1993-06-03 Siemens Ag Verfahren zum herstellen von klebverbindungen zwischen wickelkoerpern fuer elektrische bauelemente und deren anschlussdraehten

Also Published As

Publication number Publication date
DE4432740A1 (de) 1996-03-21
JP3961036B2 (ja) 2007-08-15
FI954320A0 (fi) 1995-09-14
EP0702378A3 (enrdf_load_stackoverflow) 1996-04-24
JPH0888130A (ja) 1996-04-02
EP0702378A2 (de) 1996-03-20
FI954320A7 (fi) 1996-03-15
DE59510936D1 (de) 2004-09-23
FI954320L (fi) 1996-03-15

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