EP0699781A1 - Procédé électrolytique de traitement en particulier de revêtement en continu d'un substrat - Google Patents

Procédé électrolytique de traitement en particulier de revêtement en continu d'un substrat Download PDF

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Publication number
EP0699781A1
EP0699781A1 EP95112519A EP95112519A EP0699781A1 EP 0699781 A1 EP0699781 A1 EP 0699781A1 EP 95112519 A EP95112519 A EP 95112519A EP 95112519 A EP95112519 A EP 95112519A EP 0699781 A1 EP0699781 A1 EP 0699781A1
Authority
EP
European Patent Office
Prior art keywords
electrolyte
nozzle body
flow
coated
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95112519A
Other languages
German (de)
English (en)
Other versions
EP0699781B1 (fr
Inventor
Timm Von Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metallglanz Gesellschaft fur Entgratung und Oberflachentechnik Mbh
Metallglanz Gesell fur Entgratung und Oberflachentechnik mbh
Original Assignee
Metallglanz Gesellschaft fur Entgratung und Oberflachentechnik Mbh
Metallglanz Gesell fur Entgratung und Oberflachentechnik mbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallglanz Gesellschaft fur Entgratung und Oberflachentechnik Mbh, Metallglanz Gesell fur Entgratung und Oberflachentechnik mbh filed Critical Metallglanz Gesellschaft fur Entgratung und Oberflachentechnik Mbh
Publication of EP0699781A1 publication Critical patent/EP0699781A1/fr
Application granted granted Critical
Publication of EP0699781B1 publication Critical patent/EP0699781B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Definitions

  • the invention relates to a galvanic method for galvanic or chemical treatment, in particular for the continuous application of metallic layers to a body according to the preamble of claim 1, and a device for performing the method.
  • the current density deposition rate curve therefore has an asymptotic limit, which, as mentioned, arises from the electrically insulating diffusion layer when there is insufficient supply of material. This can be remedied by moving the electrolyte. As experiments have shown, the diffusion layer thickness decreases with increasing intensity of the electrolyte movement. On the other hand, metallic precipitates become rough and powdery if current densities are chosen that approach the theoretically possible limit current densities. To obtain perfect coating qualities, current densities must therefore be chosen that are far below the possible ones Limit current density and are usually only about a third of the limit current density.
  • the object of the invention is to remedy this by means of an improved galvanic process and by a device for carrying out the process, in order to make it possible to almost completely dissolve both the diffusion layer between the electrolyte and the body to be coated, and the asymptotic limit value of the deposition rate. Shift the curve upwards in order to significantly reduce the coating time and to improve the quality of the metal coating.
  • the method according to the invention enables the deposition rate to be increased by almost completely dissolving the diffusion layer while at the same time improving the coating quality in the selected working area of the current density deposition rate curve.
  • the body to be treated is flowed uniformly from all sides regardless of the size of its diameter and its surface quality.
  • the gradual partial change in the flow along the body not only eliminates a pressure drop of the injected electrolyte with respect to the length of the body under pressure, but also, seen from the galvanizing process, a pulsating effect on the body electrical current flow achieved.
  • the orifices act as throttling points at which the flow speed increases, which has an effect on the material transport as an increase in current.
  • Both the directional flow of the body from all sides at high speed and the partial change in the flow rate have the effect that the diffusion layer along the body surface mentioned is almost completely destroyed, so that an undisturbed transport of material to the cathode is ensured.
  • the flow effect of the orifices also automatically centers the body to be treated in the nozzle body, so that a uniform geometric distance between the body and the inner wall of the nozzle body is ensured. Uniform layer thicknesses are achieved and short circuits avoided. In addition, it is ensured that the metal coating applied to the body is not mechanically damaged.
  • the process according to the invention allows, e.g. a current density of 10 to 400 A / dm2 also for galvanizing.
  • the deposition rate is therefore approximately 3.5 times higher than that measured in the prior art.
  • the diaphragms made of non-metallic, electrically non-conductive material, such as plastic or ceramic, in the form of ring disks, allow the choice of the mutual distance and the inner diameter taking into account the diameter of the outlet openings of the bores and their number - Volume throughput of the electrolyte - and its strength to optimally determine the pulse width and pulse frequency of the electrical current flow acting on the body to be galvanized.
  • electrically conductive material of the screens other electric fields are created in the electrolyte and thus also other types of coating. The same applies to alternatingly arranged blend materials. In this way, as tests have shown, it is possible to galvanically deposit metal alloys and predeterminable microstructures, as was previously not possible.
  • any number of devices according to the invention can be arranged in series one behind the other.
  • a method has become known from DE 33 17 970 A1 of electrolytically locally coating a printed circuit board by means of an electrolyte emerging from two opposing nozzles; see. there page 7, lines 11 to 13.
  • the circuit board is guided past the nozzles in a manner similar to wave soldering, for which purpose the electrolyte is fed from a trough to the nozzles and is discharged from them.
  • the nozzles are therefore used only for the targeted partial coating of the printed circuit boards and not for increasing the exit speed of the electrolyte, so that the problem of the dissolution of a diffusion layer due to an end speed of the electrolyte adding up from speed vectors to produce a turbulent flow was not addressed there and therefore also not given is.
  • a process tank 10 contains a work container 12 for receiving devices 14 to be described for galvanizing or chemical treatment, according to the exemplary embodiment for the continuous application of a metal layer to one continuously guided by the work container 12 and the devices 14 - here rod-shaped - body 15.
  • an electrolyte 18 located in the process trough 10 is fed to the individual device 14 via a pump line 19 and in each case one feed 20 having the shape of a pipe socket.
  • the emerging electrolyte flows back into the process tub 10 in the direction of the arrows 17.
  • the flow rate of the electrolyte can be influenced via the pump.
  • One of the devices 14 is shown enlarged in FIG. As shown there, the electrolyte 18 introduced via the feed 20 flows through the device 14 and reaches a nozzle body 34 via a hollow body 30 in a manner to be described and from there, as the individual arrows show, back into the working container 12 and from there back into the process tub 10.
  • the device designated as a whole by reference numeral 14 for the continuous electroplating of wires, tube outer surfaces or similar bodies 15 comprises, as shown in FIGS. 2 and 3, the hollow body 30 flooded with the electrolyte 18 and forming a pressure vessel with two end faces 31 and 32 and the one as a hollow body trained nozzle body 34 which is arranged coaxially to the hollow body 30.
  • Nozzle body 34 and hollow body 30 have a common central through opening 35.
  • the nozzle body 34 is coated on all sides with an insoluble metal layer 38 of a metal from the platinum group.
  • This metal layer 38 also covers the end faces 31 and 32 and the inner lateral surface of the hollow body 30, and has a thickness of 2 to 20 ⁇ .
  • FIG. 2 shows, for the sake of clarity only the through hole 35 is identified with the metal layer 38. This ensures that the effective areas of the No metal body 34 emit metal ions to the electrolyte 18.
  • the nozzle body 34 has, distributed over its entire circumference, a plurality of bores 44, which are arranged at equal intervals with respect to the longitudinal axis 16 and perpendicular to it, cross-sectional areas 11, which are each inclined at the same angles ⁇ obliquely to and against the flow direction and by a swirl angle ⁇ - see. 3 and 4 - of the body 15 to be coated, which is guided centrally through the nozzle body 34, run.
  • An electrically non-conductive guide ring 26 is arranged on the outlet side 25 of the nozzle body 34.
  • the axis of symmetry 41 of the pipe socket 20 is offset parallel and eccentrically by a distance a from the transverse axis 40 of the device 14. This has the consequence that the flow behavior of the electrolyte 18 pumped into the hollow body 30 enters the hollow body 30 as undisturbed as possible and flows around the nozzle body 34.
  • the inflow openings of the bores 44 each lie on flanks 46 of the outer circumferential surface of the nozzle body 34, each of which is part of constrictions 47 which are V-shaped in cross section and lie one behind the other.
  • the pumped electrolyte 18 flows into these constrictions 47 and from there into the constriction without loss of pressure Bores 44 and via the outlet openings 37, which act as Laval nozzles, into the space of the passage opening 35.
  • the longitudinal axes 16 perpendicularly intersecting planes A to E, orifices 36 are inserted - offset to the cross-sectional areas 11 in the longitudinal direction each have a passage opening 37.
  • FIG. 4 shows one of the diaphragms 36 made of electrically non-conductive material.
  • these screens 36 can also consist of an electrically conductive material, or can be arranged alternately of electrically conductive and non-conductive material.
  • the flow opening 37 of the orifices 36 are gradually enlarged with respect to the flow direction of the electrolyte, which is directed opposite to the flow direction of the body 15 to be coated, in order to prevent a pressure drop in the nozzle body 34.
  • the smallest flow opening 37 is therefore in level E, while the largest flow opening 37 is in level A.
  • the diaphragms 36 have a plurality of swirl-generating incisions 39 which are oriented tangentially to the passage opening 37.
  • the operation of the described device is as follows:
  • the body 15 to be coated is connected to a power source, not shown, at its negative pole, for example via current-carrying contact rollers, while the nozzle body 34 is connected to the positive pole of the power source, not shown, via busbars 13.
  • the current density is adjusted to 10 to 400 A / dm 2 using circuit elements known per se in accordance with the method to be carried out.
  • the natural speed impressed on the body 15 to be coated acts in the direction of passage.
  • the electrolyte 18 moved by the pump 16 is accelerated as it flows through the bores 44, since these act as Laval nozzles, and is injected at an angle ⁇ obliquely to and against the direction of flow of the body 15 to be coated, and at the swirl angle ⁇ .
  • the uniform arrangement of the bores 44 in the nozzle body 34 ensures a uniform impact of the electrolyte 18 on the entire surface of the body 15 to be coated and moving against the flow direction.
  • the oppositely directed movement vectors of the body 15 and the injected electrolyte 18 add up and, under the jet effect of the bores 44 on the surface of the body 15 to be coated, cause a turbulent flow around the entire surface. This turbulent flow almost completely destroys the diffusion layer created during the galvanization.
  • the diaphragms 36 with their stepped passage openings 37 arranged between the respective area planes 11 of the bores 44 the pressure of the electrolyte 18 in the nozzle body 34 is kept constant over its entire length.
  • these diaphragms act as localized rapid currents for the electrolyte 18, so that, viewed from the galvanizing process, a current flow which has a pulsating effect on the body 15 is generated.
  • the guide ring 26 has the task of preventing a short circuit between the body 15 and the nozzle body 34, which would occur if the body 15 would touch the nozzle body 34 due to the relative movements between the body 15 and the electrolyte 18 and the vibrations caused thereby.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP95112519A 1994-08-29 1995-08-09 Procédé électrolytique de traitement en particulier de revêtement en continu d'un substrat Expired - Lifetime EP0699781B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4430652 1994-08-29
DE4430652A DE4430652C2 (de) 1994-08-29 1994-08-29 Galvanisches Verfahren und Vorrichtung zur Durchführung des Verfahrens sowie dessen Verwendung zum galvanischen oder chemischen Behandeln, insbesondere zum kontinuierlichen Aufbringen metallischer Schichten auf einen Körper
US08/520,071 US5595640A (en) 1994-08-29 1995-08-28 Method and apparatus for continuous galvanic application of metallic layers on a body

Publications (2)

Publication Number Publication Date
EP0699781A1 true EP0699781A1 (fr) 1996-03-06
EP0699781B1 EP0699781B1 (fr) 1998-05-27

Family

ID=25939634

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95112519A Expired - Lifetime EP0699781B1 (fr) 1994-08-29 1995-08-09 Procédé électrolytique de traitement en particulier de revêtement en continu d'un substrat

Country Status (5)

Country Link
US (1) US5595640A (fr)
EP (1) EP0699781B1 (fr)
CA (1) CA2156644C (fr)
DE (2) DE4430652C2 (fr)
ES (1) ES2119277T3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2910669A3 (fr) * 2014-01-30 2015-12-02 Harry Igor Schaaf Installation de revêtement galvanique et son procédé de fonctionnement

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030236489A1 (en) * 2002-06-21 2003-12-25 Baxter International, Inc. Method and apparatus for closed-loop flow control system
US7273537B2 (en) * 2002-09-12 2007-09-25 Teck Cominco Metals, Ltd. Method of production of metal particles through electrolysis
DE102006060255B4 (de) * 2006-12-14 2012-09-27 Jochen Holder Verfahren zur galvanischen Beschichtung von Werkstücken in einem zinkhaltigen Elektrolytbad
CN103930599A (zh) * 2011-11-15 2014-07-16 Posco公司 用于制造金属箔的高速水平电铸设备及制造方法
EP2746432A1 (fr) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Dispositif de dépôt galvanique vertical de métal sur un substrat
US20150014176A1 (en) * 2013-07-09 2015-01-15 Raymon F. Thompson Wafer processing apparatus having scroll pump

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3317970A1 (de) 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
GB2147009A (en) * 1983-09-07 1985-05-01 Sumitomo Metal Ind Method and apparatus for continuous electroplating of alloys
DE3439750A1 (de) 1984-10-31 1986-04-30 Inovan-Stroebe GmbH & Co KG, 7534 Birkenfeld Galvanisierverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL235329A (fr) * 1958-01-22
DE2151618C3 (de) * 1971-10-16 1975-05-28 Maschinenfabrik Augsburg-Nuernberg Ag, 8000 Muenchen Verfahren und Vorrichtung zum kathodischen Behandeln dünner elektrisch leitender Faserstränge bzw. -bündel
US3894924A (en) * 1972-11-08 1975-07-15 Raytheon Co Apparatus for plating elongated bodies
US3975242A (en) * 1972-11-28 1976-08-17 Nippon Steel Corporation Horizontal rectilinear type metal-electroplating method
US3994786A (en) * 1975-06-13 1976-11-30 Gte Sylvania Incorporated Electroplating device and method
US4409071A (en) * 1982-12-27 1983-10-11 International Business Machines Corporation Masking for selective electroplating jet method
SE469267B (sv) * 1991-07-01 1993-06-14 Candor Sweden Ab Ytbehandlingsanordning, varvid ett medium under tryck riktas mot en loepande materialbana i en kavitet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3317970A1 (de) 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
GB2147009A (en) * 1983-09-07 1985-05-01 Sumitomo Metal Ind Method and apparatus for continuous electroplating of alloys
DE3439750A1 (de) 1984-10-31 1986-04-30 Inovan-Stroebe GmbH & Co KG, 7534 Birkenfeld Galvanisierverfahren

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2910669A3 (fr) * 2014-01-30 2015-12-02 Harry Igor Schaaf Installation de revêtement galvanique et son procédé de fonctionnement

Also Published As

Publication number Publication date
CA2156644A1 (fr) 1996-03-01
DE59502321D1 (de) 1998-07-02
US5595640A (en) 1997-01-21
DE4430652A1 (de) 1996-03-14
CA2156644C (fr) 2004-12-14
ES2119277T3 (es) 1998-10-01
DE4430652C2 (de) 1997-01-30
EP0699781B1 (fr) 1998-05-27

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