EP1902161B1 - Ensemble d'electrodes et procede de revetement electrochimique de la surface d'une piece - Google Patents
Ensemble d'electrodes et procede de revetement electrochimique de la surface d'une piece Download PDFInfo
- Publication number
- EP1902161B1 EP1902161B1 EP06777644A EP06777644A EP1902161B1 EP 1902161 B1 EP1902161 B1 EP 1902161B1 EP 06777644 A EP06777644 A EP 06777644A EP 06777644 A EP06777644 A EP 06777644A EP 1902161 B1 EP1902161 B1 EP 1902161B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- coating
- workpiece
- electrodes
- jet
- tubular elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
- 238000000034 method Methods 0.000 title claims description 113
- 238000000576 coating method Methods 0.000 title claims description 66
- 239000011248 coating agent Substances 0.000 title claims description 50
- 230000008569 process Effects 0.000 claims description 87
- 239000002105 nanoparticle Substances 0.000 claims description 47
- 239000003792 electrolyte Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011859 microparticle Substances 0.000 description 36
- 239000002245 particle Substances 0.000 description 34
- 238000009826 distribution Methods 0.000 description 19
- 239000010410 layer Substances 0.000 description 19
- 238000006073 displacement reaction Methods 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005422 blasting Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- -1 therefore Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Definitions
- the configuration of the process electrodes as tubular elements and the channels arranged therein make it possible to target a process medium, such as micro- or nanoscale particles or a mixture of a chemical treatment solution and micro- or nanoscale particles dispersed therein, as a jet medium in the form of a jet between the process electrodes and the working electrode as the workpiece. In this way, an effective use of the micro- or nanoscale particles can take place during coating.
- a process medium such as micro- or nanoscale particles or a mixture of a chemical treatment solution and micro- or nanoscale particles dispersed therein
- the number of micro- or nanoscale particles present in the region between the counter electrode arrangement 9 and the workpiece 1 can be purposefully increased or reduced. In this way, the incorporation density of the particles in the coating can be specifically increased and reduced.
- the pressure conditions in the distribution tank 17 can be adjusted for example via the pressure in the inflow 19. Both continuous pressures and pulsating pressures are possible. Controlling the pressure here may include both the pressure amplitude and the frequency at pulsating pressures.
- Coatings with layers which differ from one another due to the incorporation density of the particles can be produced by continuously changing the pressure conditions in the distribution tank 17. It should be noted at this point that the method according to the invention can also be used to produce multi-layer systems which differ from one another by the nature of the particles and have a graded or abrupt change in the density of the incorporated particles. This is possible since the type of particles introduced into the distribution tank 17 and the pressure in the distribution tank 17 can be controlled independently of each other.
- the counter electrode arrangement 9 comprises a plurality of tubular elements 11a to 11e, which form tubular process electrodes 12a to 12e.
- the process electrodes 12a to 12e are connected via an in Fig. 2 not shown line with the pole of a voltage source connectable. All process electrodes 12a to 12e are connected at one end to the distribution tank 17 in such a way that a process medium, for example an electrolyte with dispersed micro- or nanoscale particles, passes through the channels 13 in the interior of the process electrodes 12a to 12e (cf. Fig. 1 ) can flow to the outlet openings 14a to 14e.
- a process medium for example an electrolyte with dispersed micro- or nanoscale particles
- the electrode arrangement 9 according to the invention can be adapted particularly well to the geometry of the workpiece 1 in the described manner, without the need to specially manufacture a specially shaped electrode for this purpose. Due to the same distance of the various openings 14a to 14e of the process electrodes 12a to 12e from the workpiece 1, a uniform distribution of the micro- or nanoscale particles irradiated in the direction of the surface in the coating can be achieved.
- the carrier 129 comprises a first, the distribution tank 17 facing support plate 131 and a second, the distribution tank 17 applied support plate 133. Both support plates have openings whose size is chosen so that between the edges of the openings and through the support plates 131, 133rd passed through process electrodes 11a to 11e remains a game that allows axial displacement of the process electrodes 12a to 12e relative to the carrier 129.
- adjustment plates 134, 136, 138 which likewise have openings which are dimensioned such that the process electrodes 12a to 12e are passed through them with play.
- the Justageplatten 134, 136, 138 therefore do not hinder axial displacement of the process electrodes 12a to 12e in a first state.
- the possible axial displacement of the process electrodes 12a to 12e is limited only by flange-like projections 135, 137, 139 in the region of the process electrodes 12a to 12e which is located inside the carrier 129.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Claims (13)
- Procédé de revêtement électrochimique de la surface ( 2 ) d'une pièce, dans lequel on introduit des particules à l'échelle microscopique ou nanoscopique dans le revêtement, caractérisé
en ce que, pendant le revêtement, on dirige sur la surface ( 2 ) de la pièce plusieurs faisceaux d'un milieu comprenant les particules à l'échelle microscopique ou à l'échelle nanoscopique à introduire. - Procédé suivant la revendication 1,
caractérisé
en ce qu'on forme le milieu seulement des particules à l'échelle microscopique ou à l'échelle nanoscopique. - Procédé suivant la revendication 1,
caractérisé
en ce que l'on disperse les particules à l'échelle microscopique ou à l'échelle nanoscopique dans une solution électrolytique de traitement et en ce que l'on forme le milieu de la solution électrochimique de traitement au sein de laquelle les particules à l'échelle microscopique ou à l'échelle nanoscopique sont dispersées. - Procédé suivant l'une des revendications 1 à 4,
caractérisé
en ce que l'on règle par la pression du faisceau, la quantité de particules à l'échelle microscopique ou à l'échelle nanoscopique introduite dans le revêtement. - Procédé suivant la revendication 4,
caractérisé
en ce qu'on fait varier la pression du faisceau pendant le revêtement électrochimique. - Procédé suivant l'une des revendications 1 à 5,
caractérisé
en ce qu'on modifie la composition du milieu pendant le revêtement électrochimique. - Agencement de revêtement d'une pièce pour la mise en oeuvre du procédé suivant les revendications 1 à 6, comportant un agencement ( 9 ) de contre-électrodes ayant un certain nombre d'électrodes (12) de processus, pour le traitement électrochimique d'une pièce ( 1 ), dans lequel la pièce ( 1 ) forme une électrode de travail, et une cuve d'électrolyte, dans laquelle l'agencement de contre-électrodes est placé, caractérisé en ce que- il y a un dispositif ( 17 ) d'apport d'un milieu de processus pour l'apport d'un milieu de processus aux électrodes ( 12 ) de processus,- les électrodes ( 12 ) de processus sont sous la forme d'éléments ( 11 ) tubulaires ayant des canaux ( 13 ) s'étendant en leur intérieur et ont respectivement une extrémité tournée vers le dispositif ( 17 ) d'apport de milieu de processus et une extrémité éloignée du dispositif ( 17 ) d'apport de milieu de processus avec une ouverture ( 14 ) qui y est disposée, et- les canaux ( 13 ) sont, dans la partie des extrémités, tournés vers le dispositif ( 17 ) d'apport du milieu de processus des éléments ( 11 ) tubulaires, en liaison avec le dispositif ( 17 ) d'apport de milieu de processus et débouchent dans l'ouverture (14) à l'extrémité des éléments ( 11 ) tubulaires éloignée du dispositif d'apport de milieu de processus, dans lequel- les électrodes ( 12 ) de processus et les canaux qui y sont disposés introduisent le milieu de processus respectivement sous la forme d'un faisceau, de manière ciblée dans la région comprise entre les électrodes de processus et l'électrode de travail.
- Agencement ( 9 ) suivant la revendication 7,
caractérisé
en ce que les canaux ( 13 ) se rétrécissent dans la région avant les ouvertures ( 14 ). - Procédé suivant la revendication 8,
caractérisé
en ce que la forme des canaux ( 13 ) dans la région des ouvertures ( 14 ) et/ou la forme des ouvertures ( 14 ) elle-même est choisie en tenant compte de la qualité du faisceau à obtenir. - Procédé suivant l'une des revendications 7 à 9, caractérisé
en ce qu'il y a un dispositif de réglage, pour régler la pression du milieu de processus dans le dispositif ( 17 ) d'apport du milieu de processus. - Procédé suivant l'une des revendications 7 à 10, caractérisé
en ce que les éléments ( 11 ) tubulaires des électrodes ( 12 ) de processus ont une forme en aiguille. - Procédé suivant l'une des revendications 7 à 11, caractérisé
en ce que les éléments ( 11 ) tubulaires des électrodes ( 12 ) de processus sont guidés par un support ( 19 ) commun empli de cire et ont des éléments ( 35, 37, 39 ) de sécurité, qui empêchent, à l'état solidifié, les électrodes (12) de processus de se déplacer axialement par rapport à la cire ( 27 ). - Procédé suivant l'une des revendications 7 à 12, caractérisé
en ce que les éléments ( 11 ) tubulaires des électrodes ( 12 ) de processus sont guidés dans des trous d'au moins une plaque ( 131, 133 ) de support commune, un petit jeu entre les bords des trous et les éléments ( 11 ) tubulaires respectifs étant présent, et en ce qu'un dispositif (134, 136, 138) de serrage est présent, à l'aide duquel les éléments tubulaires peuvent appuyer avec une force telle contre les bords des trous qu'ils sont, en raison du frottement qui se produit, empêchés de se déplacer axialement par rapport à la plaque ( 131, 133 ) de support.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005033857A DE102005033857A1 (de) | 2005-07-12 | 2005-07-12 | Elektrodenanordnung und Verfahren zum elektrochemischen Beschichten einer Werkstückoberfläche |
| PCT/EP2006/064014 WO2007006752A1 (fr) | 2005-07-12 | 2006-07-07 | Ensemble d'electrodes et procede de revetement electrochimique de la surface d'une piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1902161A1 EP1902161A1 (fr) | 2008-03-26 |
| EP1902161B1 true EP1902161B1 (fr) | 2012-08-29 |
Family
ID=36968928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06777644A Not-in-force EP1902161B1 (fr) | 2005-07-12 | 2006-07-07 | Ensemble d'electrodes et procede de revetement electrochimique de la surface d'une piece |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8747638B2 (fr) |
| EP (1) | EP1902161B1 (fr) |
| JP (1) | JP2009501276A (fr) |
| CN (1) | CN101223304A (fr) |
| DE (1) | DE102005033857A1 (fr) |
| DK (1) | DK1902161T3 (fr) |
| WO (1) | WO2007006752A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070275262A1 (en) * | 2006-05-23 | 2007-11-29 | Dechao Lin | Reducing formation of tin whiskers on a tin plating layer |
| CN101717977B (zh) * | 2009-12-08 | 2011-09-14 | 淮海工学院 | 高硬度Cu-SiC纳米复合镀层的制备方法及其专用设备 |
| CN102787332B (zh) * | 2012-08-17 | 2014-12-24 | 湖北联合天诚防伪技术股份有限公司 | 一种喷银板贴板电铸的方法 |
| WO2017110765A1 (fr) * | 2015-12-25 | 2017-06-29 | 株式会社山本鍍金試験器 | Dispositif de placage |
| CN105970260B (zh) * | 2016-04-25 | 2019-05-03 | 江苏师范大学 | 一种在喷射电沉积加工过程中改善均匀性的方法 |
| CN106868572B (zh) * | 2017-04-25 | 2019-07-09 | 广东工业大学 | 一种电泳辅助微纳颗粒熔融自组装表面改性设备 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU67358A1 (fr) | 1973-04-04 | 1974-05-09 | ||
| US4027366A (en) | 1973-08-02 | 1977-06-07 | Beatrice Foods Co. | Multilayer coated substrate |
| US4826508A (en) * | 1986-09-15 | 1989-05-02 | Diabrasive International, Ltd. | Flexible abrasive coated article and method of making it |
| DE59301228D1 (de) | 1992-03-06 | 1996-02-08 | Frei Siegfried | Verfahren und Vorrichtung zur Überwachung des Sprühstromes in einer Pulverbeschichtungsanlage |
| JP3391113B2 (ja) | 1994-10-07 | 2003-03-31 | 豊田合成株式会社 | 複合めっき方法 |
| US5865976A (en) * | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
| DE19521323A1 (de) * | 1995-06-12 | 1996-12-19 | Abb Management Ag | Teil mit einer galvanisch aufgebrachten Beschichtung und Verfahren zur Herstellung von galvanischen Schichten |
| DE19702366C2 (de) * | 1996-01-24 | 2002-10-31 | Toyoda Gosei Kk | Beschichtungsverfahren |
| US6221230B1 (en) | 1997-05-15 | 2001-04-24 | Hiromitsu Takeuchi | Plating method and apparatus |
| US6352636B1 (en) * | 1999-10-18 | 2002-03-05 | General Electric Company | Electrochemical system and process for stripping metallic coatings |
| DE10250471B3 (de) | 2002-10-30 | 2004-04-01 | Lindal Ventil Gmbh | Anlage zur Antikorrosionsbehandlung von Ventiltellern für Spenderbehälter |
| US20040084318A1 (en) * | 2002-11-05 | 2004-05-06 | Uri Cohen | Methods and apparatus for activating openings and for jets plating |
-
2005
- 2005-07-12 DE DE102005033857A patent/DE102005033857A1/de not_active Withdrawn
-
2006
- 2006-07-07 US US11/995,122 patent/US8747638B2/en active Active
- 2006-07-07 JP JP2008520855A patent/JP2009501276A/ja not_active Abandoned
- 2006-07-07 EP EP06777644A patent/EP1902161B1/fr not_active Not-in-force
- 2006-07-07 WO PCT/EP2006/064014 patent/WO2007006752A1/fr active Application Filing
- 2006-07-07 CN CNA2006800254779A patent/CN101223304A/zh active Pending
- 2006-07-07 DK DK06777644.3T patent/DK1902161T3/da active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007006752A1 (fr) | 2007-01-18 |
| JP2009501276A (ja) | 2009-01-15 |
| US20080202936A1 (en) | 2008-08-28 |
| EP1902161A1 (fr) | 2008-03-26 |
| DE102005033857A1 (de) | 2007-01-18 |
| US8747638B2 (en) | 2014-06-10 |
| DK1902161T3 (da) | 2012-10-15 |
| CN101223304A (zh) | 2008-07-16 |
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