EP0681691A1 - Capteur de pression. - Google Patents

Capteur de pression.

Info

Publication number
EP0681691A1
EP0681691A1 EP93902038A EP93902038A EP0681691A1 EP 0681691 A1 EP0681691 A1 EP 0681691A1 EP 93902038 A EP93902038 A EP 93902038A EP 93902038 A EP93902038 A EP 93902038A EP 0681691 A1 EP0681691 A1 EP 0681691A1
Authority
EP
European Patent Office
Prior art keywords
pressure sensor
layer
pressure
substrate
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP93902038A
Other languages
German (de)
English (en)
Other versions
EP0681691B1 (fr
Inventor
Wilfried Mokwa
Michael Kandler
Joerg Amelung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP0681691A1 publication Critical patent/EP0681691A1/fr
Application granted granted Critical
Publication of EP0681691B1 publication Critical patent/EP0681691B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

Definitions

  • the invention is concerned with the field of pressure sensors.
  • the invention is concerned with a relative pressure sensor which can be implemented as a micromechanical structure with the smallest dimensions.
  • the invention relates to a pressure sensor with a substrate and a layer defining a cavity with this substrate, which has a membrane-like area above the cavity, which can be acted upon by a first pressure prevailing outside the cavity, according to the preamble of Claim 1.
  • Pressure sensors which can be implemented using methods of micromechanics and in particular surface micromechanics have been disclosed in a wide variety of configurations in the more recent scientific literature and in the more recent patent literature.
  • the applicant's international patent application PCT / DE91 / 00107 shows an absolute pressure sensor which can be produced from a semiconductor material, such as silicon in particular, using methods of micromechanics and which has a substrate in which by means of a corresponding doping, a conductive semiconductor region is arranged insulated from the substrate, a pressure sensor structure being built up on this conductive semiconductor region in the semiconductor substrate by first applying a spacer layer to the substrate, then a polycrystalline semiconductor layer on the spacer layer is deposited, whereupon the polycrystalline semiconductor layer is doped and the spacer layer, which can also be referred to as the sacrificial layer, is removed by etching via suitable channels.
  • a semiconductor material such as silicon in particular, using methods of micromechanics and which has a substrate in which by means of a corresponding doping, a conductive semiconductor region is arranged insulated from the substrate, a pressure sensor structure being built up on this conductive semiconductor region in the semiconductor substrate by first applying a spacer layer to the substrate, then
  • the channels are closed by depositing a suitable material.
  • a capacitive pressure sensor structure in which the polycrystalline semiconductor layer, together with the substrate, defines a closed cavity, which can be evacuated, for example, or can be filled with a gas with a predetermined pressure.
  • Such a pressure sensor is extremely advantageous in that it enables the detection of an absolute pressure with high measurement accuracy and is designed to be compatible with CMOS circuits due to the isolation of the semiconductor region from the substrate, but there is a limitation of this pressure sensor in that it is only suitable for recording an absolute pressure.
  • Relative pressure sensors or pressure sensors for differential pressure measurement are already known, which have been implemented using micromechanical technologies.
  • the specialist publication Journal of Vacuum Science & Technology / A, Volume 4, No. 3, May to June 1986, Part 1, page 618, column 2, last paragraph to 619, column 1, first paragraph in conjunction with 3 shows a relative pressure sensor constructed from semiconductor materials with a substrate and a polysilicon layer which defines a cavity together with the substrate, the substrate having a rear opening which is formed by anisotropic etching starting from the rear of the substrate up to the cavity.
  • a spacer layer or sacrificial layer for fixing the later pressure sensor cavity is etched out by means of hydrofluoric acid through this rear opening in the manufacture of the pressure sensor.
  • relative pressure sensors of this type have only an inadequate mechanical stability, in particular in the event of an overload. Furthermore, it has been found that such relative pressure sensors have variations in their detection sensitivity. Lichity, so for example in the case of a capacitive relative pressure sensor have variations with respect to the quotient of the change in capacity based on the pressure change also within a single production batch.
  • the invention is therefore based on the object of creating a pressure sensor with which a pressure difference can be measured and which, with good reproducibility of the detection sensitivity, allows extensive microinaturation within a production batch of pressure sensors.
  • the invention teaches to supply the internal pressure for the pressure sensor cavity via a channel which extends along the surface of the substrate . It is further provided according to the invention that this channel is fixed relative to the substrate by a layer structure which comprises at least the first layer, which also forms the membrane-like area of the pressure sensor.
  • the invention requires that the ratio of the width of the channel to the thickness of the layer structure above the channel should be smaller than the ratio of the smallest extent of the membrane-like area in the membrane plane to the thickness of the membrane-like area.
  • the invention teaches a local separation of the actual pressure sensor function, for which the detection of the differential pressure by deflection of the membrane-like area and the electrical detection of the deflection of the membrane branch-like area as well as the mechanical functions of the overload resistance and the tension-free membrane holder are to be counted, from the function of supplying one of the two pressures to the pressure sensor cavity, which the channel structure designed according to the invention is achieved.
  • the functional separation created by the invention is in contrast to the prior art, since relative pressure sensors according to the prior art introduce voltages into the membrane area through the rear opening of the substrate below the membrane-like region, in the case of a capacitive one Detection of the membrane deflection has a dependency of the detection capacity on the hardly definable dimension of the front exit of the opening at the rear, and since the pressure sensor structure in this prior art pressure sensor structure limits the overload resistance of the pressure sensor.
  • the pressure sensor structure according to the invention enables all advantages of the absolute pressure sensor described at the outset to be achieved, including its increased measuring accuracy and its compatibility for CMOS circuits.
  • FIG. 2 shows cross-sectional representations of a pressure sensor and an associated reference element
  • Fig. 3a shows a first embodiment of the invention Cross-sectional pressure sensor
  • 3b shows a second embodiment of the pressure sensor according to the invention in a cross-sectional illustration
  • FIG. 4 shows a plan view of a field of pressure sensors according to the invention according to a third embodiment
  • FIG. 5 shows a cross-sectional illustration of a first embodiment of a pressure sensor unit with a housing and the first embodiment of the pressure sensor shown in FIG. 3a;
  • FIG. 6 shows a cross-sectional illustration of a second embodiment of a pressure sensor unit with housing and the second embodiment of a pressure sensor shown in FIG. 3b;
  • FIG. 8 shows a top view of a pressure measuring arrangement for detecting a pressure distribution with high spatial resolution.
  • a substrate 1 which in the preferred exemplary embodiment is a p-silicon substrate, is provided with a doping within a doping region 2 by means of photolithographic measures which are conventional per se and which are opposite to the conductivity type of the substrate.
  • an n + doping region 2 is accordingly generated, on the one hand to form a highly conductive electrode and on the other hand, this electrode, which is defined by the doping region 2, compared to the substrate 1 by a pn - Isolate transition.
  • an insulator layer 3 upset.
  • This spacer layer 4 is structured by means of photolithographic measures known per se for fixing the later pressure sensor cavity, this being arranged centrally above the doping region 2.
  • a further oxide layer 5 is then deposited and structured photolithographically to define later etching channels 6.
  • a polysilicon layer 7 is now deposited, which is conductively doped at least in the area of a later membrane-like region 8 above a pressure sensor cavity 9. By etching using hydrofluoric acid, the spacer layer 4, 5 consisting of oxide is removed through the etching channel 6, whereupon the etching channels 6 are closed by depositing a suitable material, such as an oxide layer.
  • a final oxide layer 9 in the area of the membrane-like region 8 can be removed by etching to form a pressure sensor, which is designated there in its entirety by reference number 10, while this oxide layer 9 remains unchanged for determining a reference element which corresponds to the basic capacitance and which is designated in its entirety by reference numeral 11.
  • a cross-sectional representation of a first embodiment of a pressure sensor according to the invention which is designated in its entirety by reference numeral 20, is explained below with reference to FIG. 3a.
  • This comprises a substrate 21 with a doping region 22, the doping again being selected in the opposite way to the conductivity type of the substrate 21.
  • a first polysilicon layer 25 which defines a pressure sensor cavity 24 and which is above the tion area 22 defines a membrane-like, thin region 26.
  • This membrane-like region 26 can be acted upon by a first pressure, which can also be referred to as external pressure.
  • a channel 27 adjoining the cavity 24 extends along the surface 28 of the substrate 21, which opens into a side opening 29 in the embodiment shown here.
  • the channel is defined relative to the substrate 21 by a layer structure which on the one hand comprises the first polysilicon layer 25 which comprises the membrane-like region 26 of the pressure sensor 20 and on the other hand has a reinforcing layer 30 deposited thereon.
  • the reinforcement layer 30 above the first polysilicon layer 25 can also consist of polysilicon. It is also conceivable to also form this reinforcement layer from silicon dioxide or silicon nitride.
  • the width bk of the channel 42 is preferably smaller than the diameter or the smallest lateral extension dm of the membrane-like one Area of each pressure sensor 41.
  • the ratio of the width bk of the channel 27, 42 to the thickness ds of the layer structure 25, 30 above the channel must be smaller than the ratio of the smallest extension dm of the membrane-like area 26, 41 in of the membrane plane to the thickness dg of the membrane-like region 26.
  • the additional reinforcement layer 30 can be dispensed with if the channels 27 are sufficiently narrow, although this is considered to be advantageous.
  • the second embodiment of a pressure sensor which is designated in its entirety by reference numeral 32 in FIG. 3b, corresponds, with the exception of the deviations described below, to the first embodiment of the pressure sensor 20 described with reference to FIG. 3a, where designate the same or similar parts with the same reference symbols.
  • the side opening 29 of the channel 27 is omitted here, the channel 27 on the side facing away from the pressure sensor cavity 24 through the first polysilicon layer 25 and the reinforcing layer 30 opposite the substrate 21 is closed.
  • the substrate 21 has a rear opening 33 created, for example, by anisotropic etching. The rear opening extends from the back of the substrate 34 through the substrate 21 to the front or surface 28 of the substrate 21 such that the front exit 35 of the rear opening 33 lies outside the membrane-like area 26 and only in the area of the Channel 27 comes to rest.
  • FIG. 5 shows a sectional illustration through a first embodiment of a pressure sensor unit, which is designated in its entirety by reference numeral 50 and comprises a housing 51 and the first embodiment of the pressure sensor 30 described with reference to FIG. 3a.
  • the housing 51 has two connecting pipes 52, 53 spaced apart from one another, through which the first and second pressures P1, P2 can be applied.
  • the pressure sensor 30 is fixed to the back of the silicon substrate 21 relative to the bottom 54 of the housing 51, for example by gluing.
  • the housing is divided by a partition 55 into two housing areas 56, 57 for the first and second pressure P1, P2.
  • the separation wall runs essentially vertically to the longitudinal direction of the channel 27 and seals with the pressure sensor 20 in the region of its reinforcing layer 30.
  • FIG. 6 shows a second embodiment of a pressure sensor unit, which is designated in its entirety by reference number 60.
  • This also has a housing 61 which has two connecting pipes 62, 63 for the application of the first and second pressures P1, P2.
  • the connecting pipes 62, 63 are preferably provided on opposite walls of the housing 61.
  • the second embodiment of the pressure sensor 32 as described with reference to FIG. 3b, is fixed with its rear opening 33 above the connecting pipe 63 with respect to the wall by an adhesive from which this connecting pipe 63 originates.
  • a pressure sensor unit formed on a wafer can be a pressure sensor field 40 which comprises a multiplicity of pressure sensors 41.
  • the individual electrodes will be connected in parallel in order to achieve increased sensitivity through this field-like arrangement.
  • the individual pressure sensors are connected to one another by channels, the shape of which largely resembles the channel 27 described in detail.
  • This pressure sensor arrangement 70 comprises three pressure sensor fields 71, 72, 73, the areas of the membrane-like areas of the pressure sensor field 71 being larger than those of the pressure sensor field 72, which in turn are larger than those of the pressure sensor field 73.
  • the last-mentioned pressure sensor field 73 thus serves the Er ⁇ a high pressure range, the second pressure Sensor field 72 of the detection of a medium pressure range, while the first-mentioned pressure sensor field 71 is provided for a low pressure range.
  • FIG. 8 shows a further top view of a pressure sensor arrangement, which is designated in its entirety with the reference symbol 80.
  • This pressure sensor arrangement comprises six pressure sensor fields 81, 82, 83, 84, 85, 86, which are arranged on a single chip and each comprise a plurality of preferably four pressure sensors 81a, 81b, 81c, 81d connected to one another via channels.
  • Each of the pressure sensor fields 81, 82, 83, 84, 85, 86 is connected to a channel 87, 88, 89, 90, 91, 92.
  • the channels are brought together in a narrow space at a pressure detection area 93 on the chip in order to enable the measurement of a pressure distribution P2, ..., P7 with a comparatively high spatial resolution.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Un capteur de pression comporte un substrat (21) et une couche (25) qui forme avec le substrat une cavité de détection de pression (24), la couche présentant une zone du type membrane (26) sur laquelle peut être appliquée une pression extérieure. Un capteur de pression microminiaturisable du type susmentionné pour la mesure de la pression différentielle ou de la pression relative est créé par le fait que la cavité est suivie d'un canal (27) qui s'étend le long de la surface du substrat, ce canal comportant une structure en couches qui inclut la couche définissant la zone-membrane du capteur de pression. Le rapport entre la largeur du canal et l'épaisseur de la structure en couches (25, 30) au-dessus du canal, est plus petit que le rapport entre la plus petite étendue de la zone-membrane dans le plan de la membrane et l'épaisseur de la zone-membrane.
EP93902038A 1993-01-19 1993-01-19 Capteur de pression Expired - Lifetime EP0681691B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE1993/000048 WO1994017383A1 (fr) 1993-01-19 1993-01-19 Capteur de pression

Publications (2)

Publication Number Publication Date
EP0681691A1 true EP0681691A1 (fr) 1995-11-15
EP0681691B1 EP0681691B1 (fr) 1996-07-31

Family

ID=6887837

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93902038A Expired - Lifetime EP0681691B1 (fr) 1993-01-19 1993-01-19 Capteur de pression

Country Status (5)

Country Link
US (1) US5583296A (fr)
EP (1) EP0681691B1 (fr)
JP (1) JP2652589B2 (fr)
DE (1) DE59303373D1 (fr)
WO (1) WO1994017383A1 (fr)

Families Citing this family (20)

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Publication number Priority date Publication date Assignee Title
US5969591A (en) * 1991-03-28 1999-10-19 The Foxboro Company Single-sided differential pressure sensor
DE19521832A1 (de) * 1995-06-16 1996-12-19 Bosch Gmbh Robert Druckmeßvorrichtung
CA2193015C (fr) * 1996-01-04 2001-04-03 Dominic Ricciardi Architecture de reseau pour l'acheminement de services a base d'ajouts
JPH09232595A (ja) * 1996-02-26 1997-09-05 Denso Corp 圧力検出装置
US5824910A (en) * 1997-04-16 1998-10-20 The United States Of America As Represented By The Secretary Of The Navy Miniature hydrostat fabricated using multiple microelectromechanical processes
DE19740244A1 (de) * 1997-09-12 1998-02-26 Klaus Prof Dr Ing Bethe Beschleunigungs-unempfindlicher, planarer Differenzdruck-Sensor in Mikrotechnik
DE19839606C1 (de) * 1998-08-31 2000-04-27 Siemens Ag Mikromechanisches Bauelement und Verfahren zu dessen Herstellung
US6225140B1 (en) * 1998-10-13 2001-05-01 Institute Of Microelectronics CMOS compatable surface machined pressure sensor and method of fabricating the same
ATE252225T1 (de) 1998-12-15 2003-11-15 Fraunhofer Ges Forschung Verfahren zum erzeugen eines mikro- elektromechanischen elements
US6181237B1 (en) 1999-08-17 2001-01-30 Lucent Technologies Inc. Method and apparatus for generating pressure based alerting signals
DE69936794T2 (de) 1999-08-20 2008-04-30 Hitachi, Ltd. Halbleiterdrucksensor und vorrichtung zur erfassung von drucken
US6275151B1 (en) 2000-01-11 2001-08-14 Lucent Technologies Inc. Cognitive intelligence carrying case
JP3432780B2 (ja) 2000-02-22 2003-08-04 株式会社日立製作所 半導体圧力センサ
US6595046B2 (en) 2000-03-10 2003-07-22 Gary Lemberger Temperature and pressure compensating indicator
US6528340B2 (en) 2001-01-03 2003-03-04 Honeywell International Inc. Pressure transducer with composite diaphragm
DE10122765A1 (de) * 2001-05-10 2002-12-05 Campus Micro Technologies Gmbh Elektroakustischer Wandler zur Erzeugung oder Erfassung von Ultraschall, Wandler-Array und Verfahren zur Herstellung der Wandler bzw. der Wandler-Arrays
DE102005029803A1 (de) 2005-06-27 2007-01-04 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mikromechanisches Bauelement
JP5110885B2 (ja) * 2007-01-19 2012-12-26 キヤノン株式会社 複数の導電性の領域を有する構造体
JP5444199B2 (ja) 2010-12-06 2014-03-19 日立オートモティブシステムズ株式会社 複合センサ
US10036676B1 (en) 2017-03-15 2018-07-31 Honeywell International Inc. Microelectromechanical systems (MEMS) force die with buried cavity vented to the edges

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US3930412A (en) * 1975-01-03 1976-01-06 Kulite Semiconductor Products, Inc. Electrically scanned pressure transducer configurations
JPS5817421B2 (ja) * 1979-02-02 1983-04-07 日産自動車株式会社 半導体圧力センサ
DE3319605A1 (de) * 1983-05-30 1984-12-06 Siemens AG, 1000 Berlin und 8000 München Sensor mit polykristallinen silicium-widerstaenden
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EP0339981A3 (fr) * 1988-04-29 1991-10-09 Schlumberger Industries, Inc. Capteur lamellé à semi-conducteur avec protection contre la surpression
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Title
See references of WO9417383A1 *

Also Published As

Publication number Publication date
WO1994017383A1 (fr) 1994-08-04
US5583296A (en) 1996-12-10
EP0681691B1 (fr) 1996-07-31
JP2652589B2 (ja) 1997-09-10
JPH08501156A (ja) 1996-02-06
DE59303373D1 (de) 1996-09-05

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