EP0570392A1 - Configuration de composants degageant de la chaleur dans un dispositif refroidi par un liquide - Google Patents

Configuration de composants degageant de la chaleur dans un dispositif refroidi par un liquide

Info

Publication number
EP0570392A1
EP0570392A1 EP19920902780 EP92902780A EP0570392A1 EP 0570392 A1 EP0570392 A1 EP 0570392A1 EP 19920902780 EP19920902780 EP 19920902780 EP 92902780 A EP92902780 A EP 92902780A EP 0570392 A1 EP0570392 A1 EP 0570392A1
Authority
EP
European Patent Office
Prior art keywords
components
arrangement
electrodes
plate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19920902780
Other languages
German (de)
English (en)
Inventor
Hans-Joachim Krokoszinski
Kurt Langer
Wilhelm Peter Walther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Patent GmbH
Original Assignee
ABB Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Patent GmbH filed Critical ABB Patent GmbH
Publication of EP0570392A1 publication Critical patent/EP0570392A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an arrangement of at least two heat-generating components, in particular power semiconductor components, the arrangement comprising means for heat dissipation using an electrically insulating cooling liquid, and means for realizing an electrical circuit.
  • DE-Al-39 10 470 describes several versions of a power semiconductor switch device.
  • a fifth embodiment is shown in FIGS. 23 and 24 and described in columns 14 and 15 of the publication, which contains liquid-cooled electrodes.
  • a plurality of semiconductor chips electrically connected in parallel by the electrodes are arranged between the electrodes.
  • the electrodes consist of a hollowed-out AIN plate, which is coated with a copper foil using the direct connection method.
  • the chips are soldered to the foil of the electrodes.
  • the electrodes are also through an insulating housing connected together.
  • the coolant guide requires external pipe or hose connections on the electrodes if these are to be supplied by a common cooling device. An arrangement for realizing other electrical circuits instead of a parallel connection is not specified.
  • Power semiconductor modules are installed on a heat sink with the interposition of a thermal paste between the module and the heat sink in order to improve the heat transfer from the bottom of the module to the heat sink surface by filling in small bumps. This measure is necessary in order to ensure heat dissipation from power semiconductor components with high heat flow densities.
  • the thermal paste means one in the layer sequence such an arrangement one of the largest individual heat resistors.
  • a second essential individual thermal resistance is caused by electrically insulating layers if it is a module with an electrically insulated structure, as described in DE-OS 36 04 882.
  • ceramic substrates are used whose thermal resistance at a substrate thickness of 0.63 mm is approximately as great as the thermal resistance of the thermal paste.
  • the heat generated by components is dissipated only through one side, namely via the base plate of the module.
  • the heat dissipation via electrical connections of the module is negligible. At high currents, wire bonds or soldered copper clips can even become so hot that they give off heat to the component.
  • the object of the invention is to provide an arrangement for cooling heat-generating components, in particular power semiconductor components, which avoids the disadvantages and restrictions of known arrangements.
  • an electrically insulating coolant and b) means for realizing electrical circuits or circuit parts while avoiding non-integrated electrical lines, c) electrically insulating parts of the arrangement consisting of ceramics which are connected to one another by metallic parts in a direct connection method, and d) such composite bodies as well as other components to be mechanically connected have a solderable surface and are connected to one another by soft soldering. and with the following further features: e) at least one of the components is arranged in a module and hermetically encapsulated, the
  • Connections and channels for guiding the cooling liquid - a single cooling circuit common to the entire arrangement, metallic electrodes and - an electrically insulating plate with metallized main surfaces arranged between the electrodes, a connecting channel and at least one cutout opening for Components, and f) several modules can be connected to each other to form a compact integrated arrangement with the interposition of an electrically insulating component and by connection with possibly further components by soft soldering, wherein electrical circuits or circuit parts that do not have a parallel connection can also be implemented of components.
  • the arrangements proposed by the invention have the advantage that the most important thermal resistances of known module arrangements, namely thermal pastes and ceramic substrates, are eliminated from the heat flow, and loss losses in the kilowatt range can also be dissipated with a very intensive liquid cooling.
  • the heat is removed from the component on two sides. Cables cannot feed any additional power loss into the components.
  • the construction proposed by the invention leads to a reduced volume and weight of the overall arrangement.
  • the arrangement can advantageously be produced with an automated production device, it being possible for all of the components to be soldered to be stacked together in a soldering process.
  • the electrically insulated routing of the coolant from a first electrode to a second electrode ensures that, despite the required electrical insulation between the electrodes, only one common coolant circuit is required.
  • One of the configurations relates to a stack arrangement of silicon wafers, compensating blanks and solder material, the stack arrangement either being pre-soldered into the overall arrangement or being soldered together with the other components.
  • a further embodiment relates to an electrically insulated insertion of modules in a coolant circuit of a more extensive arrangement using a coolant supply block and insulating plates.
  • the invention is explained in more detail below on the basis of exemplary embodiments illustrated in the drawing, further configuration options being described.
  • FIG. 1 power semiconductor module
  • FIG. 2 shows a detailed illustration of a component and an electrically insulating plate from the module shown in FIG. 1,
  • FIG. 3 power semiconductor module with coolant supply block
  • FIG. 4 power semiconductor module with two parallel diodes
  • FIG. 5 diode half bridge
  • FIG. 6 circuit diagram of a circuit part from a power supply device
  • FIG. 1 shows the construction principle of the arrangement according to the invention using a power semiconductor module 13 which is distinguished by a high power density.
  • the arrangement contains an electrically insulating plate 1 with a cutout opening (2) into which a heat-generating component 3 is inserted.
  • the plate 1 can be, for example, an aluminum oxide plate, the upper and lower main surfaces 4, 5 of which are metallized in order to achieve solderability.
  • the metallization of the plate 1 are For example, copper foils 6 (see FIG. 2) are suitable, which are connected to the ceramic plate 1 by a direct connection method.
  • the component 3 to be cooled can, for. B. be a power semiconductor device, or a resistance device.
  • the main surfaces 6, 7 of the component 3 are designed to be solderable.
  • the upper main surfaces 4, 6 of the plate 1 and the component 3 are connected with the aid of soft solder 8 to an upper electrode 9, for example a plus electrode, and accordingly the lower main surfaces 5, 7 of the plate 1 and the construction elements 3 with a lower electrode 10, for example a minus electrode.
  • the electrodes 9, 10 can preferably be made of copper and each have interconnected cavities 11 for guiding a cooling liquid 12. In principle, separate cooling circuits could be provided for each electrode. However, an arrangement of a single cooling circuit, which is guided in the module 13 shown, is preferred, from a coolant inlet 14 through the cavities 11 of the upper electrode 9 via a connecting channel 16, which leads through a bore in the plate 1, via the cavities ⁇ spaces 11 of the lower electrode 10 to a coolant outlet 15.
  • the plate 1 is intended on the one hand to establish a mechanical connection between the electrodes 9, 10 and on the other hand to ensure electrical insulation between the two electrodes 9, 10.
  • the thermal conductivity of the plate 1 is practically irrelevant since it is not switched on in the heat flow.
  • the heat flows from the component 3 via the solder material 8 to the electrodes 9 and 10, respectively.
  • Suitable cooling liquids 12 are, for example, water and oil and other liquids known from the prior art with electrically insulating properties which are relevant for heat dissipation.
  • the cutout opening 2 and bores for the connecting channel 16 in a ceramic plate 1 can e.g. by ultrasonic drilling and, in the case of printed circuit board material, by simple drilling or milling.
  • the cavities 11 in the electrodes 9, 10 can e.g. are designed as meandering cooling channels and, for example in the case of copper electrodes, are produced by milling or forging.
  • the electrodes 9, 10 can be composed of two parts, as shown in FIG. 1, the cooling channels being milled in one part and the parts being connected by soft soldering, hard soldering or electron beam welding.
  • FIG. 2 shows a detail from FIG. 1, namely a possible embodiment of the plate 1 and the component 3.
  • the plate 1 can be, for example, a directly bonded aluminum oxide plate 17 with a thickness of 630 ⁇ m with copper foils 18 on both sides with a thickness of 300 ⁇ m.
  • the component 3 can be, for example, a 360 ⁇ m thick power semiconductor diode 19, for example a Schottky diode with an upper, for example 500 ⁇ m thick and a lower, for example 250 ⁇ m thick, molybdenum tube 20.
  • the thickness of the plate 1 and the component 3 need not exactly match.
  • a thickness of the plate 1 of, for example, 1.23 mm and of the component 3 of, for example, 1.11 mm can be compensated for by a different solder layer thickness, which arises automatically when soldering.
  • aluminum oxide aluminum nitride can also be used for plate 1, for example, and instead of directly bonded copper foils also thick-film copper or chemically deposited copper.
  • the plate 1 can also be a conventional printed circuit board with laminated copper.
  • the materials used for the individual components must be chosen taking into account the expansion properties in order to achieve good load resistance to the module.
  • FIG. 3 shows a supplement to the module 13 shown in FIG. 1 by a liquid supply block 21 which contains a supply line 22 and a return line 23 for cooling liquid 12.
  • the block 21 is connected to the module 13 with the interposition of an insulating plate 24 for electrical insulation. From the supply and return lines 22, 23 lead-throughs 25, which extend through bores in the insulating plate 24, lead the cooling liquid 12 to the cavities 11 of the electrodes 9, 10.
  • the insulating plate 24 is advantageous as an aluminum oxide plate directly bonded with metal foils executed and is soldered to the module 13 or the block 21. Of course, conventional pipe or hose connections can also be used instead of the coolant supply block 21.
  • FIG. 4 shows an exemplary embodiment with two electrically connected diode chips as components 3.
  • FIG. 5 shows an embodiment Example, in which two modules 13 are interconnected with a coolant supply block 21 via an insulating plate 24 to form a diode shunt bridge 26 with a common cathode plate 27 and insulated anodes 28.
  • the block 21 is separated from the plate 27 by an insulating layer 37, which can also consist of an air gap.
  • a reverse arrangement with common anodes and separate cathodes looks identical.
  • the individual modules 13 each contain two diodes connected in parallel as components 3.
  • Such an arrangement, shown in FIG. 5, can be supplemented by further components, for example for realizing a compact power unit of a " power supply device.
  • FIG. 6 shows the circuit diagram of a circuit part from a power supply device.
  • Diodes D1 and D2 with their anodes A are connected to the secondary winding 29 of a transformer T, which also has a primary winding 30 and a core 21.
  • the cathodes K of the two diodes are connected to one another.
  • FIG. 7 shows a possible implementation of the formwork part shown in FIG. 6, starting from a diode half-bridge, similar to the arrangement shown in FIG. 5, but with a somewhat modified coolant guide and electrode design.
  • the secondary winding 29 is designed as a metal plate 32, for example made of copper, which has a central bore 33 and a pushing slot 34 between the bore 33 and a lower contact surface 35.
  • the metal plate 32 designed in this way forms the only turn of the secondary winding 29 , whose winding ends 36 are each soldered to an anode electrode 9 of the two modules 13.
  • the transformer core 31 is inserted through the bore 33 and contains the insulated primary winding 30, which consists of several turns wearing.
  • two diodes B1 and D2 connected in parallel are used as components 3.
  • the upper electrodes 9 can be simplified if the metal plate 32 is so thick that it can simultaneously perform the function of an upper electrode part, that is to say a covering of cooling liquid channels.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Une configuration compacte de refroidissement de composants (3) dégageant de la chaleur, notamment de composants semiconducteurs de puissance, agencés dans des modules (13), permet d'obtenir un transfert amélioré de la chaleur vers un circuit de liquide réfrigérant. A cet effet, les composants (3) sont agencés dans des ouvertures (2) découpées dans une plaque (1) électriquement isolée. Les composants (3) sont en contact par deux surfaces principales (6, 7) avec des électrodes (9, 10) refroidies par un liquide et les électrodes (9, 10) sont électriquement isolées l'une de l'autre par la plaque (1). L'invention concerne en outre un demi-pont (26) de diodes composé de modules (13).
EP19920902780 1991-02-06 1992-01-21 Configuration de composants degageant de la chaleur dans un dispositif refroidi par un liquide Withdrawn EP0570392A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914103486 DE4103486A1 (de) 1991-02-06 1991-02-06 Anordnung zur kuehlung waermeerzeugender bauelemente
DE4103486 1991-02-06

Publications (1)

Publication Number Publication Date
EP0570392A1 true EP0570392A1 (fr) 1993-11-24

Family

ID=6424441

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19920902780 Withdrawn EP0570392A1 (fr) 1991-02-06 1992-01-21 Configuration de composants degageant de la chaleur dans un dispositif refroidi par un liquide

Country Status (4)

Country Link
EP (1) EP0570392A1 (fr)
JP (1) JPH06507044A (fr)
DE (1) DE4103486A1 (fr)
WO (1) WO1992014264A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
DE4421319A1 (de) 1994-06-17 1995-12-21 Abb Management Ag Niederinduktives Leistungshalbleitermodul
DE10125695A1 (de) * 2001-05-25 2002-12-05 Eupec Gmbh & Co Kg Leistungshalbleiteranordnung
JP4120581B2 (ja) * 2003-12-24 2008-07-16 株式会社豊田中央研究所 パワーモジュール
WO2016165843A1 (fr) 2015-04-13 2016-10-20 Abb Technology Ag Module électronique de puissance

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495067A (en) * 1965-09-01 1970-02-10 David Sciaky Resistance welding machine
FR2003573A1 (fr) * 1968-03-09 1969-11-07 Mitsubishi Electric Corp
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
JPS6060172U (ja) * 1983-09-13 1985-04-26 本田技研工業株式会社 整流器付トランス装置
US5006921A (en) * 1988-03-31 1991-04-09 Kabushiki Kaisha Toshiba Power semiconductor switching apparatus with heat sinks
US4989070A (en) * 1988-11-10 1991-01-29 Coriolis Corporation Modular heat sink structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9214264A1 *

Also Published As

Publication number Publication date
DE4103486A1 (de) 1992-08-20
JPH06507044A (ja) 1994-08-04
WO1992014264A1 (fr) 1992-08-20

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