EP0563992B1 - Méthode et appareil pour la fabrication d'éléments métalliques surfaces sur substrats - Google Patents

Méthode et appareil pour la fabrication d'éléments métalliques surfaces sur substrats Download PDF

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Publication number
EP0563992B1
EP0563992B1 EP93105519A EP93105519A EP0563992B1 EP 0563992 B1 EP0563992 B1 EP 0563992B1 EP 93105519 A EP93105519 A EP 93105519A EP 93105519 A EP93105519 A EP 93105519A EP 0563992 B1 EP0563992 B1 EP 0563992B1
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EP
European Patent Office
Prior art keywords
metal layer
intermediate carrier
substrate
layer
lacquer
Prior art date
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Expired - Lifetime
Application number
EP93105519A
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German (de)
English (en)
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EP0563992A2 (fr
EP0563992A3 (en
Inventor
Wittich Dr. Kaule
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GAO Gesellschaft fuer Automation und Organisation mbH
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GAO Gesellschaft fuer Automation und Organisation mbH
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]

Definitions

  • the invention relates to a method and a device for the production of locally limited metal layers Substrates with a possibly rough surface in the transfer process, where the metal layers on one Prepared transfer area and then on the substrate be transmitted.
  • Metallic surface elements come in the area of anti-counterfeiting of value documents a substantial Meaning too.
  • metallic surfaces offer good reflection protection due to its reflective properties, because the reflective surfaces with copy technology Means cannot be adjusted. in the The simplest case is usually metal printing inks used to make shiny metallic surface or printed images to create. Because of the grainy fine structure these methods can only be used for metallic surfaces, where only minimal requirements are placed on the Reflection behavior of the surface and where no defined surface structures are required will.
  • Holograms can be due the complex and costly manufacture, if imitated at all, only with relatively great effort and because of their optical properties, which depend on the viewing angle, good copy protection. Apart from the security aspects Holograms also like from an aesthetic point of view applied to documents of value.
  • Reflection holograms are usually either using specially prepared embossing matrices that match the Interference pattern of the hologram corresponding surface relief have produced by the surface relief embossed in a hardened lacquer layer and then metallized and with a protective lacquer layer is provided.
  • the relief of the embossing die can be used also directly into a thin metal layer embossed and then with the protective lacquer layer be provided. The metallization ensures sufficient Brilliance of the hologram, making it visually good is recognizable.
  • Hot stamping tape from which it is transferred to the end carrier is (DE-OS 33 08 831, US-PS 4,758,296).
  • a substrate with an easily removable Separating layer is provided, those to be transferred Layers in reverse order as later on the document should be available.
  • the top one Layer forms an adhesive layer, for example one Heat seal adhesive layer. Be over this adhesive layer the hot stamping tape and the document under the influence of Heat and pressure combined. The substrate of the Hot stamping tape can then due to the separation layer be pulled off effortlessly.
  • the transfer belt is made as a continuous belt will, d. H. the metallization in a continuous Process takes place (e.g. in a vacuum evaporation plant), only the desired areas transferred to the document.
  • the transfer of to transferring surface areas can be different Species are accomplished.
  • the adhesive layer is printed in a specific pattern be so that the layer structure to be transferred (if necessary with large-scale heating) only in places attached to the document or the one used in lamination Stamp has an outline shape that the conforming form, so that even when used of large-area heat seal adhesive only the areas of the adhesive layer are activated, to which the die applies pressure and heat (DE-OS 33 08 831).
  • EP-OS 0 338 378 describes continuous process in which banknote paper in Roll form first printed on both sides and then in certain areas with a holographic structure is provided.
  • the varnish to be embossed and transfer the relief structure to the paper at the same time, by the surface structure of the die is covered with a radiation-curable lacquer.
  • the paint is cured with UV radiation or electron beam.
  • the paint now adheres to the paper surface and has the holographic relief structure.
  • this relief structure with the help of masks in metallized in a vacuum evaporation system.
  • the hologram area is in a further step with a protective layer.
  • thermoplastic Layer using a heated embossing die from one Transfer hot stamping foil to the document, at the same time the optical markings in the thermoplastic Layer are embossed.
  • the carrier substrate is only peeled off after embossing and the relief structure then metallized.
  • U.S. Patent 4,420,515 discloses a Process in which an already metallized paint surface is provided with a relief structure. An endless circulating transfer belt is continuously metallized and brought into contact with a document that selectively coats a varnish has been. The paint is hardened and binds the metal stronger than that Transfer ribbon and thus pulls the when separating transfer ribbon and document Metallization partially from this transfer belt. The final step is emboss the metallized lacquer area on the substrate.
  • the embossed lacquer layer As the embossed lacquer layer is embossed, the embossed relief shows a low contour sharpness. The quality of the hologram is also impaired this procedure. Furthermore, the embossing must be carried out with high pressure so that the embossing dies are subject to high wear are.
  • EP-OS 0 145 481 describes a method in which an embossing stamp vacuum-coated directly with a metal layer, the metallized stamp covered with liquid adhesive and pressed against a substrate, and the Adhesive layer is then cured.
  • the invention is therefore based on the object of a method and a device for the application of metal layers which may be locally limited To create substrates while avoiding the disadvantages mentioned above.
  • a method and a device for flexible hologram production is said to be based on difficult substrates and under difficult conditions will.
  • the invention is based on the basic idea that the manufacture and the Transfer of a surface structure is only possible in optimal form, if the structures to be transferred are as pure as possible from the master structure are taken over and neither the transfer to the final substrate transferring structure still changed or damaged the structure of the master becomes.
  • the creation takes place in this sense not by embossing the structure to be transferred an existing flat metal layer, but through "Depositing" the metal layer on the master structure, the metal layer resembling a cast all Fills in structural elements of the master structure and detected.
  • Master and metal layer thus have negative and Positive structures that complement each other completely and that are intimately connected.
  • About changes or damage during transfer or at To avoid detachment of the metal layer from the master the two structures were only separated, after which the metal layer is fixed on the final substrate and mechanically stabilized by the substrate and adhesive layer is.
  • structure can be seen in general d. H. as a structure can be both extremely smooth reflecting surface as well as any relief structure Find use. It is important according to the invention that the selected or given structure if possible unadulterated as a positive or negative structure implemented and just as genuine on the substrate is transmitted.
  • lacquer layer is intended to cover all materials and Capture substances that in the transfer of the metal layer in To make it so soft and sticky that the metal layer with its back without damage is impressive in the layer, whereby the Metal layer on the one hand intimately connects with the lacquer layer and any bumps between the substrate surface and back metal surface and on the other hand the metal layer adheres so firmly that, if necessary after an additional curing phase, the Metal layer are completely removed from the master can.
  • a cylindrical Printing roller, an endless belt or a stamp etc. are used as a carrier of the master structure z. B.
  • a cylindrical Printing roller, an endless belt or a stamp etc. are used as a carrier of the master structure z. B.
  • the production of the metal layer takes place with the help of known metallization processes, such as Vacuum evaporation, electrolysis or photolysis as well other special processes that are used in technology under Special terms such as “Gas Jet Deposition (GJD)", “Spray Deposition”, “Laser deposition” etc. are known.
  • GJD Garnier Deposition
  • the Hardening the paint layer is different possible. This can happen when using a liquid hot melt adhesive for example, simply by cooling Multi-component paints by heating and depending on the use other substances also through other energy supply, e.g. B. by UV radiation, microwave radiation, Electron beam hardening etc.
  • the method according to the invention is particularly suitable for the transfer of locally limited metal layers, because both the metallization and the transfer process can be precisely defined and structured locally.
  • Photolytic ones are particularly advantageous for metallization Process, e.g. B. as in DE-OS 38 40 199 or DE-OS 38 40 200 described, which offer the possibility the metallic surface elements in their outline shapes particularly easy to modify, so that on this Way, in a particularly economical form series of different Surface elements or surface elements can be produced with varied additional information content are.
  • the embossing roller according to the invention metallic coated. This results in another one inventive aspect. Because with the invention The process makes it possible for the first time to produce holograms or embossing, metallization of the embossed hologram and Transfer of the metallized hologram in a continuous Workflow.
  • Fig. 1 shows in schematic form the basic principle of Invention.
  • the master 1 has one any kind of surface structure 3, in the illustrated Case a surface relief, on this relief 3 a metal layer 2 is applied such that the Structure 3 in the metal layer 2 as an exact negative structure is present.
  • the metal layer 2 is preferred locally limited or has a defined outline contour on.
  • a substrate 4 is prepared in a second work station, that can be almost any medium. in the The present case is a security with glued, natural rough surface.
  • a paint coater is another work station provided with either on the metal layer 2 or a locally limited one on the substrate 4 Lacquer layer can be applied.
  • the local limit the lacquer layer preferably corresponds to that of Metal layer 2.
  • both contours deviate from one another, taking note is that the metal layer only in the areas of Master is defined in which they are subtracted with the Paint layer is in cover.
  • the lacquer layer 6 harden at least to the extent that sufficient Adhesion to metal layer 2 and substrate 4 and a Intrinsic strength is ensured, which is a deduction from Master while stabilizing the metal layer 2 enables.
  • curing can take place by the lacquer layer 6 a heated Hot melt adhesive is made by cooling Master 1 and Metal layer 2 relatively quickly after merging stiffens.
  • Substances can also be used in the same way under the influence of IR or UV rays, Harden microwaves, electron beams etc.
  • the pressing in without additional measures and gluing the layers as well as peeling off and stabilizing the metal layer allows that final curing, if desired, also to one happen at any later time.
  • FIG. 1 For reasons of clarity, in FIG. 1 and the other figures on a scale and detail Not shown. Rather, the figures show basic arrangements that carry out allow the inventive method. In the figures functionally identical elements with the same reference numbers Mistake.
  • a cylindrical pressure roller with a smoother Partially metalized surface electrolytically and with an adhesive coated substrate in Brought in contact.
  • the web-shaped substrate 4, in the present case paper, is conveyed by a transport system shown in Fig. 2 is indicated by the rollers 10. Before the web material 4 of the printing roller 11 is fed, passes through there is a paint coating station 5.
  • the web 4 is here with the help of an engraving or stencil cylinder 12 in certain areas with a transparent adhesive coated.
  • the substrate 4 passes through the transfer zone, that of the cylindrical transfer roller 11 and one cylindrical counter-pressure roller 13 is also formed.
  • Metallized transfer roller 11 can additionally harden the adhesive, e.g. B. by polymerization with Electron beams or UV radiation take place.
  • the metal coating is conveyed further 2 deducted from the intermediate carrier 11.
  • a further processing station 14 can the metallized Area 2 but also, if necessary, the entire or larger areas of the material web 4 with be provided with a transparent protective lacquer layer.
  • the one provided with metallic surface elements 2 Material web 4 can finally further printing stations 15 are supplied to them with alphanumeric characters or to print patterns, which may also be parts the metal coating 2 can cover.
  • Suitable substances are, for example Fluorescent substances, magnetic or pearlescent pigments.
  • FIG. 3 shows the layer structure of the metallized substrate 4 after passing through the protective lacquer coating station 14. Directly on the substrate 4 is the in Station 5 arranged locally applied adhesive layer 6. Because this layer 6 is transparent and very thin and therefore the visual impression of the end product not impaired, their areal expansion does not have to correspond exactly to the dimensions of the metallization 2.
  • the expansion of the adhesive layer 6 not be smaller than the intended metallization 2, because this results in incomplete metal transfer would have.
  • To the metallization 2 from abrasion and destruction to protect it is also made of a transparent Protective lacquer layer 16 covered.
  • the intermediate carrier here the cylindrical roller 11, with those to be transferred metallic surface elements 2 provided.
  • the transfer roller 11 is on electrolytic Metallized away.
  • the parts of the cylinder, that should not be metallized are used in the Station 19 coated with electrically insulating material, e.g. B. with a layer of paint.
  • electrically insulating material e.g. B. with a layer of paint.
  • the pressure roller 11 seen next station the roller 11 passes through a galvanic bath 17.
  • the in metal loosened in the bathroom is Transfer cylinder 11 and the voltage applied to the bath the electrically conductive surface areas of the roller 11 so that a metallic pattern on the roller surface arises.
  • chemical residues are removed.
  • the metal coating 2 is now transferred to the substrate 4.
  • the Paint coating station 19 finally becomes roller 11 prepared for the next metallization cycle.
  • Fig. 4 shows a metallization station in which the cylindrical transfer roller on photolytic Paths partially metallized and coated with an adhesive Substrate is brought into contact.
  • the Vorund Aftertreatment of the substrate 4 and the transfer of metallic areas is analogous to the example 1. For this reason, an illustration has been given in FIG the corresponding additional processing stations waived.
  • Photolysis is a modern metallization process that has been successful for several years in the metallic coating of semiconductor components (DE-OS 38 40 199) or in the manufacture of metal fleece to shield electrical fields (DE-OS 38 40 200) was used.
  • the intermediate carrier 11 wetted with a palladium acetate film.
  • a solvent such as B. chloroform
  • spray or spin applied. 4 shows representative of a diving station 21. The solvent evaporates immediately and leaves a thin film of palladium acetate, whose thickness over the concentration of Solution and the application process can be set can.
  • station 22 the ones to be metallized Areas of the printing roller exposed to UV radiation by selective photo splitting at the exposed areas to make a thin layer of palladium. This only a few nm thick palladium layer then serves as Activator for the subsequent chemical metallization, at which micrometer thick copper, nickel and gold layers can be applied.
  • 4 is a Metallization bath 23 shown, in which the intermediate carrier roller 11 dips. In another variant can the metallization also by means of a suitable Printing process, e.g. B. in screen printing, on the intermediate carrier 11 can be printed directly.
  • the finished substrate has the in this example same layer structure as in Example 1, based on 3.
  • a printing roller with a smooth surface for example also a cylindrical high-pressure roller (letterpress) can be used as shown in Fig. 5. in the shown example, this roller is also after metallized photolytic process.
  • this roller is also after metallized photolytic process.
  • the process steps for metallizing the high pressure roller 26 are analogous to example 2.
  • the sublime Areas 27 of the pressure roller 26 are made with palladium acetate 21 wetted and according to the transfer Information irradiated over a large area with UV light 22. This in metal dissolved in the plating bath 23 opens up the activated areas while the unexposed areas Areas cleaned in the cleaning station 24 will.
  • Printing areas 27 is previously on the substrate applied adhesive hardened and thus binds the Metal layer 2 to the substrate 4. Before the metallization cycle starts again, the print areas 27 completely cleaned in station 25.
  • FIG. 6 which is shown in Fig. 6, serves an endless belt 28 with a smooth surface as an intermediate carrier, which is partially electrolytic metallized and with the adhesive-coated substrate 4 is brought into contact.
  • the substrate is here only with a Component 29 of the metal coating 2 from the intermediate carrier 28 peeling lacquers locally coated. Subsequently the substrate 4 becomes analogous to the previous ones Examples transported through the transfer zone and possibly aftertreated in accordance with Example 1.
  • the metallization station consists of an endless belt 28 running over the rollers 30, 31, that is electrolytically metallized.
  • the endless belt 28 is prepared in the stations 20 and 19 and then locally in the galvanic bath 17 metallized.
  • metallization 2 becomes the second Component 32 of the releasing lacquer, e.g. B. an adhesion promoter for the metal layer to be transferred and / or a hardener for the first component.
  • the two components in the transfer zone causes the diffusion of the hardener together with energy supply, to match the substances used in each case is an accelerated curing and a very good binding of the transferred metal layer to the substrate.
  • This two-component adhesive can of course also be used all other examples described are used.
  • FIG. 7 shows another variant of a metallization station.
  • the pretreatment or post-treatment of the substrate 4 take place analogously to example 1.
  • FIG. 7 shows therefore only for the metallization of the endless belt 28 necessary devices and the the transfer zone forming rollers 13 and 30.
  • the partial metallization of the intermediate carrier 28 happens here analogously to Example 2 after the photolytic Method.
  • the endless belt 28 is with the Palladium acetate film 21 wetted by UV radiation 22 in places for the metal deposition in the metallization bath 23 is activated. Stations 24 and 25 ensure that the belt is cleaned as already described 28
  • the representation in FIG. 8 is also limited to the metallization station and the transfer zone.
  • the endless belt 28 serving as an intermediate carrier becomes partially through a vacuum coating over masks metallized.
  • the tape 28 is in before each metallization cycle Station 33 cleaned of any metal residues. Conditioning the areas to be coated are in the vacuum chamber 34 itself, if necessary, with the help of masks 35. As a vacuum coating process can do both vacuum evaporation and cathode ray sputtering (Sputtering) used will. The transfer of the metallic areas proceeds as already explained, by curing or cooling the Adhesive in the contact zone of substrate 4 and endless belt 28 between the rollers 13 and 30.
  • the intermediate carrier is used as an embossing mold trained, d. H. he carries on his surface the diffractive relief structure, which according to the state of the Technology is embossed into the paint on the substrate.
  • the paint can also be applied the metallized areas of the intermediate carrier applied and simultaneously with the metal layer on the Substrate are transferred.
  • the inventive metallization of the insensitive Embossing instead of the sensitive substrate allows it chemical metallization with aggressive chemicals perform.
  • the following examples show metallization stations described as such Have embossed intermediate carrier.
  • a cylindrical pressure roller with a relief-like surface structure becomes partial or full electrolytic metallized and coated with an adhesive Contacted substrate.
  • the device shown in Fig. 2 can in principle be taken over. Only the cylindrical pressure roller 11 must have a relief surface corresponding to the hologram exhibit.
  • the substrate 4, e.g. B. a paper web is preferred with an engraving or template cylinder 12 placed, locally coated with a varnish 5 on the places where the hologram should be embossed. Subsequently, the substrate 4 in the embossing and Metal transfer zone between the pressure roller 13 and the metallized die 36 transported.
  • the cylindrical Embossing mold 36 has the hologram embossing structure placed in register with respect to the locally coated Surfaces of the substrate 4.
  • the surface relief of the embossing die 36 is after the Electrolytic processes already described in Example 1 fully or partially metallized.
  • the Metallization can also be carried out over the entire area because the register-accurate transfer by the coated Places on the substrate 4 is determined. A sharper one Contouring of the metal surfaces 2 is however by partial Metallization of the embossing mold 36 is achieved.
  • the relief structure becomes detachable and metallized transferred true to the original into the paint.
  • the paint is cured e.g. B. by cooling, UV radiation or polymerization with electron beams.
  • the hardened lacquer layer is drawn the metallization from the die 36.
  • Example 2 and FIG. 4 becomes the cylindrical pressure roller with a smooth surface 11 by a likewise cylindrical Embossing die 36 replaced and photolytically metallized.
  • the metallization devices described in Examples 4-6 which is an endless belt as an intermediate carrier can be used in the combined hologram embossing or metallization used according to the invention will.
  • the endless belt 28 carries in these cases the hologram relief structure.
  • Fig. 9 shows a section of the on photolytic Path metallized embossing tape 37 (Fig. 7) before using it is brought into contact with the substrate 4.
  • the endless belt 37 has a relief structure 38.
  • Above the relief structure 38 there is a thin palladium layer 39, by photolytically decomposing the palladium acetate film arose. The unexposed areas of this Films were removed in station 24.
  • the photolytic metallization of the embossing mold offers how already explained the possibility of finely structured to produce metallic surfaces. This fact is too especially when designing holograms in combination with other features of great advantage. So it can Hologram, for example with a line or guilloche frame be provided or rasterized so that a background print remains visible. It would also be conceivable Cutouts in the form of characters or patterns to be provided in the metallization. Because of the variable Exposure options of the palladium acetate film could also a sequential numbering in the form of metallic Numerals can be provided on the hologram.
  • Another basic variant is based on the Waive substrate.
  • the paint cured directly on the metallic intermediate carrier and with the metal layer as a self-supporting film deducted.

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  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Finance (AREA)
  • Holo Graphy (AREA)
  • Credit Cards Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)

Claims (23)

  1. Procédé de fabrication sur un substrat (4) d'une couche métallique (2) présentant une structure de surface (3, 38) définie, dans lequel la couche métallique (2) est préparée sous forme détachable sur un support intermédiaire (11, 26, 28, 36, 37) et est ensuite transférée sur le substrat (4), caractérisé par les étapes suivantes consistant :
    a) à équiper le support intermédiaire (11, 26, 28, 36, 37) d'une structure de bande-mère (3, 38), le support intermédiaire (11, 26, 28, 36, 37) étant un milieu circulant en continu ;
    b) à appliquer la couche métallique (2) sur la structure de bande mère (3, 38) du support intermédiaire (11, 26, 28, 36, 37) ;
    c) à revêtir le substrat (4) ou la couche métallique (2) d'une couche de laque (6) ;
    d) à réunir de façon contiguë la couche métallique (2), la couche de laque (6) et le substrat (4) à un stade, par lequel la couche de laque apparaít sous une forme suffisamment molle et collante ;
    e) à durcir ou laisser durcir la couche de laque (6) ;
    f) à séparer la couche métallique (2) se trouvant en contact avec la couche de laque (6) du support intermédiaire (11, 26, 28, 36, 37) et du substrat (4) en la retirant simultanément du support intermédiaire (11, 26, 28, 36, 37).
  2. Procédé de fabrication sur un substrat d'une couche métallique présentant une structure de surface définie, dans lequel la couche métallique est préparée sous forme détachable sur un support intermédiaire et est ensuite transférée sur le substrat, caractérisé par les étapes suivantes consistant :
    a) à équiper le support intermédiaire d'une structure de bande-mère ;
    b) à appliquer la couche métallique sur la structure de bande mère du support intermédiaire ;
    c) à revêtir la couche métallique d'une couche de laque ;
    d) à durcir ou laisser durcir la couche de laque ;
    e) à séparer la couche métallique se trouvant en contact avec la couche de laque du support intermédiaire et de la couche de laque en la retirant simultanément du support intermédiaire, la couche de laque durcie constituant le substrat sous la forme d'un feuil autoportant.
  3. Procédé selon la revendication 1, caractérisé en ce que, avait l'étape c, le substrat (4) est glacé ou lissé, dans la zone à revêtir.
  4. Procédé selon la revendication 1 ou 2, caractérisé en ce que le support intermédiaire (11, 26, 38) est muni d'une surface extrêmement lisse.
  5. Procédé selon la revendication 1 ou 2, caractérisé en ce que le support intermédiaire (36, 37) est muni d'un relief de surface (39) sous la forme d'une structure de diffraction, en particulier d'un hologramme.
  6. Procédé selon au moins l'une des revendications 1 à 5, caractérisé en ce que la couche métallique (2) est réalisée par photolyse, électrolyse, dépôt par jet de gaz, dépôt par pulvérisation ou dépôt au laser.
  7. Procédé selon au moins l'une des revendications 1 à 6, caractérisé en ce que le durcissement de la couche de laque (6) est réalisé par un changement de température, par un rayonnement ultraviolet (UV), micro-ondes ou électronique.
  8. Procédé selon au moins l'une des revendications 1 à 7, caractérisé en ce que le substrat (4) est soumis à un traitement ultérieur après l'application de la couche métallique (2).
  9. Procédé selon la revendication 8, caractérisé en ce que le substrat (4) est muni dans la zone de la couche métallique (2) d'une laque de protection.
  10. Procédé selon la revendication 8 ou 9, caractérisé en ce que le substrat (4) est muni d'une impression ou d'un gaufrage à froid, le cas échéant également dans la zone de la couche métallique (2).
  11. Procédé selon au moins l'une des revendications 1 à 10, caractérisé en ce que la structure de bande-mère (3, 38) est réalisée sur un rouleau de pressage cylindrique, sur un cylindre d'impression à gravure en relief ou sur une bande sans fin.
  12. Procédé selon au moins l'une des revendications 1 à 11, caractérisé en ce que la couche métallique (2) est réalisée sous forme localement délimitée sur le support intermédiaire (11, 26, 28, 36, 37).
  13. Dispositif pour fabriquer sur un substrat une couche métallique présentant une structure de surface définie, dans lequel la couche métallique est préparée sur un support intermédiaire et est ensuite transférée sur le substrat, caractérisé en ce que le dispositif comporte les organes suivants :
    a) un support intermédiaire muni d'une structure de bande-mère et circulant en continu, sur lequel la couche métallique est réalisée sous forme détachable ;
    b) un organe se composant d'au moins un poste pour appliquer la couche métallique sur le support intermédiaire muni de la structure de bande-mère ;
    c) un poste pour revêtir de laque le support intermédiaire ;
    d) un organe pour durcir ou laisser durcir la couche de laque ;
    e) un organe pour séparer la couche de laque durcie et le support intermédiaire, dans lequel la couche métallique qui se trouve en contact avec la couche de laque, est séparée du support intermédiaire et la couche de laque durcie constitue le substrat sous la forme d'un feuil autoportant.
  14. Dispositif pour fabriquer sur un substrat (4) une couche métallique (2) présentant une structure de surface (3, 38) définie, dans lequel la couche métallique (2) est préparée sur un support intermédiaire (11, 26, 28, 36, 37) et est ensuite transférée sur le substrat (4), caractérisé en ce qu'il comporte les organes suivants :
    a) un support intermédiaire (11, 26, 28, 36, 37) muni d'une structure de bande-mère (3, 38) et circulant en continu, sur lequel la couche métallique (2) est réalisée sous forme détachable ;
    b) un organe (17, 18, 19, 20, 21, 22, 23, 24, 25) pour appliquer la couche métallique (2) sur le support intermédiaire (11, 26, 28, 36, 37) muni de la structure de bande-mère (3, 38) ;
    c) un poste (5, 12) pour revêtir de laque le substrat et/ou la couche métallique ;
    d) un poste (11, 13, 30, 31) pour provisoirement réunir de façon contiguë le support intermédiaire (11, 26, 28, 36, 37) et le substrat (4) ;
    e) un organe pour durcir complètement la couche de laque (6) à l'emplacement où la couche métallique (2) sur le support est amenée en contact intime, via la couche de laque (6) encore molle et collante, avec le substrat (4).
  15. Dispositif selon la revendication 13 ou 14, caractérisé en ce que le support intermédiaire (36, 37) comporte un relief de surface sous la forme d'une structure de diffraction, en particulier d'un hologramme.
  16. Dispositif selon la revendication 13 ou 14, caractérisé en ce que le support intermédiaire (11, 26, 28) comporte une surface extrêmement lisse.
  17. Dispositif selon au moins l'une des revendication 13 à 16, caractérisé en ce que le support intermédiaire est un rouleau de pressage cylindrique (11, 36), une bande sans fin (28) ou un cylindre d'impression à gravure en relief (26).
  18. Dispositif selon au moins l'une des revendication 13 à 17, caractérisé en ce que l'organe b) pour appliquer la couche métallique (2) sur le support intermédiaire (11, 26, 28, 36, 37) comporte les moyens suivants :
    f) un poste de revêtement (19), pour munir les zones qui ne doivent pas être revêtues du support intermédiaire (11, 26, 28, 36, 37) d'un matériau électriquement isolant ;
    g) un bain électrolytique (17) pour réaliser le revêtement métallique sur les zones électriquement conductrices du support intermédiaire (11, 26, 28, 36, 37).
  19. Dispositif selon la revendication 18, caractérisé en ce que, avant le poste f), et éventuellement après le poste g), sont prévus des organes de nettoyage (18, 20).
  20. Dispositif selon au moins l'une des revendication 13 à 17, caractérisé en ce que l'organe b) pour appliquer la couche métallique (2) sur le support intermédiaire (11, 26, 28, 36, 37) comporte les moyens suivants :
    f) poste d'imprégnation (21) pour imprégner le support intermédiaire (11, 26, 28, 36, 37) d'un film d'acétate de palladium ;
    g) poste (22) d'illumination aux ultraviolets (UV) pour, le cas échéant, activer localement l'acétate de palladium ;
    h) poste de métallisation (23) pour métalliser les zones illuminées de l'acétate de palladium.
  21. Dispositif selon la revendication 20, caractérisé en ce que, avant le poste f), et éventuellement après le poste h), est prévu un organe de nettoyage (24, 25).
  22. Application du dispositif selon au moins l'une des revendications 13 à 21 pour la fabrication d'un support de données, de préférence à partir de papier de sécurité.
  23. Application du dispositif selon au moins l'une des revendications 1 à 12 pour la fabrication d'un support de données, de préférence à partir de papier de sécurité.
EP93105519A 1992-04-03 1993-04-02 Méthode et appareil pour la fabrication d'éléments métalliques surfaces sur substrats Expired - Lifetime EP0563992B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4211235 1992-04-03
DE4211235A DE4211235C2 (de) 1992-04-03 1992-04-03 Verfahren und Vorrichtung zur Herstellung metallischer Flächenelemente auf Substraten und deren Verwendung

Publications (3)

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EP0563992A2 EP0563992A2 (fr) 1993-10-06
EP0563992A3 EP0563992A3 (en) 1995-01-18
EP0563992B1 true EP0563992B1 (fr) 1998-07-15

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US (1) US5807456A (fr)
EP (1) EP0563992B1 (fr)
JP (1) JP3049646B2 (fr)
AT (1) ATE168327T1 (fr)
DE (2) DE4211235C2 (fr)

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Also Published As

Publication number Publication date
DE4211235C2 (de) 2003-04-17
DE4211235A1 (de) 1993-12-02
DE59308760D1 (de) 1998-08-20
EP0563992A2 (fr) 1993-10-06
ATE168327T1 (de) 1998-08-15
JPH0679987A (ja) 1994-03-22
EP0563992A3 (en) 1995-01-18
JP3049646B2 (ja) 2000-06-05
US5807456A (en) 1998-09-15

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