EP3150400A1 - Procede destine a la fabrication d'un element de securite - Google Patents

Procede destine a la fabrication d'un element de securite Download PDF

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Publication number
EP3150400A1
EP3150400A1 EP15188216.4A EP15188216A EP3150400A1 EP 3150400 A1 EP3150400 A1 EP 3150400A1 EP 15188216 A EP15188216 A EP 15188216A EP 3150400 A1 EP3150400 A1 EP 3150400A1
Authority
EP
European Patent Office
Prior art keywords
lacquer layer
embossed
carrier
layer
elevations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15188216.4A
Other languages
German (de)
English (en)
Inventor
Sonja Landertshamer
Stephan Trassl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hueck Folien GmbH
Original Assignee
Hueck Folien GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hueck Folien GmbH filed Critical Hueck Folien GmbH
Priority to EP15188216.4A priority Critical patent/EP3150400A1/fr
Priority to US15/765,366 priority patent/US10618339B2/en
Priority to PCT/EP2016/073582 priority patent/WO2017055634A1/fr
Priority to JP2018517259A priority patent/JP7025323B2/ja
Priority to EP16787740.6A priority patent/EP3356158B1/fr
Publication of EP3150400A1 publication Critical patent/EP3150400A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers

Definitions

  • the invention relates to a method for producing a security element having a metallized optical diffraction structure in an embossed lacquer layer in which a lacquer layer is applied, embossed and cured on a support, structural embossings, structure elevations and an optical diffraction structure being produced by embossing the lacquer layer, hereinafter a reflection layer is provided on the structure depressions and structure elevations of the embossed lacquer layer by metallization, and subsequently this reflection layer is selectively demetallised.
  • the invention is therefore based on the object to provide a method for producing a security element with a metallized optical diffraction structure of the type described input, which is simple and flexible applicable and reproducibly generates an accurate security element.
  • the optical diffraction structure is impressed on at least one structure elevation and that the selective demetallization comprises connecting at least the structure elevation having the metallized and the optical diffraction structure to a transfer carrier and subsequently separating this structure elevation connected to a transfer carrier from the carrier as well as at least one adjacent to this structure survey metallized structure recess by removing the transfer carrier from the carrier.
  • the lacquer layer can be divided into comparatively sharply delimited partial areas in a procedurally simple manner due to the transition between the structure elevation and the subsequent structural recess.
  • the metallization in the region of the diffraction structure can be demetallized in a highly reproducible manner in a precise and accurate position, and unwanted demetallization of the reflection layer on the structure elevations can be avoided.
  • the structure supports which are connected to the transfer support and remain thereon can subsequently constitute the security element or a part thereof.
  • the structure elevations connected to the transfer carrier can be subjected to further process steps, such as additional coatings, etc. for this purpose.
  • the lacquer layer can be any layer based on thermoplastic polymers such as PMMA, acrylates, PVC, PU or similar materials.
  • the lacquer layer may further consist of free-radically or cationically curable UV lacquers which i.a. based on polyester, PU or acrylate binders.
  • the lacquer layer is applied to the carrier as a liquid or pasty lacquer and then embossed and cured, the process can be further accelerated and simplified. Due to the liquid or pasty consistency of the paint can also result in a homogeneous cohesive connection to the carrier and carried out a more uniform filling of the embossing tool, whereby the reproducibility of the process can be further increased.
  • the simplicity of the process can be further enhanced if the lacquer layer is cured during the embossing, in particular polymerized. In this way, very tight and simple narrow manufacturing tolerances can be followed with respect to the embossed structure.
  • the manufacturing parameters - such as Curing time, contact time with the embossing tool etc. - can be set flexibly, whereby the reproducibility can be further improved.
  • the curing or polymerization of the lacquer layer can be effected by UV radiation. Irradiation by the carrier during embossing is possible, for example, with UV-transparent carrier films. However, the irradiation can also take place from the side of the embossing tool.
  • the lacquer layer is embossed with a rotating stamping tool, this can further improve the continuity of the method.
  • a nearly bump-free embossing of the lacquer layer can be achieved by the rotating embossing tool. A simpler and more reproducible method may result.
  • a security element with particularly good security effect can be generated in a simple manner in terms of process engineering.
  • the hologram can already be impressed by the embossing tool with high precision in the structure surveys, whereby additional process steps can be avoided. A method with high reproducibility can thus be created.
  • the reproducibility of the method can be significantly increased if the thickness of the reflection layer is less than the embossing depth of the structure depressions.
  • the reflection layers of the structure depressions and structure elevations form an overlap with one another.
  • such an overlap could result in an uncontrollable breakage of the reflective layer upon separation, which can lead to blurred contours in the reflective layer on the structure surveys.
  • the optical diffraction patterns embossed in the structure elevations have a lower embossing depth than the structural depressions, reliable demetallization can be achieved by separating the structure elevations from the structure depressions be guaranteed during the removal of the carrier.
  • parts of the diffraction structures, in particular parts of the lacquer layer forming the structure elevations are also removed during demetallization and thus the diffraction structure is destroyed.
  • a particularly reliable and reproducible method can be achieved.
  • low manufacturing tolerances can be made possible.
  • the selective demetallization by separating the structure elevations from the structure depressions can be considerably improved if the embossing depth of the structure depressions in the lacquer layer essentially corresponds to the lacquer layer thickness.
  • This means that the bond between the structure elevations and structural depressions to be separated therefrom together with their metallization can be particularly weakened - which not only facilitates the removal of the transfer carrier, but can also ensure an exact, sharp-edged demetallization. This in particular when the structural depressions are stamped to the carrier. A particularly simple and reproducible method can result.
  • Adhesion reducers in particular may prove useful in this case, the use of which leads to a lower adhesive strength between the support and the lacquer layer than between the reflection layer and the support, if the lacquer layer has been through-stamped to the support for this purpose.
  • a particularly simple demetallization can be achieved and thus the reliability of the method can be further increased.
  • the transfer carrier is coated with an adhesion promoter before it is joined to the structure elevations, it can be ensured that the structure elevations form a stable connection with the transfer carrier via their reflection layer. This can be an unintentional release of the structure surveys be prevented by the transfer carrier during the removal of the carrier from the security element with the transfer carrier stable. The reproducibility of the process can thus continue to increase.
  • the security element is provided with a protective lacquer layer after separation from the support, this can facilitate the further treatment of the security element in the process.
  • the protective lacquer layer can compensate for the unevenness created by the structural depressions and thus create a homogeneous planar surface for further processing steps.
  • the protective lacquer layer can reliably protect the security element against external influences, such as oxidation of the metallic reflection layer.
  • the protective lacquer layer may be a transparent lacquer layer.
  • the protective lacquer layer may also be an adhesive layer in order to be able to provide the security element in a handling-friendly manner on a document of value.
  • Such an adhesive layer may be, for example, a heat-sealable, cold-seal or self-adhesive coating.
  • the adhesive layer may also be applied additionally with a protective lacquer layer.
  • the security against forgery of the security element can additionally be increased if the security element is provided with further security features. This can be done, for example, by gluing (or laminating) the security element according to the invention with a further security element having other security features.
  • the security element can be connected to a value document in a manner that are easy to handle, for example, by sticking it to the value document. Even a lamination of the same is conceivable.
  • a value document may be, for example, a passport, an identity card, a driver's license, a bill, a credit card, or the like.
  • a method 100 for producing a security element 1 is shown.
  • a lacquer layer 3 is applied to a support 2, which lacquer layer 3 is embossed in a further step with an embossing tool 4 and subsequently hardened - hereinafter shown.
  • the hardening is schematically represented by a radiation source 5, for example.
  • embossing 3 structural depressions 6 and structure elevations 7 are generated in the lacquer layer.
  • the lacquer layer 3 has optical diffraction structures 8 after embossing.
  • the lacquer layer 3 is metallized to produce a reflection layer 9, 9 '- by the metallization, a reflection layer 9, 9' is created both on the structure depressions 6 and on the structure elevations 7.
  • the metallization takes place as in Fig. 1 shown, with a common metal coating method 10.
  • the reflection layer 9, 9 ' is selectively removed in the further process of the method, in particular from the structure recesses 6 of the lacquer layer 3, or demetallinstrument therewith.
  • the structure elevations 7 of the lacquer layer 3, in particular a reflection layer 9, are bonded to a transfer carrier 11, as described in detail in FIG Fig. 2 can be recognized.
  • the transfer carrier 11, as a new substrate of the security element 1 is brought into contact with the structure elevations 7 of the lacquer layer 3 on the carrier 2.
  • a connection between the structural recesses 6 of the lacquer layer 3 and the transfer carrier 11 does not take place.
  • the original carrier 2 is now removed from the security element 1 and thereby the structure elevations 7 connected to the transfer carrier 11 from the metalized structure depressions adjoining the same 6 separately.
  • the structure depressions 6 continue to adhere to the original carrier 2 and are removed therefrom by the transfer carrier 11 in order to produce the security element 1.
  • those regions of the reflection layer 9 'which are located in the structure depressions 6 are removed together with the carrier 2.
  • the reflection layer 9 of the security element 1 is selectively demetallised on the transfer carrier 11 in the regions of the structure depressions 6, by removing the reflection layer 9 '.
  • a reflection layer 9 can be produced which is exactly congruent with the structure elevations 7 of the lacquer layer 3.
  • a diffraction structure 8 is embossed in at least one of these structure elevations 7 -for example by means of the embossing tool 4-an exactly congruent metallization of the diffraction structure 8 is thus achieved. Accordingly, regions between the structure elevations 7 act as see-through regions 12 through the reflection layer 9, which represent an exact security feature on the security element 1 and lead to a high security against counterfeiting.
  • the lacquer layer 3 is applied in the form of a liquid or pasty lacquer 13 to the carrier 2. Due to the liquid or pasty consistency of the paint 13, the cavities 14 of the embossing tool 4 can be better filled and a more homogeneous and exact embossing can be achieved. In addition, sharply demarcated structure elevations 7 can be created.
  • the lacquer layer 3 or the liquid or pasty lacquer 13 forming the lacquer layer 3 are hardened during the contact with the embossing tool 4. This can also be done in Fig. 1 be recognized.
  • a radiation source 5 is shown schematically below the embossing tool 4, which hardens the lacquer layer 3 during contact with the embossing tool 4 by suitable radiation 15.
  • a UV lamp is used as the radiation source 5, wherein the UV radiation 15 emitted by the lamp can polymerize the paint 13.
  • the embossing tool 4 is a rotating embossing tool 4, whereby the periodicity of the embossed structure is improved and a recurring impact in the embossed structure is avoided.
  • the thickness of the reflection layer 9, 9 'on the structure elevations 7 and on the structure depressions 6 is less than the embossing depth 17 of the structure depressions 6.
  • the reflection layer 9, 9 ' is significantly smaller than the embossing depth 17 of the structure depressions 6, a simple detachment of the reflection layers 9' from the lacquer layer 3 during the separation can be guaranteed.
  • optical diffraction structures 8 are embossed in several structure elevations.
  • these diffraction structures 8 form holograms 16 which represent a security feature of the security element 1.
  • the embossing depth 17 of the diffraction structures 8 or holograms 16 is advantageously, most significantly, less than the embossing depth 17 of the structure recesses 6 in the embossed lacquer layer 3.
  • the subsequent separation of the structure depressions 6 are greatly facilitated by the structure elevations 7, since the remaining Lack Mrsreste 18 in the structure depressions 6 are kept as low as possible. Remaining lacquer layer residues 18 could adhere to the structure elevations 7 during separation and prevent an exact sharp-edged separation.
  • the embossing depth 17 of the structure depressions 6 in the lacquer layer 3 essentially corresponds to the lacquer layer thickness 19.
  • no appreciable coating layer residues 18 are formed in the structure depressions 6, and the subsequently applied reflection layer 9 can thus adhere directly to the underlying layer, for example the support 2.
  • an adhesion reducer 20 is applied to the carrier 2 before the lacquer layer 3.
  • the adhesion reducer 20 is advantageously designed such that the adhesive strength between the carrier 2 and the lacquer layer 3 is reduced, but the adhesive strength between the carrier 2 and the reflection layer 9 'is enhanced. This can be done during the separation, as in Fig. 2 illustrated, ensure that the reflective layer 9 'on the support 2 reliably adheres and is removed with, while the lacquer layer 3 of the structure elevations 7 remains undamaged.
  • the transfer carrier 11 is also coated with a bonding agent 21, whereby the adhesion between the transfer carrier 11 and the reflective layer 9 of the structure elevations 7 is increased. A cohesive connection between the reflective layer 9, the structure elevations 7 and the transfer carrier 11 is ensured. The separation can be carried out more reliably and reproducibly.
  • the security element 1 is provided after separation with a protective lacquer layer 22.
  • the protective lacquer layer 22 can both serve to protect the security element 1 against external influences, as well as enable a connection of the security element 1 with further security features or value documents.
  • the protective varnish 23 forming the protective varnish layer 22 can offer both a protective effect and an adhesive effect for the security element 1.
  • the security element 1 can also be applied to value documents, such as banknotes, credit or bank cards, passports, identity cards, driving licenses, etc.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Finance (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
EP15188216.4A 2015-10-02 2015-10-02 Procede destine a la fabrication d'un element de securite Withdrawn EP3150400A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP15188216.4A EP3150400A1 (fr) 2015-10-02 2015-10-02 Procede destine a la fabrication d'un element de securite
US15/765,366 US10618339B2 (en) 2015-10-02 2016-10-03 Method for producing a security element
PCT/EP2016/073582 WO2017055634A1 (fr) 2015-10-02 2016-10-03 Procédé pour la production d'un élément de sécurité
JP2018517259A JP7025323B2 (ja) 2015-10-02 2016-10-03 保安構成要素の作製方法
EP16787740.6A EP3356158B1 (fr) 2015-10-02 2016-10-03 Procédé pour la production d'un élément de sécurité

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15188216.4A EP3150400A1 (fr) 2015-10-02 2015-10-02 Procede destine a la fabrication d'un element de securite

Publications (1)

Publication Number Publication Date
EP3150400A1 true EP3150400A1 (fr) 2017-04-05

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
EP15188216.4A Withdrawn EP3150400A1 (fr) 2015-10-02 2015-10-02 Procede destine a la fabrication d'un element de securite
EP16787740.6A Active EP3356158B1 (fr) 2015-10-02 2016-10-03 Procédé pour la production d'un élément de sécurité

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP16787740.6A Active EP3356158B1 (fr) 2015-10-02 2016-10-03 Procédé pour la production d'un élément de sécurité

Country Status (4)

Country Link
US (1) US10618339B2 (fr)
EP (2) EP3150400A1 (fr)
JP (1) JP7025323B2 (fr)
WO (1) WO2017055634A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MA42906A (fr) * 2015-07-10 2018-05-16 De La Rue Int Ltd Procédé de fabrication d'un motif dans ou sur un support
DK3720673T3 (da) * 2018-03-28 2021-05-10 Basf Coatings Gmbh Fremgangsmåde til overførsel af en prægestruktur på overfladen af et belægningsmiddel og som forbindelse anvendelig som prægematrice

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0563992A2 (fr) * 1992-04-03 1993-10-06 GAO Gesellschaft für Automation und Organisation mbH Méthode et appareil pour la fabrication d'éléments métalliques surfaces sur substrats
DE4404128A1 (de) * 1993-02-19 1994-08-25 Gao Ges Automation Org Sicherheitsdokument und Verfahren zu seiner Herstellung
DE102008008685A1 (de) * 2008-02-12 2009-08-13 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung
EP1843901B1 (fr) 2005-01-27 2014-01-08 Giesecke & Devrient GmbH Element de securite et procede de realisation associe

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DE2853953A1 (de) * 1978-12-14 1980-07-03 Hoechst Ag Identifikationskarte
JP3355308B2 (ja) * 1998-08-26 2002-12-09 大日本印刷株式会社 光硬化性樹脂組成物及び凹凸パターンの形成方法
US6344495B1 (en) * 1998-07-31 2002-02-05 Dai Nippon Printing Co., Ltd. Photo-curable resin composition and method for forming concave-convex pattern
US7420005B2 (en) * 2001-06-28 2008-09-02 Dai Nippon Printing Co., Ltd. Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern
JP4015471B2 (ja) * 2001-06-28 2007-11-28 大日本印刷株式会社 光硬化性樹脂組成物、微細凹凸パターン転写箔、光学物品、スタンパー及び微細凹凸パターンの形成方法
JP2004101834A (ja) * 2002-09-09 2004-04-02 Dainippon Printing Co Ltd 画像表示媒体、及びその製造方法
US6909444B2 (en) * 2002-09-09 2005-06-21 Dai Nippon Printing Co., Ltd. Transfer ribbon, image expressing medium and method for production of them
FI122671B (fi) * 2005-03-09 2012-05-15 M Real Oyj Menetelmä visuaalisesti tunnistettavan kuvion tuottamiseksi substraatille
US20080047930A1 (en) * 2006-08-23 2008-02-28 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
DE102007005884B4 (de) * 2007-02-07 2022-02-03 Leonhard Kurz Stiftung & Co. Kg Sicherheitsdokument
DE102007039996B4 (de) * 2007-02-07 2020-09-24 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement für ein Sicherheitsdokument und Verfahren zu seiner Herstellung
DE102008017652A1 (de) * 2008-04-04 2009-10-08 Leonhard Kurz Stiftung & Co. Kg Sicherheitselement sowie Verfahren zur Herstellung eines Sicherheitselements
JP5126522B2 (ja) * 2008-06-11 2013-01-23 大日本印刷株式会社 ホログラム自己吸着ラベルの製造方法、ホログラム自己粘着ラベル、及びホログラム付き媒体
DE102010019766A1 (de) * 2010-05-07 2011-11-10 Giesecke & Devrient Gmbh Verfahren zur Erzeugung einer Mikrostruktur auf einem Träger

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0563992A2 (fr) * 1992-04-03 1993-10-06 GAO Gesellschaft für Automation und Organisation mbH Méthode et appareil pour la fabrication d'éléments métalliques surfaces sur substrats
DE4404128A1 (de) * 1993-02-19 1994-08-25 Gao Ges Automation Org Sicherheitsdokument und Verfahren zu seiner Herstellung
EP1843901B1 (fr) 2005-01-27 2014-01-08 Giesecke & Devrient GmbH Element de securite et procede de realisation associe
DE102008008685A1 (de) * 2008-02-12 2009-08-13 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
EP3356158A1 (fr) 2018-08-08
WO2017055634A1 (fr) 2017-04-06
JP7025323B2 (ja) 2022-02-24
US20180304670A1 (en) 2018-10-25
EP3356158B1 (fr) 2019-08-14
JP2018533758A (ja) 2018-11-15
US10618339B2 (en) 2020-04-14

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