EP2981419B1 - Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative - Google Patents

Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative Download PDF

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Publication number
EP2981419B1
EP2981419B1 EP14715838.0A EP14715838A EP2981419B1 EP 2981419 B1 EP2981419 B1 EP 2981419B1 EP 14715838 A EP14715838 A EP 14715838A EP 2981419 B1 EP2981419 B1 EP 2981419B1
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EP
European Patent Office
Prior art keywords
layer
security
functional
functional layer
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14715838.0A
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German (de)
English (en)
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EP2981419A1 (fr
Inventor
Winfried HOFFMÜLLER
Michael Rahm
Andreas Rauch
Theodor Burchard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
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Giesecke and Devrient GmbH
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Publication of EP2981419A1 publication Critical patent/EP2981419A1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/369—Magnetised or magnetisable materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/43—Marking by removal of material
    • B42D25/445—Marking by removal of material using chemical means, e.g. etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/46—Associating two or more layers using pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives

Definitions

  • the invention relates to a method for producing a security element having two mutually-matched motif layers, in particular motif layers having visible in transmitted light and preferably also in reflected light characters, a security element available by the method, the security element formed as a transfer element, equipped with the security item of value and a Process for producing such a valuable article.
  • Valuables in particular value documents such as banknotes, shares, identity cards, credit cards, certificates, checks and other forgery-prone papers, such as identity documents of all kinds, but also branded goods and packaging of branded goods are often equipped with security elements to secure their authenticity and at the same time as To protect against unauthorized reproduction.
  • the security elements may, for example, take the form of security threads or stickers or any other form insertable or attachable to a valuable article or security paper, a "valuable article" within the meaning of the present invention being any objectionable to counterfeiting, in particular a value document, while a "security paper "represents the precursor to a value document, which is not yet ready for use.
  • Security elements are typically multilayer elements with multiple functional layers.
  • Functional layers are generally layers that have any properties that can be detected visually or by machine. Functional layers therefore contain, for example, dyes, luminescent substances, thermochromic substances, Liquid crystals, interference pigments, electrically conductive substances, magnetic substances, light-diffractive or refractive structures or combinations thereof.
  • the functional layers are usually designed as geometric or figurative patterns or motifs, ie there are functional areas within a layer with the detectable property (for example luminescence) and recesses in between.
  • a plurality of functional layers are arranged one above the other, it is generally desirable for the functional regions and the recesses in the individual functional layers to be formed exactly in register, ie with high register accuracy, and with contour-sharp edges between the functional regions and the recesses. In this way, one functional layer can be hidden under another, for example magnetic substances under a colored layer, or security elements with multiple functional layers and "negative writing" can be produced.
  • Negative-type security elements comprise a transparent substrate having at least one non-transparent coating having recesses (the negative writing). These recesses may have any shapes, such as letters, numbers or patterns of any kind, especially line patterns.
  • the term "negative writing" used in this application accordingly comprises recesses of any shape, ie any non-solidity in a non-transparent coating. The more transparent, ie the more translucent, the carrier substrate is, the more pronounced is the contrast between coated and uncoated regions. In the case of very transparent substrates, the negative writing is clearly recognizable in incident light, with less transparent substrates only in transmitted light.
  • the tamper-proof is the higher the finer the structures in the functional layers are with the matched-to-each other motifs. Finely contoured structures and forming the perfect register with each other, however, also pose a challenge for authorized manufacturers.
  • a number of methods are known which are intended to enable recesses in a plurality of superimposed functional layers to be registered precisely. H. congruent in all layers, train.
  • WO 92/11142 It is known to produce negative fonts in functional layers by means of heat-activatable printing inks.
  • the printing inks are printed in the form of the desired negative writing under the functional layers and contain waxes or intumescent additives which soften when heated or split off a gas and thereby produce foam structures.
  • the adhesion in the areas which can be printed with the activatable ink is reduced, and the functional layers can be removed mechanically in these areas.
  • DE 10 2007 055 112 discloses a method for register-containing, ie congruent, formation of a negative writing in a plurality of functional layers by means of an ink printed under the functional layers in the form of the negative print to be formed, which contains a constituent which effects a process upon irradiation or upon heating or on contact with a washing liquid
  • the ink exerts a force on the overlying coating which causes the coating to break.
  • This force can be exerted by a gas generated from constituents of the printing ink when they come into contact with washing liquid, irradiated and / or heated, or by a swelling agent in the printing ink, which swells upon contact with a washing liquid.
  • a method for providing congruent patterns or motifs with high contour sharpness and registration accuracy is in WO 2010/015384 A2 described.
  • the basic idea is to use a stickable resist layer to form congruent patterns in two functional layers.
  • a resist layer in the form of the desired pattern is applied to a first functional layer.
  • the pattern is exactly reproduced in the first functional layer by removing the non-resist protected areas of the first functional layer.
  • the pattern in the second functional layer is reproduced by adhering the second functional layer to the resist.
  • the bonding takes place only in the areas where the second Functional layer has contact with the resist.
  • the non-bonded regions of the second functional layer are then removed, while the bonded regions can not be removed, whereby an exact reproduction of the pattern of the resist layer and the first functional layer is produced in the second functional layer.
  • thermoplastic resist used must be tack free at room temperature. Since the step of adhering the functional layers by means of the resist can not be closely related to the pressure of the thermoplastic resist, the possibility of using crosslinking adhesive systems is considerably limited. This results in a resistance of the resist to solvents. In particular, solvents which are used in the step of printing the thermoplastic resin used in each case lead to a dissolution of the polymer. As a result, overprinting with corresponding solvent-containing systems entails considerable swelling of the thermoplastic resin despite the functional layer transferred in the transfer step. Furthermore, under certain circumstances damage to possibly in the functional layers, eg metallizations, embossed structures done. In addition, there remains a permanent impermanence to individual solvents on the layer composite obtained.
  • the object of the invention is to provide a method for the production of security elements which is improved over the above prior art and which makes it possible to form congruent patterns or motifs in two superimposed layers at least partially.
  • the object of the present invention is, in particular, to provide a security element having two motif layers with corresponding patterns or motifs which have a high register accuracy, wherein the security element has improved resistance and, with regard to its production, greater process reliability.
  • a preferred object of the present invention is to provide a security element having two metallizations each having an embossed structure, wherein the metallizations are in the form of two motif layers with corresponding patterns having high register accuracy and improved durability and with respect to their production have greater process reliability.
  • an adhesive resist layer is used in order to form congruent patterns in two functional layers, in particular metallizations.
  • a resist layer in the form of the desired pattern is applied to a first functional layer.
  • the resist lacquer applied in step 3 must still be embossable and tacky under the influence of temperature in step 6.
  • One of the consequences of this circumstance is that the choice of suitable adhesives is subject to considerable restrictions.
  • the process sequence described in D1 can not be changed because, for example, in a demetallization by means of etching postponed to a later process step, the exposed aluminum glued onto the resist in step 6 (reference number 22 in FIG Fig. 2d the D1) would be etched away.
  • the present invention is based on the idea of transferring metals or metal alloys other than aluminum from an embossing lacquer layer which can not be etched or demetallized under the conditions under which aluminum is demetallizable.
  • a durable metal may be patterned by the print pattern of the resist or adhesive and will not be damaged under process conditions by which ordinary aluminum metallization is removed.
  • Fig. 1 shows an inventive security element 1 in a view in transmitted light.
  • the security element 1 has at least the following layers: a transparent substrate 11, a first and a second functional layer (motif layers), and a resist layer, which glues the first and the second functional layer.
  • the two motif layers have the same size and shape in the exemplary embodiment and only partially cover the carrier substrate 11.
  • the motif layers can also cover the carrier substrate over the entire surface. Additionally, one of the motif layers may only partially cover or partially overlap the other motif layer.
  • the two motif layers form a triangular pattern 7 of lines 4, the lines 4 being formed from the functional areas of the functional layers (motif layers) bonded by means of resist.
  • the lines 4 are separated by recesses 3, wherein the recesses 3 are formed by the congruent recesses in the functional areas and the resist layer.
  • the lines 4 vary in their width y, whereby a sub-pattern 7 'becomes perceptible when viewed through the security element, in the embodiment shown another triangle.
  • Fig. 2 illustrates the procedure in the manufacture of a security element according to the invention 1. Shown is a section along the line AA 'of the in Fig. 1 illustrated security elements. The sequence of layers is merely exemplary.
  • Fig. 2a shows a first security element sub-element 10, consisting of a first carrier substrate 11, for example a film of polyethylene terephthalate (PET), an embossing lacquer layer 15 applied thereon with embossed diffraction structure 15 'with an aluminum metallization.
  • the aluminum metallization forms a first functional layer 12, on which in turn a layer 30 of resist in the form of a pattern with resist areas 33 and recesses 34 is printed therebetween.
  • the diffraction structure 15 ' continues in the functional layer as a diffraction structure 12'.
  • Fig. 2b 2 shows a section through the second security element subelement 20 to be combined with the first security element subelement 10.
  • the second security element subelement 20 consists of the second carrier substrate 21, the second functional layer 22 and an embossing lacquer layer 25 therebetween.
  • embossing lacquer layer 25 a diffraction structure 25 'is impressed, which continues in the second functional layer 22 as a diffraction structure 22'.
  • the second functional layer 22 is a nickel metallization.
  • the embossing lacquer 25 was before the application of the metallization 22 washed with an aqueous surfactant solution, so that the metallization 22 badly adheres to the embossing lacquer.
  • Fig. 2c shows how the first security element subelement 10 Fig. 2a and the second security element subelement 20 Fig. 2b be assembled into a composite 5.
  • the two sub-elements are pressed together, whereby the diffraction structure 22 'of the second functional layer 22 transmits into the resist areas 33, since the resist used is a deformable resist.
  • the resist areas 33 By means of the resist areas 33, the first security element partial element and the second security element partial element are glued together.
  • the compression of the two security elements sub-elements can be one or more stages, ie, the two sub-elements are preferably at elevated temperature in a heat roller with a (single-stage compression) or more so-called calender juxtaposed (multi-stage compression), or the two sub-elements are connected to several Heat rollers, each equipped with one or more so-called calender rolls, pressed together (multi-stage compression).
  • the multi-stage compression can, depending on the particular embodiment, lead to a particularly strong connection of the security element sub-elements. When using several heating rollers and temperature profiles can be realized during compression.
  • the second carrier substrate 21 and the second embossing lacquer layer 25 are peeled off, for example by a separating winding.
  • the result is in Fig. 2d shown. Only the regions 23 of the second functional layer 22, which were in contact with resist regions 33, were bonded to the first security element partial element 10. These regions constitute the second functional regions 23, which represent an exact reproduction of the pattern of the resist regions 33. The remaining regions of the second functional layer 22 were peeled off together with the second carrier substrate 21 and the embossing lacquer layer 25.
  • Fig. 2e shows the layer structure after treatment with an etchant.
  • the regions of the first functional layer 12 formed by an aluminum metallization not protected by resist regions 33 were removed, while the regions of the first functional layer 12 protected by resist regions 33 were preserved and form the first functional regions 13.
  • the first functional regions 13 represent an exact reproduction of the pattern of the resist regions 33.
  • the second functional regions 23 formed by nickel metallization have been preserved upon treatment with an etchant
  • the areas 13, 33 and 23 are each exactly congruent and form in the representation of Fig. 1 the lines 4.
  • the recesses 3 between the lines 4 are also exactly congruent and are formed by the recesses 14 in the first functional layer 12, the recesses 34 in the resist layer 30 and the recesses 24 in the second functional layer 22.
  • the lines 4 (which are formed by the first functional regions 13, the resist regions 33 and the second functional regions 23) are shown in FIG Fig. 2 illustrated embodiment each carrier a diffraction structure.
  • the diffraction structures may, for example, be hologram structures, with different hologram structures preferably being present in the first functional areas 13 and the second functional areas 23.
  • a viewer recognizes in the transmitted light view the in Fig. 1 In the front-side reflected light view, the side of the first supporting substrate 11 as the front side, the hologram of the first functional layer 12, and the hologram of the second functional layer 22 in the back-side incident view are considered.
  • a hot stamping foil can be used as a second security element sub-element.
  • the second carrier substrate 21 would be peeled off during the separation winding, while the embossing lacquer layer 25 would remain on the formed security element 1.
  • It can also serve as a protective layer.
  • a protective layer (not shown in the figure) on the second functional areas or the second functional layer is useful, in particular therefore z.
  • B. the in Fig. 2e As shown diffraction structure 22 'and the impression of the diffraction structure 25' covered in the functional layer 22 and thus is not accessible to counterfeiting attacks.
  • a particular advantage of the example on the basis of FIGS. 2a to 2e described manufacturing method according to the invention is that there are no restrictions on the suitable for the formation of the resist layer 30 adhesives.
  • suitable adhesives are typical laminating adhesives. Adhesives are advantageously used which have good printability and good metal adhesion.
  • the viscosity at room temperature after bonding is so high that an uncontrolled flow or detachment of the adhesive from one of the two functional layers or metallizations is unlikely.
  • Both solvent-based and solvent-free adhesives can be used.
  • the adhesives can be one-component or two-component.
  • the adhesive used after curing is so stable that the diffraction or embossing structures transferred from the functional layers or metallizations into the resist areas no longer flow and are stable with respect to the pressures and solvents used in subsequent process steps.
  • the temperature and the pressure in the laminating gap can be chosen to be significantly lower compared with the process based on thermoplastic resist coating described in document D1. Due to the significantly milder conditions in the laminating gap results in view of the selection of suitable substrates, a higher degree of freedom. In addition, the milder conditions in the laminating gap lead to an improved impression quality of the functional layers or
  • Metallizations in the resist areas transmitted diffraction or embossed structures.
  • the physical nature of the first functional layer and that of the second functional layer are coordinated so that the second functional layer is not damaged in the step of removing the first functional layer, for example by means of etching.
  • the first functional layer is advantageously an aluminum metallization.
  • the product obtainable by the process according to the invention additionally contains magnetic properties, so that a magnetic coding can be provided in the product. Therefore, the choice of a nickel metallization to form the second functional layer is particularly preferred. Due to the diffraction or embossing structure of the nickel metallization, such a functional layer can in particular provide a high-resolution magnetic coding. Will that be in the Fig. 2e shown security elements applied to a value-document substrate in such a way that the functional areas formed of nickel 23 facing the value document substrate and the functional areas formed of aluminum 13 facing the viewer of the value document are responsible for the magnetic coding, formed of nickel Functional areas 23 hidden for the viewer when viewing the value document in incident light.
  • the functional areas 23 are formed from a resistant to etching aluminum alloy and the functional areas 13 formed of aluminum. In this way, when viewing the security element in both front-side reflected light, as well as in the rear reflected light, the impression of an identical metallic color can be ensured.
  • the functional areas 23 are formed of copper or gold and the functional areas 13 formed of aluminum. In this way, when viewing the security element in the front reflected light on the one hand and in the rear reflected light on the other hand different colored impressions can be caused.
  • the carrier substrate of the security element partial elements which can be used according to the invention is preferably a film, for example made of polypropylene, polyethylene, polystyrene, polyester, in particular polycarbonate or polyethylene terephthalate. Transparent or translucent films are particularly preferred. When using such films, the register-formed recesses in the individual functional layers can be clearly recognized as negative writing.
  • the application of the functional layers is carried out by known methods that are suitable for the respective functional layer, for example by physical vapor deposition (PVD) in metals.
  • PVD physical vapor deposition
  • the application can be made over the entire area or only in partial areas.
  • the functional layer can be formed directly on the carrier substrate, or one or more intermediate layers can be provided.
  • intermediate layers are absolutely necessary, for example if the motif of the functional layer is a metallized hologram, kinegram, pixelgram or another metallized diffraction structure.
  • embossing lacquer layer is applied and embossed into the embossing lacquer layer, before or after the metallization, the desired diffractive structure.
  • an intermediate layer is generally required which ensures a suitable orientation of the liquid crystals.
  • Suitable orientation layers can be, for example, embossed lacquer layers embossed diffractive structures.
  • the carrier film can also be suitably treated.
  • At least one of the functional layers is a metallized diffraction structure, such as a metallized hologram.
  • a metallized diffraction structure such as a metallized hologram.
  • both functional layers metallized diffraction structures such as metallized holograms.
  • the holograms or structural information in the functional layers of a security element according to the invention can be the same or different.
  • Materials for embossing lacquer layers are known to a person skilled in the art. Suitable embossing lacquers are disclosed in, for example DE 10 2004 035 979 A1 , which discloses heat sealing lacquers which can be used equally as embossing lacquer
  • the resist is preferably applied in the form of the desired pattern, for example printed.
  • suitable printing methods are known.
  • etchant such as alkalis or acids
  • the negative writing can form, for example, an encoding or a geometric or figurative motif.
  • the carrier substrate of the second security element subelement is separated together with parts of the functional layer of the second security element subelement. Therefore, it is necessary that the functional layer has only a slight adhesion to the carrier substrate.
  • the required low adhesion force is already achieved in many functional layer materials, in particular metallizations, by omitting adhesion-promoting measures between the carrier substrate and the functional layer.
  • adhesion-promoting measures between the individual layers of a security element is otherwise customary, and the corresponding provisions are known to a person skilled in the art.
  • the adhesive force between the carrier substrate and the functional layer is too high, it can be reduced by treating the carrier substrate with suitable additives.
  • suitable additives are, for example, surface-active substances, defoamers or thickeners. Additives can also be introduced into the carrier substrate itself.
  • adhesion-reducing layers can be provided under the functional layer. Adhesion-reducing layers are selected from materials whose surfaces are known to typically experience relatively poor adhesion, for example, siliconizations, layers containing release additives (e.g., Byk 3500), waxes, cured UV coatings, metallizations, untreated films such as e.g. Eg PET.
  • any intermediate layers present between the carrier substrate and the functional layer for example embossing lacquer layers for a hologram. If such an embossing lacquer layer or other intermediate layer is to be taken off together with the carrier substrate, the adhesive force between the intermediate layer and the functional layer, ie for example between the embossing lacquer layer and a metallization applied thereon, must be correspondingly low. If the adhesive force is too high, the intermediate layer should be treated with the above-mentioned additives or an adhesion-reducing layer should be provided.
  • residues of the additives can remain on the functional layer after the carrier substrate or the intermediate layer has been separated off. These can normally be washed away simply with an aqueous solution whose pH is suitably adjusted and which may optionally also contain surfactants. Even a laundry with solvents is possible. In persistent cases, high-pressure nozzles and / or mechanical support (felts, brushes) can be used, but this is usually not necessary. Small additive residues can also be "burned away" by means of a corona treatment. Moreover, in many cases can be completely dispensed with a removal of additive residues. Suitable formulated conformal coatings can also adhere adequately to "additive-loaded" functional layers.
  • the security elements according to the invention can be provided in the form of transfer materials, ie films or tapes having a multiplicity of finished security elements prepared for the transfer.
  • the layer structure of the later security element is prepared on a carrier material in the reverse order in which the layer structure is later to be stored on a valuable object, wherein the layer structure of the security element in continuous form or already in the final outline form used as security element on the Carrier material can be prepared.
  • a hot melt adhesive is used for this purpose.
  • Will the security element be in endless form prepared may be provided for transmission either only in the areas to be transmitted of the security element, an adhesive layer, or the adhesive is activated only in the areas to be transferred.
  • the carrier material of the transfer elements is usually deducted from the layer structure of the security elements during or after their transfer to the valuable article.
  • a separating layer release layer
  • the carrier material can also remain on the transmitted security element.
  • the security elements according to the invention can be used to authenticate goods of any kind.
  • they are used to authenticate value documents, for example banknotes, checks or identity cards.
  • they can be arranged on a surface of the value document or be completely or partially embedded in the value document.
  • they are used in value documents hole hole hole.
  • the advantages of the security elements according to the invention with transparent carrier substrates and from both sides of the value document to be considered, carefully matched motifs, can be particularly beautiful. Even negatives with the finest structures and sub-patterns can be clearly recognized in transmitted light. You are in the achievable according to the invention precision of a counterfeiter practically imitated.
  • the security elements according to the invention always contain at least two adhesive layers, ie they contain an adhesive resist layer and are provided with an adhesive layer with the valuable article to be secured connected. If, for the bonding of the security element to the object of value, an adhesive which is similar in terms of its chemical and physical properties to the resist in the layer structure of the security element, the layer structure of the security element is always destroyed during detachment attempts.

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  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
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  • General Chemical & Material Sciences (AREA)
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Claims (11)

  1. Procédé de fabrication d'un élément de sécurité (1) comportant une écriture en négatif (3) pour un papier de sécurité ou pour un objet de valeur, en particulier un document de valeur, comprenant les étapes suivantes :
    a) fabrication d'un premier élément partiel d'élément de sécurité (10) par
    a1) mise à disposition d'un premier substrat porteur (11) transparent ou translucide,
    a2) application d'une première couche fonctionnelle (12) sur le premier substrat porteur (11) ou sur une couche intermédiaire (15) auparavant appliquée,
    a3) application d'une couche de résist (30) sur la première couche fonctionnelle (12) sous forme d'un motif (7) prédéterminé ayant des zones de résist (33) et des évidements (34) entre les zones de résist,
    b) fabrication d'un deuxième élément partiel d'élément de sécurité (20) par
    b1) mise à disposition d'un deuxième substrat porteur (21),
    b2) application d'une deuxième couche fonctionnelle (22) sur le deuxième substrat porteur (21) ou sur une couche intermédiaire (25) auparavant appliquée,
    c) jonction du premier (10) et du deuxième (20) élément partiel d'élément de sécurité de manière à obtenir un composite (5) de telle façon que la couche de résist (30) et la deuxième couche fonctionnelle (22) se font face, et collage du premier (10) et du deuxième (20) élément partiel d'élément de sécurité, de préférence sous pression élevée et à température élevée,
    d) prélèvement du deuxième substrat porteur (21) du composite (5) collé, la deuxième couche fonctionnelle (22) continuant à adhérer aux zones de résist (33) en formant des deuxièmes zones fonctionnelles (23), tandis que les zones restantes de la deuxième couche fonctionnelle (22) sont prélevées conjointement avec le deuxième substrat porteur (21), ce par quoi, dans la deuxième couche fonctionnelle (22), des deuxièmes évidements (24) sont réalisés, et
    e) enlèvement, par décapage, des zones de la première couche fonctionnelle (12) non protégées par des zones de résist (33), afin de constituer des premières zones fonctionnelles (13) et des premiers évidements (14) entre elles, lesquels, en association avec les évidements (34) dans la couche de résist (30) et les deuxièmes évidements (24), constituent l'écriture en négatif (3) dans la deuxième couche fonctionnelle (22) consistant en un matériau résistant au décapage.
  2. Procédé selon la revendication 1, le premier élément partiel d'élément de sécurité (10) étant fabriqué par
    - mise à disposition du premier substrat porteur (11),
    - application d'une première couche de vernis de gaufrage (15) comme couche intermédiaire sur le premier substrat porteur (11),
    - application d'une première métallisation (12) comme première couche fonctionnelle sur la première couche de vernis de gaufrage (15),
    - gaufrage de la première couche de vernis de gaufrage (15) avant ou après l'application de la première métallisation (15), et
    - application de la couche de résist (30) sur la première métallisation (12), la couche de résist comportant des zones de résist (33) et des évidements (34) ou des zones de résist (33) et des évidements (34) y étant constitués.
  3. Procédé selon la revendication 1 ou 2, le deuxième élément partiel d'élément de sécurité (20) étant fabriqué par
    - mise à disposition du deuxième substrat porteur (21),
    - application d'une deuxième couche de vernis de gaufrage (25) comme couche intermédiaire sur le deuxième substrat porteur (21),
    - application d'une deuxième métallisation (22) comme deuxième couche fonctionnelle sur la deuxième couche de vernis de gaufrage (25),
    - gaufrage de la deuxième couche de vernis de gaufrage (25) avant ou après l'application de la deuxième métallisation (22).
  4. Procédé selon une des revendications de 1 à 3, la deuxième couche fonctionnelle (22) étant constituée par du nickel, du chrome, de l'argent ou de l'or ou par un alliage de nickel, un alliage de chrome, un alliage d'argent, un alliage d'or ou un alliage d'aluminium résistant au décapage.
  5. Procédé selon une des revendications de 1 à 4, la première couche fonctionnelle (12) étant constituée par de l'aluminium.
  6. Procédé selon une des revendications de 1 à 5, la deuxième couche fonctionnelle (22) étant constituée par une métallisation présentant des propriétés magnétiques, en particulier du nickel.
  7. Procédé selon la revendication 6, la deuxième couche fonctionnelle (22) étant une métallisation en nickel, et les deuxièmes zones fonctionnelles (23) étant adaptées à mettre à disposition une codification magnétique.
  8. Procédé selon la revendication 7, les deuxièmes zones fonctionnelles (23) ayant une structure pouvant être obtenue en particulier par gaufrage, laquelle est adaptée à mettre à disposition une codification magnétique à haute résolution.
  9. Élément de sécurité (1) comportant une écriture en négatif (3), destiné à être placé sur ou à être au moins partiellement inséré dans un papier de sécurité ou dans un objet de valeur, en particulier un document de valeur, qui peut être obtenu suivant un procédé selon une des revendications de 1 à 8.
  10. Matériau de transfert destiné au transfert d'éléments de sécurité sur un papier de sécurité ou sur un objet de valeur tel qu'un document de valeur, le matériau de transfert comportant une pluralité d'éléments de sécurité (1) selon la revendication 9 réalisés en tant qu'éléments de transfert.
  11. Procédé de fabrication d'un papier de sécurité ou d'un objet de valeur tel qu'un document de valeur, dans lequel un élément de sécurité (1) selon la revendication 9 est appliqué sur un papier de sécurité ou sur un substrat pour objet de valeur ou y est au moins partiellement inséré.
EP14715838.0A 2013-04-05 2014-04-03 Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative Active EP2981419B1 (fr)

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DE102013005937.2A DE102013005937A1 (de) 2013-04-05 2013-04-05 Verfahren zum Herstellen eines Sicherheitselements mit Negativschrift
PCT/EP2014/000889 WO2014161667A1 (fr) 2013-04-05 2014-04-03 Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative

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EP2981419B1 true EP2981419B1 (fr) 2017-06-14

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CN (1) CN105263719B (fr)
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DE102016002451A1 (de) * 2016-02-29 2017-08-31 Giesecke & Devrient Gmbh Prägeplatte, Herstellungsverfahren und geprägtes Sicherheitselement
DE102016007649A1 (de) * 2016-06-22 2017-12-28 Giesecke+Devrient Currency Technology Gmbh Optisch variables Sicherheitselement
DE102016012111A1 (de) * 2016-10-10 2018-04-12 Giesecke+Devrient Currency Technology Gmbh Verfahren zum Erzeugen eines motivförmigen Sicherheitselements auf einem Zielsubstrat
WO2019057322A1 (fr) 2017-09-21 2019-03-28 Giesecke+Devrient Currency Technology Gmbh Procédé de production de pigments à profil intérieur et/ou extérieur prédéfinis au moyen d'une couche formant des craquelures et pigments
DE102018005474A1 (de) * 2018-07-09 2020-01-09 Giesecke+Devrient Currency Technology Gmbh Optisch variables Sicherheitselement mit reflektivem Flächenbereich
DE102019001422A1 (de) * 2019-02-28 2020-09-03 Giesecke+Devrient Currency Technology Gmbh Transfervorrichtung und Verfahren in einer Transfervorrichtung
WO2021146800A1 (fr) * 2020-01-20 2021-07-29 Redfab Inc. Étiquettes d'avertissement aérospatiales
GB2596075A (en) * 2020-06-15 2021-12-22 Iq Structures Sro Composite security element
CN112634743B (zh) * 2020-12-31 2022-06-17 季华实验室 光学防伪结构及其制作方法

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DE4041025C2 (de) 1990-12-20 2003-04-17 Gao Ges Automation Org Magnetischer, metallischer Sicherheitsfaden mit Negativschrift
DE102004035979A1 (de) 2004-07-14 2006-02-02 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung
GB2429187B (en) * 2005-08-15 2007-08-08 Rue De Int Ltd Security devices for security substrates
DE102006012732A1 (de) 2006-03-17 2007-09-20 Giesecke & Devrient Gmbh Gitterbild
DE102007055112A1 (de) 2007-01-05 2008-07-10 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitsfolien
CZ2007731A3 (cs) * 2007-10-19 2009-04-29 Krimistop S. R. O. Inteligentní mikrocástice obsahující data a strojove citelnou variabilní informaci a zpusob její výroby
DE102008036480A1 (de) 2008-08-05 2010-02-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitselementen mit gepasserten Motivschichten

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CN105263719B (zh) 2017-10-24
EP2981419A1 (fr) 2016-02-10
DE102013005937A1 (de) 2014-10-09
WO2014161667A1 (fr) 2014-10-09

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