EP2981419A1 - Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative - Google Patents
Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négativeInfo
- Publication number
- EP2981419A1 EP2981419A1 EP14715838.0A EP14715838A EP2981419A1 EP 2981419 A1 EP2981419 A1 EP 2981419A1 EP 14715838 A EP14715838 A EP 14715838A EP 2981419 A1 EP2981419 A1 EP 2981419A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- functional layer
- functional
- areas
- carrier substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000002346 layers by function Substances 0.000 claims abstract description 123
- 239000010410 layer Substances 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 42
- 238000004049 embossing Methods 0.000 claims description 39
- 238000001465 metallisation Methods 0.000 claims description 38
- 239000004922 lacquer Substances 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 238000012546 transfer Methods 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000000788 chromium alloy Substances 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 21
- 230000001070 adhesive effect Effects 0.000 description 21
- 239000000654 additive Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 8
- 239000000976 ink Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000000637 aluminium metallisation Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000012876 carrier material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- -1 Polyethylene terephthalate Polymers 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004920 heat-sealing lacquer Substances 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/14—Security printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/369—Magnetised or magnetisable materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/425—Marking by deformation, e.g. embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/445—Marking by removal of material using chemical means, e.g. etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/455—Associating two or more layers using heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/46—Associating two or more layers using pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
- B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
Definitions
- the invention relates to a method for producing a
- Security elements with two mutually-matched motif layers in particular motif layers having visible in transmitted light and preferably in incident light characters, a security element obtainable by the method, the trained as a transfer element security element, equipped with the security item valuables and a method for producing such a valuables.
- Valuables in particular value documents such as banknotes, shares, identity cards, credit cards, certificates, checks and others
- Security elements are typically multilayer elements with multiple functional layers.
- Functional layers are generally layers that have any properties that can be detected visually or by machine. Functional layers therefore contain, for example, dyes, luminescent substances, thermochromic substances, Liquid crystals, interference pigments, electrically conductive substances,
- the functional layers are usually designed as geometric or figurative patterns or motifs, d. H. there are functional areas with the detectable property within one shift
- Functional areas and the recesses are formed one above the other.
- one functional layer can be hidden under another, for example magnetic substances under a colored layer, or security elements with a plurality of functional layers can be hidden
- Negative-type security elements comprise a transparent substrate having at least one non-transparent coating having recesses (the negative writing). These recesses may have any shapes, such as letters, numbers or patterns of any kind, especially line patterns.
- the term "negative writing" used in this application accordingly comprises recesses of any shape, that is to say any non-fullness in a non-transparent coating
- Negative writing clearly visible in reflected light, with less transparent substrates only in transmitted light.
- a security element with negative writing two different functional layers, for example a motive in the form of a gold-colored metallic coating and the same motif as a red printing ink on it, this motif appears to the viewer in a golden color from one side, red from the other side.
- Negative fonts provide a good protection against counterfeiting, since in the transmitted light inaccuracies in the production are particularly easily recognizable, and "primitive" counterfeiting attempts, such as copying with color copiers, even for the untrained eye are immediately recognizable.
- the tamper-proof is the higher the finer the structures in the functional layers are with the matched-to-each other motifs. Finest structures contour sharp and in perfect register with each other
- This force can be exerted by a gas generated from constituents of the printing ink when they come into contact with washing liquid, irradiated and / or heated, or by a swelling agent in the printing ink, which swells upon contact with a washing liquid.
- the basic idea is to use a stickable resist layer in order to form congruent patterns in two functional layers.
- a resist layer in the form of the desired pattern is applied to a first functional layer.
- the pattern will be in the first
- reproduced by the second functional layer is glued to the resist.
- the bonding takes place only in the areas where the second Functional layer has contact with the resist.
- the non-bonded areas of the second functional layer are then removed, while the bonded areas can not be removed, whereby in the second
- Functional layer an exact reproduction of the pattern of the resist layer and the first functional layer is formed.
- Resist varnishes must be tack free at room temperature. Since the step of adhering the functional layers by means of the resist can not be closely related to the pressure of the thermoplastic resist, the possibility of using crosslinking adhesive systems is considerably limited. This results in a resistance of the resist to solvents. In particular, solvents which are used in the step of printing the thermoplastic resin used in each case lead to a dissolution of the polymer. This has the consequence that overprinting with corresponding solvent-containing systems, despite the transferred in the transfer step functional layer a considerable
- thermoplastic resists Furthermore, damage may possibly occur to the functional layers, e.g. Metallizations, embossed structures. In addition, one remains
- the object of the invention is to provide a method for the production of security elements which is improved over the above prior art and which makes it possible to form congruent patterns or motifs in two superimposed layers at least partially.
- the object of the present invention is in particular a
- the security element having an improved resistance and in terms of its production a greater process reliability.
- a preferred object of the present invention is to provide a security element having two metallizations each having an embossed structure, wherein the metallizations are in the form of two motif layers with corresponding patterns having high register accuracy and improved durability and with respect to their production a bigger one
- Negative security security elements for a security paper or a valuable article comprising the following steps: a) producing a first security element subelement al) providing a first transparent or translucent
- Resist layer has resist areas and recesses or in it
- Resist areas and recesses are formed.
- Aluminum alloy is formed. 5. (Preferred Embodiment) The method according to any one of paragraphs 1 to 4, wherein the first functional layer is formed of aluminum.
- Functional areas are adapted to provide a magnetic coding.
- Security paper or a valuable item in particular a A value document obtainable by a method according to any one of paragraphs 1 to 8.
- an adhesive resist layer is used according to the invention to form congruent patterns in two functional layers, in particular metallizations
- the following steps are carried out in the method described in D1 for producing a two-sidedly matched metallization:
- Step ⁇ Provision of an embossing lacquer layer (reference number 15 in Fig. 2a of the Dl).
- Step 2 Provide an aluminum metallization (reference number 12 in Fig. 2a of the Dl).
- Step 3 Providing a resist layer (reference number 30 in Fig. 2a of the Dl).
- Step 4 Demetallization by means of etching (see FIGS. 2a and 2b of the D1, in particular those obtained after the demetallization step
- Step 5 Produce a metal donation sheet (see Fig. 2c of the Dl).
- Step 5.1 Provision of an embossing lacquer layer (reference number 25 in Fig. 2c of the Dl).
- Step 5.2 Providing a non-adherent aluminum metallization (reference number 22 in Fig. 2c of the Dl).
- Step 6 Assemble the resist layer (Reference No. 30 in Fig. 2b of D1) with the non-adherent metallization (Reference No. 22 in Fig. 2c of D1) under increased pressure and elevated temperature to thereby form a composite (Reference No. 5 in Fig 2d the Dl) to obtain.
- Step 7 Step the divider winding, where the two connected
- Security element sub-elements are pulled apart to provide in this way a two-sided passaged metallization (reference number 1 in Fig. 2e of the Dl).
- the resist coating applied in step 3 must still be embossable and tacky under the influence of temperature in step 6.
- One of the consequences of this circumstance is that the choice of suitable adhesives is subject to considerable restrictions.
- the process sequence described in the D1 can not be changed because, for example, in a demetallization by means of etching postponed to a later step, the exposed aluminum glued onto the resist in step 6 (reference number 22 in FIG. 2d of D1 ) would be etched away.
- the present invention is based on the idea of transferring metals or metal alloys other than aluminum from an embossing lacquer layer which can not be etched or demetallized under the conditions under which aluminum is demetallizable.
- a resistant metal can by the printing pattern of the resist or
- Adhesive can be structured and is not damaged under process conditions by which a common aluminum metallization is removed.
- FIG. 1 shows a security element according to the invention in transparent
- FIGS. 2a-2e the procedure in the production of a
- Security element illustrated in sections through the security element of Fig. 1 along the line A-A '.
- Fig. 1 shows an inventive security element 1 in a view in transmitted light.
- the security element 1 has at least the following layers: a transparent substrate 11, a first and a second one
- the two motif layers have the same size and shape in the exemplary embodiment and only partially cover the carrier substrate 11.
- the motif layers can also cover the carrier substrate over the entire surface.
- Motif layers only partially cover the other motif layer or partially overlap with it.
- Security elements form the two motif layers a triangular pattern 7 of lines 4, wherein the lines 4 are formed from the functional areas of the functional layers (motif layers) bonded by means of resist.
- the lines 4 are separated by recesses 3, wherein the recesses 3 through the congruent recesses in the
- the lines 4 vary in their width y, which in looking through the
- Security element a sub-pattern 7 'becomes perceptible, in the embodiment shown another triangle.
- the functional areas do not necessarily have to be in the form of parallel lines, but can have any other shapes. Which subject a viewer perceives in front-side light view and back-elevation view depends on the particular one
- Fig. 2 illustrates the process flow in the manufacture of a security element according to the invention 1. Shown is a section along the line A-A 'of the security element shown in Fig. 1. The sequence of layers is merely exemplary.
- FIG. 2 a shows a first security element partial element 10, consisting of a first carrier substrate 11, for example a foil
- PET Polyethylene terephthalate
- embossing lacquer layer 15 applied thereto with an impressed diffraction structure 15 'with an aluminum metallization.
- the aluminum metallization forms a first
- the diffraction structure 15 ' continues in the functional layer as a diffraction structure 12'.
- the second security element subelement 20 consists of the second carrier substrate 21, the second functional layer 22 and a second security subelement 20
- embossing lacquer layer 25 is a
- FIG. 2 c shows how the first security element partial element 10 from FIG. 2 a and the second security element partial element 20 from FIG. 2 b are combined to form a composite 5.
- the two sub-elements are pressed together, whereby the diffraction structure 22 'of the second functional layer 22 transmits into the resist areas 33, since the resist used is a deformable resist.
- the resist areas 33 By means of the resist areas 33, the first
- the compression of the two security elements sub-elements can take place in one or more stages, i. the two sub-elements are preferably at elevated temperature in a heat roller with a
- Calender rolls pressed together or else the two sub-elements are pressed against each other at several heating rollers, which are each equipped with one or more so-called calender rolls (multi-stage compression).
- the multi-stage compression can, depending on the particular embodiment, lead to a particularly strong connection of the security element sub-elements.
- Temperature profiles can be realized during compression. After bonding and, if appropriate, after a certain waiting time for cooling and for stabilizing the adhesive bond, the second carrier substrate 21 and the second embossing lacquer layer 25 are peeled off, for example by a separating winding. The result is shown in Fig. 2d. Only the regions 23 of the second functional layer 22, which were in contact with resist regions 33, were bonded to the first security element partial element 10. These regions constitute the second functional regions 23, which represent an exact reproduction of the pattern of the resist regions 33. The remaining regions of the second functional layer 22 were peeled off together with the second carrier substrate 21 and the embossing lacquer layer 25.
- Fig. 2e shows the layer structure after treatment with an etchant.
- the first functional layer 12 was preserved and the first functional areas 13 form.
- the first functional regions 13 represent an exact reproduction of the pattern of the resist regions 33.
- the second functional regions 23 formed by nickel metallization have been preserved upon treatment with an etchant
- the areas 13, 33 and 23 are each exactly congruent and form in the illustration of Fig. 1, the lines 4.
- the recesses 3 between the lines 4 are also exactly congruent and by the
- the lines 4 (which are formed by the first functional areas 13, the resist areas 33 and the second functional areas 23) are carriers of a diffraction structure in the embodiment shown in FIG. 2, respectively.
- the diffraction structures may, for example, be hologram structures, with different hologram structures preferably being present in the first functional areas 13 and the second functional areas 23.
- a viewer in the transmitted light view recognizes the line pattern shown in FIG. 1, in the front-side reflected light view, the side of the first carrier substrate 11 as the front side, the hologram of the first functional layer 12, and the hologram of the second one in the rear side elevational view Functional layer 22.
- a hot stamping foil can be used as a second security element sub-element.
- a hot stamping foil can be used as a second security element sub-element.
- the embossing lacquer layer 25 would remain on the formed security element 1. It can also serve as a protective layer.
- a protective layer (not shown in the figure) on the second functional areas or the second functional layer is useful, in particular therefore z.
- the diffraction structure 22 'shown in FIG. 2e or the impression of the diffraction structure 25' in the functional layer 22 are covered and thus are not accessible to counterfeiting attacks.
- a particular advantage of the production method according to the invention described by way of example with reference to FIGS. 2 a to 2 e is that with regard to the method suitable for the formation of the resist layer 30
- Adhesives have no restrictions. Examples of suitable adhesives are typical laminating adhesives. Adhesives are advantageously used which have good printability and good metal adhesion. It is preferred that the viscosity at room temperature after bonding be so high that an uncontrolled flow or a ; Removal of the adhesive from one of the two functional layers or metallizations is unlikely. Both solvent-based and solvent-free adhesives can be used. The adhesives can be one-component or two-component. Furthermore, it is preferred that the adhesive used after curing is so stable that the diffraction or embossing structures transferred from the functional layers or metallizations into the resist areas no longer flow and are stable with respect to the pressures and solvents used in subsequent process steps.
- the temperature and the pressure in the laminating gap can be chosen to be significantly lower compared to the process described in document D1, which is based on thermoplastic resist.
- the physical properties of the first functional layer and of the second functional layer are coordinated so that the second functional layer is not damaged in the step of removing the first functional layer, for example by means of etching
- Functional layer is advantageously an aluminum metallization.
- Formation of the second functional layer are suitable e.g. Metallizations of nickel, chromium, silver or gold or metallizations of a nickel alloy, a chromium alloy, a silver alloy, a gold alloy or an etching resistant aluminum alloy.
- nickel as a metallization includes after the
- the choice of a nickel metallization to form the second functional layer is particularly preferred. Due to the diffraction or embossing structure of the nickel metallization, such a functional layer can in particular provide a high-resolution magnetic coding. If this is shown in FIG. 2e
- Substrate-substrate are facing and the functional areas formed of aluminum 13 facing the viewer of the value document, the responsible for the magnetic coding, formed of nickel functional areas 23 are hidden for the viewer when viewing the value document in incident light.
- Security elements are the functional areas 23 formed from an etch resistant aluminum alloy and the
- Security elements are the functional areas 23 formed of copper or gold and the functional areas 13 formed of aluminum. In this way, when viewing the security element in front incident light on the one hand and in the rear reflected light on the other
- the carrier substrate of the security element partial elements which can be used according to the invention is preferably a film, for example made of polypropylene, polyethylene, polystyrene, polyester, in particular polycarbonate or
- Functional layers are clearly recognized as negative writing.
- the application of the functional layers is carried out by known methods that are suitable for the respective functional layer, for example by physical vapor deposition (PVD) in metals.
- PVD physical vapor deposition
- the application can be made over the entire area or only in partial areas.
- the functional layer can be formed directly on the carrier substrate, or one or more intermediate layers can be provided. For some functional layers intermediate layers are absolutely necessary, for example if the motif of the
- Functional layer is a metallized hologram, Kinegram, Pixelgram or other metallized diffraction structure. In such a case, first an embossing lacquer layer is applied and in the
- Embossing lacquer layer before or after the metallization, embossed the desired diffractive structure.
- an intermediate layer is generally required which ensures a suitable orientation of the liquid crystals.
- Suitable orientation layers can be, for example, embossed lacquer layers embossed diffractive structures.
- the carrier film can also be suitably treated.
- At least one of the functional layers is a metallized diffraction structure, such as a metallized hologram.
- both functional layers are metallized
- Diffraction structures e.g. metallized holograms.
- the holograms or structural information in the functional layers of a security element according to the invention can be the same or different.
- Materials for embossing lacquer layers are one
- embossing lacquers are disclosed in, for example DE 10 2004 035 979 AI, which discloses heat-sealing lacquers which can likewise be used as embossing lacquer
- the resist is preferably applied in the form of the desired pattern, for example printed.
- the skilled person is suitable for this
- etchant such as alkalis or acids
- the negative writing for example, a coding or a
- the carrier substrate of the second security element subelement is separated together with parts of the functional layer of the second security element subelement. Therefore, it is necessary that the functional layer has only a slight adhesion to the carrier substrate.
- the required low adhesive force is in many
- Carrier substrate and functional layer is omitted.
- the adhesive force between the carrier substrate and the functional layer is too high, it can be reduced by treating the carrier substrate with suitable additives.
- the carrier substrate can be washed off with water and / or solvents with or without suitable additives.
- suitable additives are, for example, surface-active substances, defoamers or thickeners. Additives can also be introduced into the carrier substrate itself. Alternatively, adhesion-reducing layers can be provided with • the functional layer.
- adhesion-reducing layers materials are selected on the surfaces of which, as is generally known, a relatively poor adhesion occurs, for example siliconizations, layers containing release additives (eg Byk 3500), waxes, cured UV lacquers, metallizations, untreated foils such as e.g. Eg PET.
- adhesion-reducing layer and the functional layer to be detached an easy detachability of the functional layer can be achieved and thus the desired pattern can be produced in the functional layer of the second security element partial element.
- the intermediate layer and the functional layer so for example between the embossing lacquer layer and a metallization applied thereto, be low. If the adhesive force is too high, the intermediate layer should be treated with the above-mentioned additives or an adhesion-reducing layer should be provided. If a treatment of the carrier substrate or an intermediate layer with adhesion-reducing additives is carried out, residues of the additives can remain on the functional layer after the carrier substrate or the intermediate layer has been separated off. These can normally be washed away simply with an aqueous solution whose pH is suitably adjusted and which may optionally also contain surfactants. Even a laundry with solvents is possible. In stubborn cases can also be with
- the security elements according to the invention can be in the form of
- Transfer materials d. H. Films or tapes with a variety of finished and prepared for transfer security elements,
- the layer structure of the later security element is prepared on a carrier material in the reverse order in which the layer structure is later to be stored on a valuable object, wherein the layer structure of the security element in continuous form or already in the final outline form used as security element on the Carrier material can be prepared.
- a hot melt adhesive is used for this purpose.
- Will the security element be in endless form prepared may be provided for transmission either only in the areas to be transmitted of the security element, an adhesive layer, or the adhesive is activated only in the areas to be transferred.
- the carrier material of the transfer elements is usually deducted from the layer structure of the security elements during or after their transfer to the valuable article. To facilitate the detachment, between the carrier material and the part to be detached
- release layer a release layer
- the carrier material can also be transferred to the
- the security elements according to the invention can be used to authenticate goods of any kind.
- they are used to authenticate value documents, for example banknotes, checks or identity cards. They can do it on one
- the advantages of the security elements according to the invention with transparent carrier substrates and from both sides of the value document to be considered, carefully matched motifs, can be particularly beautiful. Even negative fonts with the finest structures and sub-patterns can be clearly recognized in transmitted light. You are in the achievable according to the invention precision of a counterfeiter practically imitated. Also, a detachment of the security elements in order to transfer them to another valuable article, is practically not possible, because the security elements according to the invention always contain at least two adhesive layers, ie they contain an adhesive resist layer and are provided with an adhesive layer with the valuable object to be secured connected. If, for the bonding of the security element to the object of value, an adhesive which is similar in terms of its chemical and physical properties to the resist in the layer structure of the security element is used in stripping attempts
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Credit Cards Or The Like (AREA)
- Printing Methods (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013005937.2A DE102013005937A1 (de) | 2013-04-05 | 2013-04-05 | Verfahren zum Herstellen eines Sicherheitselements mit Negativschrift |
PCT/EP2014/000889 WO2014161667A1 (fr) | 2013-04-05 | 2014-04-03 | Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2981419A1 true EP2981419A1 (fr) | 2016-02-10 |
EP2981419B1 EP2981419B1 (fr) | 2017-06-14 |
Family
ID=50442469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14715838.0A Active EP2981419B1 (fr) | 2013-04-05 | 2014-04-03 | Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2981419B1 (fr) |
CN (1) | CN105263719B (fr) |
DE (1) | DE102013005937A1 (fr) |
WO (1) | WO2014161667A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016002451A1 (de) * | 2016-02-29 | 2017-08-31 | Giesecke & Devrient Gmbh | Prägeplatte, Herstellungsverfahren und geprägtes Sicherheitselement |
DE102016007649A1 (de) * | 2016-06-22 | 2017-12-28 | Giesecke+Devrient Currency Technology Gmbh | Optisch variables Sicherheitselement |
DE102016012111A1 (de) * | 2016-10-10 | 2018-04-12 | Giesecke+Devrient Currency Technology Gmbh | Verfahren zum Erzeugen eines motivförmigen Sicherheitselements auf einem Zielsubstrat |
CN111094463A (zh) * | 2017-09-21 | 2020-05-01 | 捷德货币技术有限责任公司 | 产生具有预定内部和/或外部轮廓的颜料碎片的方法及颜料碎片 |
DE102018005474A1 (de) * | 2018-07-09 | 2020-01-09 | Giesecke+Devrient Currency Technology Gmbh | Optisch variables Sicherheitselement mit reflektivem Flächenbereich |
DE102019001422A1 (de) * | 2019-02-28 | 2020-09-03 | Giesecke+Devrient Currency Technology Gmbh | Transfervorrichtung und Verfahren in einer Transfervorrichtung |
US20230140092A1 (en) * | 2020-01-20 | 2023-05-04 | Redfab Inc. | Aerospace warning tag |
GB2596075A (en) * | 2020-06-15 | 2021-12-22 | Iq Structures Sro | Composite security element |
CN112634743B (zh) * | 2020-12-31 | 2022-06-17 | 季华实验室 | 光学防伪结构及其制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4041025C2 (de) | 1990-12-20 | 2003-04-17 | Gao Ges Automation Org | Magnetischer, metallischer Sicherheitsfaden mit Negativschrift |
DE102004035979A1 (de) | 2004-07-14 | 2006-02-02 | Giesecke & Devrient Gmbh | Sicherheitselement und Verfahren zu seiner Herstellung |
GB2429187B (en) * | 2005-08-15 | 2007-08-08 | Rue De Int Ltd | Security devices for security substrates |
DE102006012732A1 (de) | 2006-03-17 | 2007-09-20 | Giesecke & Devrient Gmbh | Gitterbild |
DE102007055112A1 (de) * | 2007-01-05 | 2008-07-10 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Sicherheitsfolien |
CZ2007731A3 (cs) * | 2007-10-19 | 2009-04-29 | Krimistop S. R. O. | Inteligentní mikrocástice obsahující data a strojove citelnou variabilní informaci a zpusob její výroby |
DE102008036480A1 (de) | 2008-08-05 | 2010-02-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Sicherheitselementen mit gepasserten Motivschichten |
-
2013
- 2013-04-05 DE DE102013005937.2A patent/DE102013005937A1/de not_active Withdrawn
-
2014
- 2014-04-03 EP EP14715838.0A patent/EP2981419B1/fr active Active
- 2014-04-03 CN CN201480017065.5A patent/CN105263719B/zh active Active
- 2014-04-03 WO PCT/EP2014/000889 patent/WO2014161667A1/fr active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2014161667A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN105263719B (zh) | 2017-10-24 |
CN105263719A (zh) | 2016-01-20 |
WO2014161667A1 (fr) | 2014-10-09 |
DE102013005937A1 (de) | 2014-10-09 |
EP2981419B1 (fr) | 2017-06-14 |
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