EP2981419A1 - Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative - Google Patents

Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative

Info

Publication number
EP2981419A1
EP2981419A1 EP14715838.0A EP14715838A EP2981419A1 EP 2981419 A1 EP2981419 A1 EP 2981419A1 EP 14715838 A EP14715838 A EP 14715838A EP 2981419 A1 EP2981419 A1 EP 2981419A1
Authority
EP
European Patent Office
Prior art keywords
layer
functional layer
functional
areas
carrier substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14715838.0A
Other languages
German (de)
English (en)
Other versions
EP2981419B1 (fr
Inventor
Winfried HOFFMÜLLER
Michael Rahm
Andreas Rauch
Theodor Burchard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP2981419A1 publication Critical patent/EP2981419A1/fr
Application granted granted Critical
Publication of EP2981419B1 publication Critical patent/EP2981419B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/36Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373Metallic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14Security printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/36Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/369Magnetised or magnetisable materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/405Marking
    • B42D25/425Marking by deformation, e.g. embossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/405Marking
    • B42D25/43Marking by removal of material
    • B42D25/445Marking by removal of material using chemical means, e.g. etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
    • B42D25/455Associating two or more layers using heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
    • B42D25/46Associating two or more layers using pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
    • B42D25/465Associating two or more layers using chemicals or adhesives
    • B42D25/47Associating two or more layers using chemicals or adhesives using adhesives

Definitions

  • the invention relates to a method for producing a
  • Security elements with two mutually-matched motif layers in particular motif layers having visible in transmitted light and preferably in incident light characters, a security element obtainable by the method, the trained as a transfer element security element, equipped with the security item valuables and a method for producing such a valuables.
  • Valuables in particular value documents such as banknotes, shares, identity cards, credit cards, certificates, checks and others
  • Security elements are typically multilayer elements with multiple functional layers.
  • Functional layers are generally layers that have any properties that can be detected visually or by machine. Functional layers therefore contain, for example, dyes, luminescent substances, thermochromic substances, Liquid crystals, interference pigments, electrically conductive substances,
  • the functional layers are usually designed as geometric or figurative patterns or motifs, d. H. there are functional areas with the detectable property within one shift
  • Functional areas and the recesses are formed one above the other.
  • one functional layer can be hidden under another, for example magnetic substances under a colored layer, or security elements with a plurality of functional layers can be hidden
  • Negative-type security elements comprise a transparent substrate having at least one non-transparent coating having recesses (the negative writing). These recesses may have any shapes, such as letters, numbers or patterns of any kind, especially line patterns.
  • the term "negative writing" used in this application accordingly comprises recesses of any shape, that is to say any non-fullness in a non-transparent coating
  • Negative writing clearly visible in reflected light, with less transparent substrates only in transmitted light.
  • a security element with negative writing two different functional layers, for example a motive in the form of a gold-colored metallic coating and the same motif as a red printing ink on it, this motif appears to the viewer in a golden color from one side, red from the other side.
  • Negative fonts provide a good protection against counterfeiting, since in the transmitted light inaccuracies in the production are particularly easily recognizable, and "primitive" counterfeiting attempts, such as copying with color copiers, even for the untrained eye are immediately recognizable.
  • the tamper-proof is the higher the finer the structures in the functional layers are with the matched-to-each other motifs. Finest structures contour sharp and in perfect register with each other
  • This force can be exerted by a gas generated from constituents of the printing ink when they come into contact with washing liquid, irradiated and / or heated, or by a swelling agent in the printing ink, which swells upon contact with a washing liquid.
  • the basic idea is to use a stickable resist layer in order to form congruent patterns in two functional layers.
  • a resist layer in the form of the desired pattern is applied to a first functional layer.
  • the pattern will be in the first
  • reproduced by the second functional layer is glued to the resist.
  • the bonding takes place only in the areas where the second Functional layer has contact with the resist.
  • the non-bonded areas of the second functional layer are then removed, while the bonded areas can not be removed, whereby in the second
  • Functional layer an exact reproduction of the pattern of the resist layer and the first functional layer is formed.
  • Resist varnishes must be tack free at room temperature. Since the step of adhering the functional layers by means of the resist can not be closely related to the pressure of the thermoplastic resist, the possibility of using crosslinking adhesive systems is considerably limited. This results in a resistance of the resist to solvents. In particular, solvents which are used in the step of printing the thermoplastic resin used in each case lead to a dissolution of the polymer. This has the consequence that overprinting with corresponding solvent-containing systems, despite the transferred in the transfer step functional layer a considerable
  • thermoplastic resists Furthermore, damage may possibly occur to the functional layers, e.g. Metallizations, embossed structures. In addition, one remains
  • the object of the invention is to provide a method for the production of security elements which is improved over the above prior art and which makes it possible to form congruent patterns or motifs in two superimposed layers at least partially.
  • the object of the present invention is in particular a
  • the security element having an improved resistance and in terms of its production a greater process reliability.
  • a preferred object of the present invention is to provide a security element having two metallizations each having an embossed structure, wherein the metallizations are in the form of two motif layers with corresponding patterns having high register accuracy and improved durability and with respect to their production a bigger one
  • Negative security security elements for a security paper or a valuable article comprising the following steps: a) producing a first security element subelement al) providing a first transparent or translucent
  • Resist layer has resist areas and recesses or in it
  • Resist areas and recesses are formed.
  • Aluminum alloy is formed. 5. (Preferred Embodiment) The method according to any one of paragraphs 1 to 4, wherein the first functional layer is formed of aluminum.
  • Functional areas are adapted to provide a magnetic coding.
  • Security paper or a valuable item in particular a A value document obtainable by a method according to any one of paragraphs 1 to 8.
  • an adhesive resist layer is used according to the invention to form congruent patterns in two functional layers, in particular metallizations
  • the following steps are carried out in the method described in D1 for producing a two-sidedly matched metallization:
  • Step ⁇ Provision of an embossing lacquer layer (reference number 15 in Fig. 2a of the Dl).
  • Step 2 Provide an aluminum metallization (reference number 12 in Fig. 2a of the Dl).
  • Step 3 Providing a resist layer (reference number 30 in Fig. 2a of the Dl).
  • Step 4 Demetallization by means of etching (see FIGS. 2a and 2b of the D1, in particular those obtained after the demetallization step
  • Step 5 Produce a metal donation sheet (see Fig. 2c of the Dl).
  • Step 5.1 Provision of an embossing lacquer layer (reference number 25 in Fig. 2c of the Dl).
  • Step 5.2 Providing a non-adherent aluminum metallization (reference number 22 in Fig. 2c of the Dl).
  • Step 6 Assemble the resist layer (Reference No. 30 in Fig. 2b of D1) with the non-adherent metallization (Reference No. 22 in Fig. 2c of D1) under increased pressure and elevated temperature to thereby form a composite (Reference No. 5 in Fig 2d the Dl) to obtain.
  • Step 7 Step the divider winding, where the two connected
  • Security element sub-elements are pulled apart to provide in this way a two-sided passaged metallization (reference number 1 in Fig. 2e of the Dl).
  • the resist coating applied in step 3 must still be embossable and tacky under the influence of temperature in step 6.
  • One of the consequences of this circumstance is that the choice of suitable adhesives is subject to considerable restrictions.
  • the process sequence described in the D1 can not be changed because, for example, in a demetallization by means of etching postponed to a later step, the exposed aluminum glued onto the resist in step 6 (reference number 22 in FIG. 2d of D1 ) would be etched away.
  • the present invention is based on the idea of transferring metals or metal alloys other than aluminum from an embossing lacquer layer which can not be etched or demetallized under the conditions under which aluminum is demetallizable.
  • a resistant metal can by the printing pattern of the resist or
  • Adhesive can be structured and is not damaged under process conditions by which a common aluminum metallization is removed.
  • FIG. 1 shows a security element according to the invention in transparent
  • FIGS. 2a-2e the procedure in the production of a
  • Security element illustrated in sections through the security element of Fig. 1 along the line A-A '.
  • Fig. 1 shows an inventive security element 1 in a view in transmitted light.
  • the security element 1 has at least the following layers: a transparent substrate 11, a first and a second one
  • the two motif layers have the same size and shape in the exemplary embodiment and only partially cover the carrier substrate 11.
  • the motif layers can also cover the carrier substrate over the entire surface.
  • Motif layers only partially cover the other motif layer or partially overlap with it.
  • Security elements form the two motif layers a triangular pattern 7 of lines 4, wherein the lines 4 are formed from the functional areas of the functional layers (motif layers) bonded by means of resist.
  • the lines 4 are separated by recesses 3, wherein the recesses 3 through the congruent recesses in the
  • the lines 4 vary in their width y, which in looking through the
  • Security element a sub-pattern 7 'becomes perceptible, in the embodiment shown another triangle.
  • the functional areas do not necessarily have to be in the form of parallel lines, but can have any other shapes. Which subject a viewer perceives in front-side light view and back-elevation view depends on the particular one
  • Fig. 2 illustrates the process flow in the manufacture of a security element according to the invention 1. Shown is a section along the line A-A 'of the security element shown in Fig. 1. The sequence of layers is merely exemplary.
  • FIG. 2 a shows a first security element partial element 10, consisting of a first carrier substrate 11, for example a foil
  • PET Polyethylene terephthalate
  • embossing lacquer layer 15 applied thereto with an impressed diffraction structure 15 'with an aluminum metallization.
  • the aluminum metallization forms a first
  • the diffraction structure 15 ' continues in the functional layer as a diffraction structure 12'.
  • the second security element subelement 20 consists of the second carrier substrate 21, the second functional layer 22 and a second security subelement 20
  • embossing lacquer layer 25 is a
  • FIG. 2 c shows how the first security element partial element 10 from FIG. 2 a and the second security element partial element 20 from FIG. 2 b are combined to form a composite 5.
  • the two sub-elements are pressed together, whereby the diffraction structure 22 'of the second functional layer 22 transmits into the resist areas 33, since the resist used is a deformable resist.
  • the resist areas 33 By means of the resist areas 33, the first
  • the compression of the two security elements sub-elements can take place in one or more stages, i. the two sub-elements are preferably at elevated temperature in a heat roller with a
  • Calender rolls pressed together or else the two sub-elements are pressed against each other at several heating rollers, which are each equipped with one or more so-called calender rolls (multi-stage compression).
  • the multi-stage compression can, depending on the particular embodiment, lead to a particularly strong connection of the security element sub-elements.
  • Temperature profiles can be realized during compression. After bonding and, if appropriate, after a certain waiting time for cooling and for stabilizing the adhesive bond, the second carrier substrate 21 and the second embossing lacquer layer 25 are peeled off, for example by a separating winding. The result is shown in Fig. 2d. Only the regions 23 of the second functional layer 22, which were in contact with resist regions 33, were bonded to the first security element partial element 10. These regions constitute the second functional regions 23, which represent an exact reproduction of the pattern of the resist regions 33. The remaining regions of the second functional layer 22 were peeled off together with the second carrier substrate 21 and the embossing lacquer layer 25.
  • Fig. 2e shows the layer structure after treatment with an etchant.
  • the first functional layer 12 was preserved and the first functional areas 13 form.
  • the first functional regions 13 represent an exact reproduction of the pattern of the resist regions 33.
  • the second functional regions 23 formed by nickel metallization have been preserved upon treatment with an etchant
  • the areas 13, 33 and 23 are each exactly congruent and form in the illustration of Fig. 1, the lines 4.
  • the recesses 3 between the lines 4 are also exactly congruent and by the
  • the lines 4 (which are formed by the first functional areas 13, the resist areas 33 and the second functional areas 23) are carriers of a diffraction structure in the embodiment shown in FIG. 2, respectively.
  • the diffraction structures may, for example, be hologram structures, with different hologram structures preferably being present in the first functional areas 13 and the second functional areas 23.
  • a viewer in the transmitted light view recognizes the line pattern shown in FIG. 1, in the front-side reflected light view, the side of the first carrier substrate 11 as the front side, the hologram of the first functional layer 12, and the hologram of the second one in the rear side elevational view Functional layer 22.
  • a hot stamping foil can be used as a second security element sub-element.
  • a hot stamping foil can be used as a second security element sub-element.
  • the embossing lacquer layer 25 would remain on the formed security element 1. It can also serve as a protective layer.
  • a protective layer (not shown in the figure) on the second functional areas or the second functional layer is useful, in particular therefore z.
  • the diffraction structure 22 'shown in FIG. 2e or the impression of the diffraction structure 25' in the functional layer 22 are covered and thus are not accessible to counterfeiting attacks.
  • a particular advantage of the production method according to the invention described by way of example with reference to FIGS. 2 a to 2 e is that with regard to the method suitable for the formation of the resist layer 30
  • Adhesives have no restrictions. Examples of suitable adhesives are typical laminating adhesives. Adhesives are advantageously used which have good printability and good metal adhesion. It is preferred that the viscosity at room temperature after bonding be so high that an uncontrolled flow or a ; Removal of the adhesive from one of the two functional layers or metallizations is unlikely. Both solvent-based and solvent-free adhesives can be used. The adhesives can be one-component or two-component. Furthermore, it is preferred that the adhesive used after curing is so stable that the diffraction or embossing structures transferred from the functional layers or metallizations into the resist areas no longer flow and are stable with respect to the pressures and solvents used in subsequent process steps.
  • the temperature and the pressure in the laminating gap can be chosen to be significantly lower compared to the process described in document D1, which is based on thermoplastic resist.
  • the physical properties of the first functional layer and of the second functional layer are coordinated so that the second functional layer is not damaged in the step of removing the first functional layer, for example by means of etching
  • Functional layer is advantageously an aluminum metallization.
  • Formation of the second functional layer are suitable e.g. Metallizations of nickel, chromium, silver or gold or metallizations of a nickel alloy, a chromium alloy, a silver alloy, a gold alloy or an etching resistant aluminum alloy.
  • nickel as a metallization includes after the
  • the choice of a nickel metallization to form the second functional layer is particularly preferred. Due to the diffraction or embossing structure of the nickel metallization, such a functional layer can in particular provide a high-resolution magnetic coding. If this is shown in FIG. 2e
  • Substrate-substrate are facing and the functional areas formed of aluminum 13 facing the viewer of the value document, the responsible for the magnetic coding, formed of nickel functional areas 23 are hidden for the viewer when viewing the value document in incident light.
  • Security elements are the functional areas 23 formed from an etch resistant aluminum alloy and the
  • Security elements are the functional areas 23 formed of copper or gold and the functional areas 13 formed of aluminum. In this way, when viewing the security element in front incident light on the one hand and in the rear reflected light on the other
  • the carrier substrate of the security element partial elements which can be used according to the invention is preferably a film, for example made of polypropylene, polyethylene, polystyrene, polyester, in particular polycarbonate or
  • Functional layers are clearly recognized as negative writing.
  • the application of the functional layers is carried out by known methods that are suitable for the respective functional layer, for example by physical vapor deposition (PVD) in metals.
  • PVD physical vapor deposition
  • the application can be made over the entire area or only in partial areas.
  • the functional layer can be formed directly on the carrier substrate, or one or more intermediate layers can be provided. For some functional layers intermediate layers are absolutely necessary, for example if the motif of the
  • Functional layer is a metallized hologram, Kinegram, Pixelgram or other metallized diffraction structure. In such a case, first an embossing lacquer layer is applied and in the
  • Embossing lacquer layer before or after the metallization, embossed the desired diffractive structure.
  • an intermediate layer is generally required which ensures a suitable orientation of the liquid crystals.
  • Suitable orientation layers can be, for example, embossed lacquer layers embossed diffractive structures.
  • the carrier film can also be suitably treated.
  • At least one of the functional layers is a metallized diffraction structure, such as a metallized hologram.
  • both functional layers are metallized
  • Diffraction structures e.g. metallized holograms.
  • the holograms or structural information in the functional layers of a security element according to the invention can be the same or different.
  • Materials for embossing lacquer layers are one
  • embossing lacquers are disclosed in, for example DE 10 2004 035 979 AI, which discloses heat-sealing lacquers which can likewise be used as embossing lacquer
  • the resist is preferably applied in the form of the desired pattern, for example printed.
  • the skilled person is suitable for this
  • etchant such as alkalis or acids
  • the negative writing for example, a coding or a
  • the carrier substrate of the second security element subelement is separated together with parts of the functional layer of the second security element subelement. Therefore, it is necessary that the functional layer has only a slight adhesion to the carrier substrate.
  • the required low adhesive force is in many
  • Carrier substrate and functional layer is omitted.
  • the adhesive force between the carrier substrate and the functional layer is too high, it can be reduced by treating the carrier substrate with suitable additives.
  • the carrier substrate can be washed off with water and / or solvents with or without suitable additives.
  • suitable additives are, for example, surface-active substances, defoamers or thickeners. Additives can also be introduced into the carrier substrate itself. Alternatively, adhesion-reducing layers can be provided with • the functional layer.
  • adhesion-reducing layers materials are selected on the surfaces of which, as is generally known, a relatively poor adhesion occurs, for example siliconizations, layers containing release additives (eg Byk 3500), waxes, cured UV lacquers, metallizations, untreated foils such as e.g. Eg PET.
  • adhesion-reducing layer and the functional layer to be detached an easy detachability of the functional layer can be achieved and thus the desired pattern can be produced in the functional layer of the second security element partial element.
  • the intermediate layer and the functional layer so for example between the embossing lacquer layer and a metallization applied thereto, be low. If the adhesive force is too high, the intermediate layer should be treated with the above-mentioned additives or an adhesion-reducing layer should be provided. If a treatment of the carrier substrate or an intermediate layer with adhesion-reducing additives is carried out, residues of the additives can remain on the functional layer after the carrier substrate or the intermediate layer has been separated off. These can normally be washed away simply with an aqueous solution whose pH is suitably adjusted and which may optionally also contain surfactants. Even a laundry with solvents is possible. In stubborn cases can also be with
  • the security elements according to the invention can be in the form of
  • Transfer materials d. H. Films or tapes with a variety of finished and prepared for transfer security elements,
  • the layer structure of the later security element is prepared on a carrier material in the reverse order in which the layer structure is later to be stored on a valuable object, wherein the layer structure of the security element in continuous form or already in the final outline form used as security element on the Carrier material can be prepared.
  • a hot melt adhesive is used for this purpose.
  • Will the security element be in endless form prepared may be provided for transmission either only in the areas to be transmitted of the security element, an adhesive layer, or the adhesive is activated only in the areas to be transferred.
  • the carrier material of the transfer elements is usually deducted from the layer structure of the security elements during or after their transfer to the valuable article. To facilitate the detachment, between the carrier material and the part to be detached
  • release layer a release layer
  • the carrier material can also be transferred to the
  • the security elements according to the invention can be used to authenticate goods of any kind.
  • they are used to authenticate value documents, for example banknotes, checks or identity cards. They can do it on one
  • the advantages of the security elements according to the invention with transparent carrier substrates and from both sides of the value document to be considered, carefully matched motifs, can be particularly beautiful. Even negative fonts with the finest structures and sub-patterns can be clearly recognized in transmitted light. You are in the achievable according to the invention precision of a counterfeiter practically imitated. Also, a detachment of the security elements in order to transfer them to another valuable article, is practically not possible, because the security elements according to the invention always contain at least two adhesive layers, ie they contain an adhesive resist layer and are provided with an adhesive layer with the valuable object to be secured connected. If, for the bonding of the security element to the object of value, an adhesive which is similar in terms of its chemical and physical properties to the resist in the layer structure of the security element is used in stripping attempts

Abstract

L'invention concerne un procédé servant à fabriquer un élément de sécurité (1) pourvu d'une inscription négative (3). Ledit procédé comprend les étapes qui suivent consistant à : a) fabriquer un premier élément partiel (10) d'élément de sécurité en fournissant un premier substrat de support (11), appliquer une première couche fonctionnelle (12) sur le premier substrat de support (11), appliquer une couche de résiste (30) sur la première couche fonctionnelle (12) sous la forme d'un motif (7) prédéfini avec des zones de résiste (33) et des évidements (34) entre les zones de résiste ; b) fabriquer un deuxième élément partiel (20) d'élément de sécurité en fournissant un deuxième substrat de support (21), appliquer une deuxième couche fonctionnelle (22) sur le deuxième substrat de support (21) ; c) assembler le premier élément partiel (10) et le deuxième élément partiel (20) d'élément de sécurité pour former un composite (5) de telle manière que la couche de résiste (30) et la deuxième couche fonctionnelle (22) soient orientées l'une vers l'autre, et coller le premier élément partiel (10) et le deuxième élément partiel (20) d'élément de sécurité ; d) séparer le deuxième substrat de support (21) du composite (5) collé, la deuxième couche fonctionnelle (22) adhérant aux zones de résiste (33) en formant des deuxièmes zones fonctionnelles (23), tandis que les autres zones de la deuxième couche fonctionnelle (22) sont retirées avec le deuxième substrat de support (21), ce qui permet de réaliser, dans la deuxième couche fonctionnelle (22), des deuxièmes évidements (24) ; et e) supprimer les zones, non protégées par des zones de résiste (33), de la première couche fonctionnelle (12) au moyen d'un décapage afin de former des premières zones fonctionnelles (13) et des premiers évidements (14), qui forment, avec les évidements (34) dans la couche de résiste (30) et avec les deuxièmes évidements (24) dans la deuxième couche fonctionnelle (22) constituée d'un matériau résistant au décapage, l'inscription négative (3).
EP14715838.0A 2013-04-05 2014-04-03 Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative Active EP2981419B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013005937.2A DE102013005937A1 (de) 2013-04-05 2013-04-05 Verfahren zum Herstellen eines Sicherheitselements mit Negativschrift
PCT/EP2014/000889 WO2014161667A1 (fr) 2013-04-05 2014-04-03 Procédé servant à fabriquer un élément de sécurité pourvu d'une inscription négative

Publications (2)

Publication Number Publication Date
EP2981419A1 true EP2981419A1 (fr) 2016-02-10
EP2981419B1 EP2981419B1 (fr) 2017-06-14

Family

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DE102016002451A1 (de) * 2016-02-29 2017-08-31 Giesecke & Devrient Gmbh Prägeplatte, Herstellungsverfahren und geprägtes Sicherheitselement
DE102016007649A1 (de) * 2016-06-22 2017-12-28 Giesecke+Devrient Currency Technology Gmbh Optisch variables Sicherheitselement
DE102016012111A1 (de) * 2016-10-10 2018-04-12 Giesecke+Devrient Currency Technology Gmbh Verfahren zum Erzeugen eines motivförmigen Sicherheitselements auf einem Zielsubstrat
WO2019057322A1 (fr) * 2017-09-21 2019-03-28 Giesecke+Devrient Currency Technology Gmbh Procédé de production de pigments à profil intérieur et/ou extérieur prédéfinis au moyen d'une couche formant des craquelures et pigments
DE102018005474A1 (de) 2018-07-09 2020-01-09 Giesecke+Devrient Currency Technology Gmbh Optisch variables Sicherheitselement mit reflektivem Flächenbereich
DE102019001422A1 (de) * 2019-02-28 2020-09-03 Giesecke+Devrient Currency Technology Gmbh Transfervorrichtung und Verfahren in einer Transfervorrichtung
CA3168598A1 (fr) * 2020-01-20 2021-07-29 Redfab Inc. Etiquettes d'avertissement aerospatiales
GB2596075A (en) * 2020-06-15 2021-12-22 Iq Structures Sro Composite security element
CN112634743B (zh) * 2020-12-31 2022-06-17 季华实验室 光学防伪结构及其制作方法

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DE102008036480A1 (de) 2008-08-05 2010-02-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitselementen mit gepasserten Motivschichten

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DE102013005937A1 (de) 2014-10-09
CN105263719B (zh) 2017-10-24
WO2014161667A1 (fr) 2014-10-09
CN105263719A (zh) 2016-01-20
EP2981419B1 (fr) 2017-06-14

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