EP3150400A1 - Method for manufacturing a safety element - Google Patents
Method for manufacturing a safety element Download PDFInfo
- Publication number
- EP3150400A1 EP3150400A1 EP15188216.4A EP15188216A EP3150400A1 EP 3150400 A1 EP3150400 A1 EP 3150400A1 EP 15188216 A EP15188216 A EP 15188216A EP 3150400 A1 EP3150400 A1 EP 3150400A1
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- EP
- European Patent Office
- Prior art keywords
- lacquer layer
- embossed
- carrier
- layer
- elevations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/29—Securities; Bank notes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/425—Marking by deformation, e.g. embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
Definitions
- the invention relates to a method for producing a security element having a metallized optical diffraction structure in an embossed lacquer layer in which a lacquer layer is applied, embossed and cured on a support, structural embossings, structure elevations and an optical diffraction structure being produced by embossing the lacquer layer, hereinafter a reflection layer is provided on the structure depressions and structure elevations of the embossed lacquer layer by metallization, and subsequently this reflection layer is selectively demetallised.
- the invention is therefore based on the object to provide a method for producing a security element with a metallized optical diffraction structure of the type described input, which is simple and flexible applicable and reproducibly generates an accurate security element.
- the optical diffraction structure is impressed on at least one structure elevation and that the selective demetallization comprises connecting at least the structure elevation having the metallized and the optical diffraction structure to a transfer carrier and subsequently separating this structure elevation connected to a transfer carrier from the carrier as well as at least one adjacent to this structure survey metallized structure recess by removing the transfer carrier from the carrier.
- the lacquer layer can be divided into comparatively sharply delimited partial areas in a procedurally simple manner due to the transition between the structure elevation and the subsequent structural recess.
- the metallization in the region of the diffraction structure can be demetallized in a highly reproducible manner in a precise and accurate position, and unwanted demetallization of the reflection layer on the structure elevations can be avoided.
- the structure supports which are connected to the transfer support and remain thereon can subsequently constitute the security element or a part thereof.
- the structure elevations connected to the transfer carrier can be subjected to further process steps, such as additional coatings, etc. for this purpose.
- the lacquer layer can be any layer based on thermoplastic polymers such as PMMA, acrylates, PVC, PU or similar materials.
- the lacquer layer may further consist of free-radically or cationically curable UV lacquers which i.a. based on polyester, PU or acrylate binders.
- the lacquer layer is applied to the carrier as a liquid or pasty lacquer and then embossed and cured, the process can be further accelerated and simplified. Due to the liquid or pasty consistency of the paint can also result in a homogeneous cohesive connection to the carrier and carried out a more uniform filling of the embossing tool, whereby the reproducibility of the process can be further increased.
- the simplicity of the process can be further enhanced if the lacquer layer is cured during the embossing, in particular polymerized. In this way, very tight and simple narrow manufacturing tolerances can be followed with respect to the embossed structure.
- the manufacturing parameters - such as Curing time, contact time with the embossing tool etc. - can be set flexibly, whereby the reproducibility can be further improved.
- the curing or polymerization of the lacquer layer can be effected by UV radiation. Irradiation by the carrier during embossing is possible, for example, with UV-transparent carrier films. However, the irradiation can also take place from the side of the embossing tool.
- the lacquer layer is embossed with a rotating stamping tool, this can further improve the continuity of the method.
- a nearly bump-free embossing of the lacquer layer can be achieved by the rotating embossing tool. A simpler and more reproducible method may result.
- a security element with particularly good security effect can be generated in a simple manner in terms of process engineering.
- the hologram can already be impressed by the embossing tool with high precision in the structure surveys, whereby additional process steps can be avoided. A method with high reproducibility can thus be created.
- the reproducibility of the method can be significantly increased if the thickness of the reflection layer is less than the embossing depth of the structure depressions.
- the reflection layers of the structure depressions and structure elevations form an overlap with one another.
- such an overlap could result in an uncontrollable breakage of the reflective layer upon separation, which can lead to blurred contours in the reflective layer on the structure surveys.
- the optical diffraction patterns embossed in the structure elevations have a lower embossing depth than the structural depressions, reliable demetallization can be achieved by separating the structure elevations from the structure depressions be guaranteed during the removal of the carrier.
- parts of the diffraction structures, in particular parts of the lacquer layer forming the structure elevations are also removed during demetallization and thus the diffraction structure is destroyed.
- a particularly reliable and reproducible method can be achieved.
- low manufacturing tolerances can be made possible.
- the selective demetallization by separating the structure elevations from the structure depressions can be considerably improved if the embossing depth of the structure depressions in the lacquer layer essentially corresponds to the lacquer layer thickness.
- This means that the bond between the structure elevations and structural depressions to be separated therefrom together with their metallization can be particularly weakened - which not only facilitates the removal of the transfer carrier, but can also ensure an exact, sharp-edged demetallization. This in particular when the structural depressions are stamped to the carrier. A particularly simple and reproducible method can result.
- Adhesion reducers in particular may prove useful in this case, the use of which leads to a lower adhesive strength between the support and the lacquer layer than between the reflection layer and the support, if the lacquer layer has been through-stamped to the support for this purpose.
- a particularly simple demetallization can be achieved and thus the reliability of the method can be further increased.
- the transfer carrier is coated with an adhesion promoter before it is joined to the structure elevations, it can be ensured that the structure elevations form a stable connection with the transfer carrier via their reflection layer. This can be an unintentional release of the structure surveys be prevented by the transfer carrier during the removal of the carrier from the security element with the transfer carrier stable. The reproducibility of the process can thus continue to increase.
- the security element is provided with a protective lacquer layer after separation from the support, this can facilitate the further treatment of the security element in the process.
- the protective lacquer layer can compensate for the unevenness created by the structural depressions and thus create a homogeneous planar surface for further processing steps.
- the protective lacquer layer can reliably protect the security element against external influences, such as oxidation of the metallic reflection layer.
- the protective lacquer layer may be a transparent lacquer layer.
- the protective lacquer layer may also be an adhesive layer in order to be able to provide the security element in a handling-friendly manner on a document of value.
- Such an adhesive layer may be, for example, a heat-sealable, cold-seal or self-adhesive coating.
- the adhesive layer may also be applied additionally with a protective lacquer layer.
- the security against forgery of the security element can additionally be increased if the security element is provided with further security features. This can be done, for example, by gluing (or laminating) the security element according to the invention with a further security element having other security features.
- the security element can be connected to a value document in a manner that are easy to handle, for example, by sticking it to the value document. Even a lamination of the same is conceivable.
- a value document may be, for example, a passport, an identity card, a driver's license, a bill, a credit card, or the like.
- a method 100 for producing a security element 1 is shown.
- a lacquer layer 3 is applied to a support 2, which lacquer layer 3 is embossed in a further step with an embossing tool 4 and subsequently hardened - hereinafter shown.
- the hardening is schematically represented by a radiation source 5, for example.
- embossing 3 structural depressions 6 and structure elevations 7 are generated in the lacquer layer.
- the lacquer layer 3 has optical diffraction structures 8 after embossing.
- the lacquer layer 3 is metallized to produce a reflection layer 9, 9 '- by the metallization, a reflection layer 9, 9' is created both on the structure depressions 6 and on the structure elevations 7.
- the metallization takes place as in Fig. 1 shown, with a common metal coating method 10.
- the reflection layer 9, 9 ' is selectively removed in the further process of the method, in particular from the structure recesses 6 of the lacquer layer 3, or demetallinstrument therewith.
- the structure elevations 7 of the lacquer layer 3, in particular a reflection layer 9, are bonded to a transfer carrier 11, as described in detail in FIG Fig. 2 can be recognized.
- the transfer carrier 11, as a new substrate of the security element 1 is brought into contact with the structure elevations 7 of the lacquer layer 3 on the carrier 2.
- a connection between the structural recesses 6 of the lacquer layer 3 and the transfer carrier 11 does not take place.
- the original carrier 2 is now removed from the security element 1 and thereby the structure elevations 7 connected to the transfer carrier 11 from the metalized structure depressions adjoining the same 6 separately.
- the structure depressions 6 continue to adhere to the original carrier 2 and are removed therefrom by the transfer carrier 11 in order to produce the security element 1.
- those regions of the reflection layer 9 'which are located in the structure depressions 6 are removed together with the carrier 2.
- the reflection layer 9 of the security element 1 is selectively demetallised on the transfer carrier 11 in the regions of the structure depressions 6, by removing the reflection layer 9 '.
- a reflection layer 9 can be produced which is exactly congruent with the structure elevations 7 of the lacquer layer 3.
- a diffraction structure 8 is embossed in at least one of these structure elevations 7 -for example by means of the embossing tool 4-an exactly congruent metallization of the diffraction structure 8 is thus achieved. Accordingly, regions between the structure elevations 7 act as see-through regions 12 through the reflection layer 9, which represent an exact security feature on the security element 1 and lead to a high security against counterfeiting.
- the lacquer layer 3 is applied in the form of a liquid or pasty lacquer 13 to the carrier 2. Due to the liquid or pasty consistency of the paint 13, the cavities 14 of the embossing tool 4 can be better filled and a more homogeneous and exact embossing can be achieved. In addition, sharply demarcated structure elevations 7 can be created.
- the lacquer layer 3 or the liquid or pasty lacquer 13 forming the lacquer layer 3 are hardened during the contact with the embossing tool 4. This can also be done in Fig. 1 be recognized.
- a radiation source 5 is shown schematically below the embossing tool 4, which hardens the lacquer layer 3 during contact with the embossing tool 4 by suitable radiation 15.
- a UV lamp is used as the radiation source 5, wherein the UV radiation 15 emitted by the lamp can polymerize the paint 13.
- the embossing tool 4 is a rotating embossing tool 4, whereby the periodicity of the embossed structure is improved and a recurring impact in the embossed structure is avoided.
- the thickness of the reflection layer 9, 9 'on the structure elevations 7 and on the structure depressions 6 is less than the embossing depth 17 of the structure depressions 6.
- the reflection layer 9, 9 ' is significantly smaller than the embossing depth 17 of the structure depressions 6, a simple detachment of the reflection layers 9' from the lacquer layer 3 during the separation can be guaranteed.
- optical diffraction structures 8 are embossed in several structure elevations.
- these diffraction structures 8 form holograms 16 which represent a security feature of the security element 1.
- the embossing depth 17 of the diffraction structures 8 or holograms 16 is advantageously, most significantly, less than the embossing depth 17 of the structure recesses 6 in the embossed lacquer layer 3.
- the subsequent separation of the structure depressions 6 are greatly facilitated by the structure elevations 7, since the remaining Lack Mrsreste 18 in the structure depressions 6 are kept as low as possible. Remaining lacquer layer residues 18 could adhere to the structure elevations 7 during separation and prevent an exact sharp-edged separation.
- the embossing depth 17 of the structure depressions 6 in the lacquer layer 3 essentially corresponds to the lacquer layer thickness 19.
- no appreciable coating layer residues 18 are formed in the structure depressions 6, and the subsequently applied reflection layer 9 can thus adhere directly to the underlying layer, for example the support 2.
- an adhesion reducer 20 is applied to the carrier 2 before the lacquer layer 3.
- the adhesion reducer 20 is advantageously designed such that the adhesive strength between the carrier 2 and the lacquer layer 3 is reduced, but the adhesive strength between the carrier 2 and the reflection layer 9 'is enhanced. This can be done during the separation, as in Fig. 2 illustrated, ensure that the reflective layer 9 'on the support 2 reliably adheres and is removed with, while the lacquer layer 3 of the structure elevations 7 remains undamaged.
- the transfer carrier 11 is also coated with a bonding agent 21, whereby the adhesion between the transfer carrier 11 and the reflective layer 9 of the structure elevations 7 is increased. A cohesive connection between the reflective layer 9, the structure elevations 7 and the transfer carrier 11 is ensured. The separation can be carried out more reliably and reproducibly.
- the security element 1 is provided after separation with a protective lacquer layer 22.
- the protective lacquer layer 22 can both serve to protect the security element 1 against external influences, as well as enable a connection of the security element 1 with further security features or value documents.
- the protective varnish 23 forming the protective varnish layer 22 can offer both a protective effect and an adhesive effect for the security element 1.
- the security element 1 can also be applied to value documents, such as banknotes, credit or bank cards, passports, identity cards, driving licenses, etc.
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- Optics & Photonics (AREA)
- Toxicology (AREA)
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
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- Credit Cards Or The Like (AREA)
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Abstract
Es wird ein Verfahren (100) zur Herstellung eines Sicherheitselements (1) mit einer metallisierten optischen Beugungsstruktur (8) in einer geprägten Lackschicht (3) gezeigt, bei dem auf einen Träger (2) eine Lackschicht (3) aufgebracht, geprägt und gehärtet wird, wobei durch das Prägen der Lackschicht (3) Strukturvertiefungen (6), Strukturerhebungen (7) und eine optische Beugungsstruktur (8) erzeugt werden, nachfolgend eine Reflexionsschicht (9, 9') an den Strukturvertiefungen (6) und Strukturerhebungen (7) der geprägten Lackschicht (3) durch Metallisierung vorgesehen und darauffolgend diese Reflexionsschicht (9, 9') selektiv demetallisiert wird. Um ein einfaches und zuverlässiges Verfahren zur Herstellung eines Sicherheitselements zu schaffen, wird vorgeschlagen, dass an mindestens einer Strukturerhebung (7) die optische Beugungsstruktur (8) eingeprägt wird und dass die selektive Demetallisierung ein Verbinden zumindest der, die metallisierte und die optische Beugungsstruktur (8) aufweisenden Strukturerhebung (7) mit einem Transferträger (11) und nachfolgend ein Trennen dieser mit einem Transferträger (11) verbundenen Strukturerhebung (7) sowohl vom Träger (2) als auch von mindestens einer an diese Strukturerhebung (7) angrenzenden metallisierten Strukturvertiefung (6) durch Abziehen des Transferträgers (11) vom Träger (2) umfasst.A method (100) for producing a security element (1) having a metallized optical diffraction structure (8) in an embossed lacquer layer (3) is shown, in which a lacquer layer (3) is applied, embossed and cured on a support (2) , wherein by embossing the lacquer layer (3) structure depressions (6), structure elevations (7) and an optical diffraction structure (8) are produced, subsequently a reflection layer (9, 9 ') on the structure recesses (6) and structure elevations (7) of embossed lacquer layer (3) provided by metallization and subsequently this reflection layer (9, 9 ') is selectively demetallisiert. In order to provide a simple and reliable method for producing a security element, it is proposed that the optical diffraction structure (8) is embossed on at least one structure elevation (7) and that the selective demetallization comprises joining at least the metallized and the optical diffraction structure (8 7) with a transfer carrier (11) and subsequently a separation of said structure elevation (7) connected to a transfer carrier (11) both from the carrier (2) and from at least one metallized structure depression (6) adjoining this structure elevation (7) ) by removing the transfer carrier (11) from the carrier (2).
Description
Die Erfindung betrifft ein Verfahren zur Herstellung eines Sicherheitselements mit einer metallisierten optischen Beugungsstruktur in einer geprägten Lackschicht, bei dem auf einen Träger eine Lackschicht aufgebracht, geprägt und gehärtet wird, wobei durch das Prägen der Lackschicht Strukturvertiefungen, Strukturerhebungen und eine optische Beugungsstruktur erzeugt werden, nachfolgend eine Reflexionsschicht an den Strukturvertiefungen und Strukturerhebungen der geprägten Lackschicht durch Metallisierung vorgesehen und darauffolgend diese Reflexionsschicht selektiv demetallisiert wird.The invention relates to a method for producing a security element having a metallized optical diffraction structure in an embossed lacquer layer in which a lacquer layer is applied, embossed and cured on a support, structural embossings, structure elevations and an optical diffraction structure being produced by embossing the lacquer layer, hereinafter a reflection layer is provided on the structure depressions and structure elevations of the embossed lacquer layer by metallization, and subsequently this reflection layer is selectively demetallised.
Zur selektiven Demetallisierung von metallischen Reflexionsschichten zur Herstellung von Sicherheitselementen ist es bekannt (
Die Erfindung hat sich daher die Aufgabe gestellt, ein Verfahren zur Herstellung eines Sicherheitselements mit einer metallisierten optischen Beugungsstruktur der Eingangs geschilderten Art zu schaffen, das einfach und flexibel anwendbar ist und reproduzierbar ein genaues Sicherheitselement erzeugt.The invention is therefore based on the object to provide a method for producing a security element with a metallized optical diffraction structure of the type described input, which is simple and flexible applicable and reproducibly generates an accurate security element.
Die Erfindung löst die gestellte Aufgabe dadurch, dass an mindestens einer Strukturerhebung die optische Beugungsstruktur eingeprägt wird und dass die selektive Demetallisierung ein Verbinden zumindest der, die metallisierte und die optische Beugungsstruktur aufweisenden Strukturerhebung mit einem Transferträger und nachfolgend ein Trennen dieser mit einem Transferträger verbundenen Strukturerhebung sowohl vom Träger als auch von mindestens einer an diese Strukturerhebung angrenzenden metallisierten Strukturvertiefung durch Abziehen des Transferträgers vom Träger umfasst.The invention achieves the stated object in that the optical diffraction structure is impressed on at least one structure elevation and that the selective demetallization comprises connecting at least the structure elevation having the metallized and the optical diffraction structure to a transfer carrier and subsequently separating this structure elevation connected to a transfer carrier from the carrier as well as at least one adjacent to this structure survey metallized structure recess by removing the transfer carrier from the carrier.
Wird an mindestens einer Strukturerhebung der Lackschicht die optische Beugungsstruktur eingeprägt, kann die Lackschicht auf verfahrenstechnische einfache Weise aufgrund des Übergangs zwischen der Strukturerhebung und der daran anschließenden Strukturvertiefung in vergleichsweise scharf abgegrenzte Teilbereiche aufgeteilt werden. Damit kann auch eine anschließende selektive Demetallisierung der metallisierten geprägten Lackschicht bzw. eine Demetallisierung eines Teilbereichs an der metallisierten geprägten Lackschicht erleichtert werden, wenn diese selektive Demetallisierung ein Verbinden zumindest der, die metallisierte und die optische Beugungsstruktur aufweisenden Strukturerhebung mit einem Transferträger und nachfolgend ein Trennen dieser mit einem Transferträger verbundenen Strukturerhebung sowohl vom Träger als auch von mindestens einer an diese Strukturerhebung angrenzenden metallisierten Strukturvertiefung durch Abziehen des Transferträgers vom Träger umfasst. Erfindungsgemäß kann so höchst reproduzierbar die Metallisierung im Bereich der Beugungsstruktur präzise und positionsgenau demetallisiert und eine ungewollte Demetallisierung der Reflexionsschicht an den Strukturerhebungen vermieden werden. Beispielsweise können dadurch an die Beugungsstruktur exakt anschließende Durchsichtsbereiche, Ausschnitte, Unterbrechungen, Freistellungen etc. am Sicherheitselement geschaffen werden, was dessen Fälschungssicherheit erheblich erhöhen kann. Zudem kann damit eine mit den Strukturerhebungen deckungsgleiche Reflexionsschicht geschaffen werden - insbesondere eine Reflexionsschicht, die mit der optischen Beugungsstruktur an der Strukturerhebung deckungsgleich ist. Ein äußerst reproduzierbares aber dennoch kostengünstiges Verfahren zur Herstellung eines fälschungssicheren Sicherheitselements kann demnach geschaffen werden.If the optical diffraction structure is embossed on at least one structure elevation of the lacquer layer, the lacquer layer can be divided into comparatively sharply delimited partial areas in a procedurally simple manner due to the transition between the structure elevation and the subsequent structural recess. In this way, a subsequent selective demetallization of the metallized embossed lacquer layer or demetallization of a partial region on the metallized embossed lacquer layer can be facilitated, if this selective demetallization involves joining at least the structure elevation comprising the metallized and the optical diffraction structure to a transfer carrier and subsequently separating the latter comprising a transfer structure connected to a transfer carrier, both from the carrier and from at least one metallized structure depression adjoining this structure elevation by removing the transfer carrier from the carrier. In accordance with the invention, the metallization in the region of the diffraction structure can be demetallized in a highly reproducible manner in a precise and accurate position, and unwanted demetallization of the reflection layer on the structure elevations can be avoided. For example, by the Diffraction structure exactly subsequent viewing areas, cutouts, interruptions, exemptions, etc. are created on the security element, which can significantly increase its security against counterfeiting. In addition, it is thus possible to create a reflection layer congruent with the structure elevations - in particular a reflection layer that is congruent with the optical diffraction structure at the structure elevation. An extremely reproducible but nevertheless cost-effective method for producing a tamper-proof security element can accordingly be created.
Im Allgemeinen wird erwähnt, dass die mit dem Transferträger verbundenen und auf diesem verbleibenden Strukturerhebungen in weiterer Folge das Sicherheitselement bzw. einen Teil davon darstellen können. Die mit dem Transferträger verbundenen Strukturerhebungen können hierfür noch weiteren Verfahrensschritte, wie etwa zusätzlichen Beschichtungen etc., unterworfen werden. Im Allgemeinen wird weiter festgehalten, dass die Lackschicht jede Schicht darstellen kann, die auf thermoplastischen Polymeren, wie beispielsweise PMMA, Acrylaten, PVC, PU oder ähnlichen Materialen basiert. Die Lackschicht kann weiter aus radikalisch oder kationisch härtenden UV-Lacken bestehen, die u.a. auf Polyester-, PU- oder Acrylat-Bindemitteln basieren.In general, it is mentioned that the structure supports which are connected to the transfer support and remain thereon can subsequently constitute the security element or a part thereof. The structure elevations connected to the transfer carrier can be subjected to further process steps, such as additional coatings, etc. for this purpose. In general, it is further noted that the lacquer layer can be any layer based on thermoplastic polymers such as PMMA, acrylates, PVC, PU or similar materials. The lacquer layer may further consist of free-radically or cationically curable UV lacquers which i.a. based on polyester, PU or acrylate binders.
Wird zudem die Lackschicht als flüssiger oder pastöser Lack auf den Träger aufgebracht und anschließend geprägt und gehärtet, kann das Verfahren weiter beschleunigt und vereinfacht werden. Durch die flüssige oder pastöse Konsistenz des Lacks kann sich zudem eine homogene stoffschlüssige Verbindung zum Träger ergeben und eine gleichmäßigere Ausfüllung des Prägewerkzeugs erfolgen, wodurch die Reproduzierbarkeit des Verfahrens weiter erhöht werden kann.If, in addition, the lacquer layer is applied to the carrier as a liquid or pasty lacquer and then embossed and cured, the process can be further accelerated and simplified. Due to the liquid or pasty consistency of the paint can also result in a homogeneous cohesive connection to the carrier and carried out a more uniform filling of the embossing tool, whereby the reproducibility of the process can be further increased.
Die Einfachheit des Verfahrens kann weiter gesteigert werden, wenn die Lackschicht während des Prägens gehärtet, insbesondere polymerisiert, wird. Auf diese Weise kann besonders schnell und einfach engen Fertigungstoleranzen in Bezug auf die Prägestruktur gefolgt werden. Zudem können die Fertigungsparameter - wie Aushärtedauer, Kontaktzeit mit dem Prägewerkzeug etc. - flexibel eingestellt werden, wodurch die Reproduzierbarkeit weiter verbessert werden kann. Im Allgemeinen wird festgehalten, dass die Härtung bzw. Polymerisation der Lackschicht durch UV-Strahlung erfolgen kann. Eine Bestrahlung durch den Träger während des Prägens ist beispielsweise bei UV-transparenten Trägerfolien möglich. Die Bestrahlung kann jedoch auch von der Seite des Prägewerkzeugs her erfolgen.The simplicity of the process can be further enhanced if the lacquer layer is cured during the embossing, in particular polymerized. In this way, very tight and simple narrow manufacturing tolerances can be followed with respect to the embossed structure. In addition, the manufacturing parameters - such as Curing time, contact time with the embossing tool etc. - can be set flexibly, whereby the reproducibility can be further improved. In general, it is stated that the curing or polymerization of the lacquer layer can be effected by UV radiation. Irradiation by the carrier during embossing is possible, for example, with UV-transparent carrier films. However, the irradiation can also take place from the side of the embossing tool.
Wird die Lackschicht mit einem rotierenden Prägewerkzeug geprägt, so kann dies die Kontinuität des Verfahrens weiter verbessern. Zudem kann durch das rotierende Prägewerkzeug eine nahezu stoßfreie Prägung der Lackschicht erreicht werden. Ein einfacheres und reproduzierbareres Verfahren kann sich dadurch ergeben.If the lacquer layer is embossed with a rotating stamping tool, this can further improve the continuity of the method. In addition, a nearly bump-free embossing of the lacquer layer can be achieved by the rotating embossing tool. A simpler and more reproducible method may result.
Bildet mindestens eine, in eine Strukturerhebung eingeprägte Beugungsstruktur ein Hologramm aus, so kann auf verfahrenstechnisch einfache Weise ein Sicherheitselement mit besonders guter Sicherheitswirkung erzeugt werden. Das Hologramm kann hierbei bereits durch das Prägewerkzeug mit hoher Präzision in die Strukturerhebungen eingeprägt werden, wodurch zusätzliche Verfahrensschritte vermeidbar sind. Ein Verfahren mit hoher Reproduzierbarkeit kann somit geschaffen werden.If at least one diffraction structure embossed into a structure elevation forms a hologram, a security element with particularly good security effect can be generated in a simple manner in terms of process engineering. The hologram can already be impressed by the embossing tool with high precision in the structure surveys, whereby additional process steps can be avoided. A method with high reproducibility can thus be created.
Die Reproduzierbarkeit des Verfahrens kann deutlich erhöht werden, wenn die Dicke der Reflexionsschicht geringer als die Prägetiefe der Strukturvertiefungen ist. So kann zuverlässig vermieden werden, dass die Reflexionsschichten der Strukturvertiefungen und Strukturerhebungen zueinander einen Überlapp ausbilden. Unter anderem könnte ein solcher Überlapp beim Trennen zu einem unkontrollierbaren Bruch der Reflexionsschicht führen, was zu unscharfen Konturen in der Reflexionsschicht auf den Strukturerhebungen führen kann.The reproducibility of the method can be significantly increased if the thickness of the reflection layer is less than the embossing depth of the structure depressions. Thus, it can be reliably avoided that the reflection layers of the structure depressions and structure elevations form an overlap with one another. Among other things, such an overlap could result in an uncontrollable breakage of the reflective layer upon separation, which can lead to blurred contours in the reflective layer on the structure surveys.
Weisen die in den Strukturerhebungen eingeprägten optischen Beugungsstrukturen eine geringere Prägetiefe als die Strukturvertiefungen auf, so kann eine zuverlässige Demetallisierung durch Trennung der Strukturerhebungen von den Strukturvertiefungen während des Abziehens des Trägers gewährleistet werden. So ist zudem zuverlässig vermeidbar, dass Teile der Beugungsstrukturen, insbesondere Teile der die Strukturerhebungen ausbildenden Lackschicht, bei der Demetallisierung mitabgezogen werden und somit die Beugungsstruktur zerstört wird. Ein besonders zuverlässiges und reproduzierbares Verfahren kann dadurch erreicht werden. Zudem können geringe Fertigungstoleranzen ermöglicht werden.If the optical diffraction patterns embossed in the structure elevations have a lower embossing depth than the structural depressions, reliable demetallization can be achieved by separating the structure elevations from the structure depressions be guaranteed during the removal of the carrier. Thus, it is also reliably avoidable that parts of the diffraction structures, in particular parts of the lacquer layer forming the structure elevations, are also removed during demetallization and thus the diffraction structure is destroyed. A particularly reliable and reproducible method can be achieved. In addition, low manufacturing tolerances can be made possible.
Die selektive Demetallisierung durch Trennen der Strukturerhebungen von den Strukturvertiefungen kann erheblich verbessert werden, wenn die Prägetiefe der Strukturvertiefungen in der Lackschicht im Wesentlichen der Lackschichtdicke entspricht. Damit kann nämlich der Verbund zwischen Strukturerhebungen und davon abzutrennenden Strukturvertiefungen mitsamt deren Metallisierung besonders geschwächt werden - was nicht nur das Abziehen des Transferträgers erleichtern, sondern auch eine exakte, scharfkantige Demetallisierung gewährleisten kann. Dies insbesondere wenn die Strukturvertiefungen bis zum Träger durchgeprägt werden. Ein besonders einfaches und reproduzierbares Verfahren kann sich dadurch ergeben.The selective demetallization by separating the structure elevations from the structure depressions can be considerably improved if the embossing depth of the structure depressions in the lacquer layer essentially corresponds to the lacquer layer thickness. This means that the bond between the structure elevations and structural depressions to be separated therefrom together with their metallization can be particularly weakened - which not only facilitates the removal of the transfer carrier, but can also ensure an exact, sharp-edged demetallization. This in particular when the structural depressions are stamped to the carrier. A particularly simple and reproducible method can result.
Wird vor der Lackschicht ein Haftverminderer auf den Träger aufgebracht, so kann das Trennen der Strukturerhebungen von den Strukturvertiefungen weiter erleichtert werden. Insbesondere können sich hierbei Haftverminderer bewähren, deren Verwendung zu einer geringeren Haftfestigkeit zwischen Träger und Lackschicht als zwischen Reflexionsschicht und Träger führt, wenn hierfür die Lackschicht bis zum Träger durchgeprägt worden ist. Eine besonders einfache Demetallisierung kann dadurch erreicht und damit die Zuverlässigkeit des Verfahrens weiter erhöht werden.If an adhesion reducing agent is applied to the carrier before the lacquer layer, the separation of the structure elevations from the structural depressions can be further facilitated. Adhesion reducers in particular may prove useful in this case, the use of which leads to a lower adhesive strength between the support and the lacquer layer than between the reflection layer and the support, if the lacquer layer has been through-stamped to the support for this purpose. A particularly simple demetallization can be achieved and thus the reliability of the method can be further increased.
Wird zudem der Transferträger, vor dem Verbinden mit den Strukturerhebungen, mit einem Haftvermittler beschichtet, so kann gewährleistet werden, dass die Strukturerhebungen über ihre Reflexionsschicht eine standfeste Verbindung mit dem Transferträger eingehen. So kann ein ungewolltes Lösen der Strukturerhebungen vom Transferträger während des Abziehens des Trägers vom Sicherheitselement mit dem Transferträger standfest verhindert werden. Die Reproduzierbarkeit des Verfahrens kann sich damit weiter erhöhen.If, in addition, the transfer carrier is coated with an adhesion promoter before it is joined to the structure elevations, it can be ensured that the structure elevations form a stable connection with the transfer carrier via their reflection layer. This can be an unintentional release of the structure surveys be prevented by the transfer carrier during the removal of the carrier from the security element with the transfer carrier stable. The reproducibility of the process can thus continue to increase.
Wird das Sicherheitselement nach dem Trennen vom Träger mit einer Schutzlackschicht versehen, kann dies die Weiterbehandlung des Sicherheitselements im Verfahren erleichtern. Die Schutzlackschicht kann hierbei zudem die durch die Strukturvertiefungen entstandenen Unebenheiten ausgleichen und so eine homogene ebene Oberfläche für weitere Bearbeitungsschritte schaffen. Zudem kann die Schutzlackschicht das Sicherheitselement zuverlässig vor äußeren Einflüssen, wie etwa Oxidation der metallischen Reflexionsschicht, schützen. Beispielsweise kann es sich bei der Schutzlackschicht um eine transparente Lackschicht handeln. Es ist ebenfalls vorstellbar, dass die Schutzlackschicht auch eine Klebstoffschicht sein kann, um das Sicherheitselement handhabungsfreundlich auf einem Wertdokument vorsehen zu können. Eine solche Klebstoffschicht kann beispielsweise eine Heißsiegel-, Kaltsiegel- oder Selbstklebebeschichtung sein. Die Klebstoffschicht kann ebenfalls zusätzlich mit einer Schutzlackschicht aufgebracht sein.If the security element is provided with a protective lacquer layer after separation from the support, this can facilitate the further treatment of the security element in the process. In addition, the protective lacquer layer can compensate for the unevenness created by the structural depressions and thus create a homogeneous planar surface for further processing steps. In addition, the protective lacquer layer can reliably protect the security element against external influences, such as oxidation of the metallic reflection layer. For example, the protective lacquer layer may be a transparent lacquer layer. It is also conceivable that the protective lacquer layer may also be an adhesive layer in order to be able to provide the security element in a handling-friendly manner on a document of value. Such an adhesive layer may be, for example, a heat-sealable, cold-seal or self-adhesive coating. The adhesive layer may also be applied additionally with a protective lacquer layer.
Die Fälschungssicherheit des Sicherheitselements kann zusätzlich erhöht werden, wenn das Sicherheitselement mit weiteren Sicherheitsmerkmalen versehen wird. Dies kann beispielsweise durch Verkleben (oder Aufkaschieren) des erfindungsgemäßen Sicherheitselements mit einem weiteren, andere Sicherheitsmerkmale aufweisenden Sicherheitselements erfolgen.The security against forgery of the security element can additionally be increased if the security element is provided with further security features. This can be done, for example, by gluing (or laminating) the security element according to the invention with a further security element having other security features.
Das Sicherheitselement kann handhabungsfreundlich mit einem Wertdokument verbunden werden, indem dieses beispielsweise mit dem Wertdokument verklebt wird. Auch ein Auflaminieren desselben ist vorstellbar. Im Allgemeinen wird festgehalten, dass ein Wertdokument beispielsweise ein Reisepass, ein Personalausweis, ein Führerschein, eine Banknote, eine Kreditkarte oder Ähnliches sein kann.The security element can be connected to a value document in a manner that are easy to handle, for example, by sticking it to the value document. Even a lamination of the same is conceivable. In general, it is noted that a value document may be, for example, a passport, an identity card, a driver's license, a bill, a credit card, or the like.
In den Figuren ist beispielsweise der Erfindungsgegenstand anhand einer Ausführungsvariante näher dargestellt. Es zeigen:
-
Fig. 1 eine schematische Darstellung des erfindungsgemäßen Verfahrens, -
Fig. 2 einen Detailausschnitt des Trennvorgangs des Verfahrens ausFig. 1 , und -
Fig. 3 einen Detailausschnitt des Prägevorgangs des Verfahrens ausFig. 1 .
-
Fig. 1 a schematic representation of the method according to the invention, -
Fig. 2 a detail of the separation process of the methodFig. 1 , and -
Fig. 3 a detail of the embossing process of the methodFig. 1 ,
Gemäß
Erfindungsgemäß werden zur selektiven Demetallisierung der Reflexionsschicht 9, 9' die, insbesondere eine Reflexionsschicht 9 aufweisenden Strukturerhebungen 7 der Lackschicht 3 mit einem Transferträger 11 stoffschlüssig verbunden, wie dies im Detail in
Wie in
Vorteilhaft ist die Dicke der Reflexionsschicht 9, 9' an den Strukturerhebungen 7 und an den Strukturvertiefungen 6 geringer als die Prägetiefe 17 der Strukturvertiefungen 6. Dadurch wird ein Überlapp der Reflexionsschicht 9 und der Reflexionsschicht 9' vermieden, der ein starkes Zusammenhalten der metallischen Reflexionsschichten 9, 9' bedingen würde. Ist die Reflexionsschicht 9, 9' jedoch deutlich geringer als die Prägetiefe 17 der Strukturvertiefungen 6, so kann eine einfache Ablösung der Reflexionsschichten 9' aus der Lackschicht 3 während des Trennens garantiert werden.Advantageously, the thickness of the
Aus der Detailansicht in
Um die Trennung der Strukturerhebungen 7 von den Strukturvertiefungen 6 zu erleichtern, wird vor der Lackschicht 3 ein Haftverminderer 20 auf den Träger 2 aufgebracht. Vorteilhaft ist der Haftverminderer 20 derart ausgestaltet, dass die Haftfestigkeit zwischen dem Träger 2 und der Lackschicht 3 vermindert, jedoch die Haftfestigkeit zwischen dem Träger 2 und der Reflexionsschicht 9' verstärkt wird. Dadurch kann während des Trennens, wie in
Der Transferträger 11 ist zudem mit einem Haftvermittler 21 beschichtet, wodurch die Haftfestigkeit zwischen dem Transferträger 11 und der Reflexionsschicht 9 der Strukturerhebungen 7 erhöht wird. Eine stoffschlüssige Verbindung zwischen der Reflexionsschicht 9, der Strukturerhebungen 7 und dem Transferträger 11 wird dabei sichergestellt. Das Trennen kann dadurch zuverlässiger und reproduzierbarer durchgeführt werden.The
Wie in
Weitere Sicherheitsmerkmale, mit denen das Sicherheitselement 1 verbunden werden kann, sind etwa Hologramme, lumineszierende Schichten, Metallstreifen, Schichten mit Kippeffekten oder Vergleichbares. Das Sicherheitselement 1 kann ebenso auf Wertdokumente, wie Banknoten, Kredit- oder Bankkarten, Reisepässe, Personalausweise, Führerscheine etc., aufgebracht werden.Further security features with which the
Claims (13)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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EP15188216.4A EP3150400A1 (en) | 2015-10-02 | 2015-10-02 | Method for manufacturing a safety element |
PCT/EP2016/073582 WO2017055634A1 (en) | 2015-10-02 | 2016-10-03 | Method for producing a security element |
US15/765,366 US10618339B2 (en) | 2015-10-02 | 2016-10-03 | Method for producing a security element |
EP16787740.6A EP3356158B1 (en) | 2015-10-02 | 2016-10-03 | Method for producing a security element |
JP2018517259A JP7025323B2 (en) | 2015-10-02 | 2016-10-03 | How to make security components |
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EP15188216.4A EP3150400A1 (en) | 2015-10-02 | 2015-10-02 | Method for manufacturing a safety element |
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EP15188216.4A Withdrawn EP3150400A1 (en) | 2015-10-02 | 2015-10-02 | Method for manufacturing a safety element |
EP16787740.6A Active EP3356158B1 (en) | 2015-10-02 | 2016-10-03 | Method for producing a security element |
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US (1) | US10618339B2 (en) |
EP (2) | EP3150400A1 (en) |
JP (1) | JP7025323B2 (en) |
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MA42906A (en) * | 2015-07-10 | 2018-05-16 | De La Rue Int Ltd | METHOD OF MANUFACTURING A PATTERN IN OR ON A SUPPORT |
TW202005776A (en) * | 2018-03-28 | 2020-02-01 | 德商巴斯夫塗料有限責任公司 | Method for transferring an embossed structure to the surface of a coating composition, and composite employable as embossing die |
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EP1843901B1 (en) | 2005-01-27 | 2014-01-08 | Giesecke & Devrient GmbH | Security element and method for the production thereof |
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DE2853953A1 (en) * | 1978-12-14 | 1980-07-03 | Hoechst Ag | IDENTIFICATION CARD |
JP3355308B2 (en) | 1998-08-26 | 2002-12-09 | 大日本印刷株式会社 | Photocurable resin composition and method for forming uneven pattern |
US6344495B1 (en) * | 1998-07-31 | 2002-02-05 | Dai Nippon Printing Co., Ltd. | Photo-curable resin composition and method for forming concave-convex pattern |
US7420005B2 (en) | 2001-06-28 | 2008-09-02 | Dai Nippon Printing Co., Ltd. | Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern |
JP4015471B2 (en) | 2001-06-28 | 2007-11-28 | 大日本印刷株式会社 | Photocurable resin composition, fine uneven pattern transfer foil, optical article, stamper, and method for forming fine uneven pattern |
US6909444B2 (en) | 2002-09-09 | 2005-06-21 | Dai Nippon Printing Co., Ltd. | Transfer ribbon, image expressing medium and method for production of them |
JP2004101834A (en) | 2002-09-09 | 2004-04-02 | Dainippon Printing Co Ltd | Image display medium and manufacturing method therefor |
FI122671B (en) * | 2005-03-09 | 2012-05-15 | M Real Oyj | Method of manufacturing a visually identifiable pattern on a substrate |
US20080047930A1 (en) | 2006-08-23 | 2008-02-28 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate |
DE102007039996B4 (en) | 2007-02-07 | 2020-09-24 | Leonhard Kurz Stiftung & Co. Kg | Security element for a security document and method for its production |
DE102007005884B4 (en) | 2007-02-07 | 2022-02-03 | Leonhard Kurz Stiftung & Co. Kg | security document |
DE102008017652A1 (en) | 2008-04-04 | 2009-10-08 | Leonhard Kurz Stiftung & Co. Kg | Security element and method for producing a security element |
JP5126522B2 (en) | 2008-06-11 | 2013-01-23 | 大日本印刷株式会社 | Method for manufacturing hologram self-adhesive label, hologram self-adhesive label, and medium with hologram |
DE102010019766A1 (en) | 2010-05-07 | 2011-11-10 | Giesecke & Devrient Gmbh | Method for producing a microstructure on a support |
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2015
- 2015-10-02 EP EP15188216.4A patent/EP3150400A1/en not_active Withdrawn
-
2016
- 2016-10-03 JP JP2018517259A patent/JP7025323B2/en active Active
- 2016-10-03 WO PCT/EP2016/073582 patent/WO2017055634A1/en active Application Filing
- 2016-10-03 US US15/765,366 patent/US10618339B2/en not_active Expired - Fee Related
- 2016-10-03 EP EP16787740.6A patent/EP3356158B1/en active Active
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EP0563992A2 (en) * | 1992-04-03 | 1993-10-06 | GAO Gesellschaft für Automation und Organisation mbH | Method and apparatus for the manufacture of metallic surface layers on substrates |
DE4404128A1 (en) * | 1993-02-19 | 1994-08-25 | Gao Ges Automation Org | Security document and method for its manufacture |
EP1843901B1 (en) | 2005-01-27 | 2014-01-08 | Giesecke & Devrient GmbH | Security element and method for the production thereof |
DE102008008685A1 (en) * | 2008-02-12 | 2009-08-13 | Giesecke & Devrient Gmbh | Security element and method for its production |
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US20180304670A1 (en) | 2018-10-25 |
EP3356158A1 (en) | 2018-08-08 |
JP7025323B2 (en) | 2022-02-24 |
JP2018533758A (en) | 2018-11-15 |
US10618339B2 (en) | 2020-04-14 |
WO2017055634A1 (en) | 2017-04-06 |
EP3356158B1 (en) | 2019-08-14 |
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