EP0499237A2 - Microphone capacitif à élöctret et methode d'assemblage - Google Patents

Microphone capacitif à élöctret et methode d'assemblage Download PDF

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Publication number
EP0499237A2
EP0499237A2 EP92102344A EP92102344A EP0499237A2 EP 0499237 A2 EP0499237 A2 EP 0499237A2 EP 92102344 A EP92102344 A EP 92102344A EP 92102344 A EP92102344 A EP 92102344A EP 0499237 A2 EP0499237 A2 EP 0499237A2
Authority
EP
European Patent Office
Prior art keywords
metal gate
diaphragm
gate ring
ring
capacitor microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92102344A
Other languages
German (de)
English (en)
Other versions
EP0499237A3 (en
EP0499237B1 (fr
Inventor
Hiroyuki Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0499237A2 publication Critical patent/EP0499237A2/fr
Publication of EP0499237A3 publication Critical patent/EP0499237A3/en
Application granted granted Critical
Publication of EP0499237B1 publication Critical patent/EP0499237B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones

Definitions

  • the present invention relates to an electret capacitor microphone (hereinafter referred to as an "ECM”) and, particularly, to an ECM capable of being assembled by an automatic assembly machine.
  • ECM electret capacitor microphone
  • a conventional ECM has a bottomed cylindrical metal casing, and a bottomed cylindrical insulator telescoped into the metal casing.
  • a diaphragm (electret member), having a metallized foil on one surface thereof, and a backplate are disposed between a bottom of the metal casing and an opening end of the insulator with a predetermined gap between the diaphragm and the backplate.
  • a printed circuit board is mounted on an exposed bottom surface of the cylindrical insulator.
  • a field effect transistor (FET) for impedance conversion is disposed in a space within the cylindrical insulator. The FET has an input lead and an output lead, which are respectively connected to the backplate and an electrode on the printed circuit board.
  • the backplate, the insulator, the FET and the printed circuit board are pre-assembled together into an amplifier block.
  • the diaphragm is disposed inside the metal casing.
  • the amplifier block is inserted into the metal casing, and a portion at the opening end of the metal casing is caulked, thereby completing the assembly.
  • the construction of the conventional ECM is complicated throughout the apparatus, in particular, in the amplifier block.
  • the amplifier block requires to be pre-assembled.
  • the conventional ECM has a problem in that the apparatus is not suitable for assembly by an automatic assembly machine.
  • the conventional ECM also has the following drawback.
  • the various component parts of the ECM are fixed in place by caulking a portion of the cylindrical metal casing, and the component parts include an insulator which is generally molded from a resin.
  • the use of a resin product is disadvantageous in terms of thermal resistance. For instance, where the output lead of the FET is connected to another printed circuit board by a solder dip or the like, the resin insulator may be collapsed or melted due to heat generated during the solder dipping. This involves the risk of the caulked portion becoming loose, resulting in the product quality being deteriorated.
  • the present invention has an object to eliminate the above-described disadvantages.
  • the present invention is particularly directed to providing an ECM which can be assembled by an automatic assembly machine.
  • an ECM includes a bottomed cylindrical metal casing 1 having a sound hole 1a formed in a bottom thereof, a diaphragm clamping metal ring 2 disposed on an inner side of the bottom of the metal casing 1, a diaphragm 3 (serving as an electret member) having a metallized foil 3a on one surface thereof attached to the metal ring 2 by an adhesive or other suitable means, a gap spacer 4 and a backplate 5 having a through-hole 5a located on the other surface of the diaphragm 3 through the gap spacer 4.
  • An air layer 10 is defined between the backplate 5 and the diaphragm 3.
  • the ECM further includes a cylindrical metal gate ring 12 supporting the backplate 5.
  • the metal gate ring 12 is electrically connected with the backplate 5 by contacting or welding to it.
  • a plurality of recesses 12a are formed at an end portion of the metal gate ring 12.
  • the metal gate ring 12 can be easily formed by, for example, rounding stamped flat sheet, as shown in Fig. 3.
  • An insulator 11 is disposed to insulate the backplate 5 and the metal gate ring 12 from the surroundings as well as to house therein these members so as to place them in appropriate positions. The insulator 11 is held in place by, for example, press-fitting it onto the backplate 5 or the metal gate ring 12.
  • An FET 7 for impedance conversion is directly mounted on a printed circuit board 8 and positioned within the metal gate ring 12.
  • An input lead 7a of the FET 7 is interposed between the recess 12a of the metal gate ring 12 and a surface of the printed circuit board 8 so as to allow electrical conduction through these members, and hence to be electrically connected with the backplate 5.
  • An output lead 7b of the FET 7 is electrically connected with an electrode on the printed circuit board 8 by a solder 8a provided by dipping.
  • the component parts of the ECM, described above, are integrally fixed in place by caulking an opening end portion of the cylindrical metal casing 1, as indicated by reference numeral lb.
  • a cloth 9 covers the sound hole 1a to prevent penetration of dust. Without the cloth 9, however, there would be no particular hindrance to the operation of the ECM.
  • an amplifier block is prepared in advance, which consists of a first and a second assembly sub-blocks 21 and 22.
  • the first sub-block 21 comprises the backplate 5, the metal gate ring 12 and the insulator 11.
  • the second assembly sub-block 20 comprises the FET 7 and the printed circuit board 8.
  • the metal ring 2 to which the diaphragm 3 is partially fixed, the gap spacer 4, the first assembly sub-block 21, and the second assembly sub-block 20 are successively inserted. Thereafter, an end portion lb of the cylindrical metal casing 1 is caulked, thereby completing the assembly.
  • the air layer 10 has a capacitance of about several pF to 10s pF. Sound waves from the outside of the ECM pass through the sound hole 1a, and cause the diaphragm 3 to vibrate, thereby causing slight changes in the above capacitance. The changes in the capacitance are transformed by means of the FET 7 to changes in an electrical output.
  • This embodiment has an excellent advantage in that the entire apparatus can be assembled by an automatic assembly machine, the advantage being helped by the very simple constructions of the individual assembly sub-blocks 20 and 21.
  • Another advantage is that, even when the application of heat during solder dipping or the like has caused the insulator 11 to partially melt, this does not cause any adverse influence on the settling portion or the caulked end portion 1b, hence, no adverse influence on the settling of the components of the apparatus, thereby making it possible to avoid deterioration in the product quality, such as loose settling of the components.
  • the conventional ECM (shown in Fig. 8) is assembled in the manner shown in Fig. 9.
  • a backplate 5, an insulator 6, an FET 7 and a printed circuit board 8 are previously assembled together into an amplifier block.
  • a metal ring 2 to which a diaphragm 3 is attached, a gap spacer 4, and the amplifier block are successively inserted into a cylindrical metal casing 1 with a cloth 9 attached thereto.
  • an end portion 1b of the cylindrical metal casing 1 is caulked, thereby assembling the components into an integral construction.
  • the amplifier block is complicated, and further required to be pre-assembled.
  • the construction of the conventional ECM is not suitable for performing a fully automatized assembly operation.
  • a metal gate ring 13 is, as shown in Fig. 6, an annular metal gate ring having no recess.
  • the second embodiment further includes a dual-lead type FET 14 and a printed circuit board 15 having patterns on both surfaces thereof.
  • an input lead 14a of the FET 14 is connected with an inner printed circuit pattern 15c by soldering or the like, and connected with the metal gate ring 13 via the inner printed circuit pattern 15c.
  • An output lead 14b of the FET 14 is connected with another inner printed circuit pattern 15d by soldering, and connected with an outer printed circuit pattern 15e via the inner printed circuit pattern 15d, a through hole 15b and a soldered portion 15a.
  • the soldered portion 15a also serves to close the through hole 15b.
  • the FET 14 is fixed to the printed circuit board 15 by an adhesive 16.
  • the adhesive 16 may be also used to close the through hole 15b, instead of the soldered portion 15a.
  • assembly can be performed in a manner similar to that in the first embodiment, and operation and advantages similar to those of the first embodiment are provided.
  • a third embodiment of the present invention is distinguished in that a metal pin lead 17 with a flange passes through a through hole 15b of a printed circuit board 15.
  • the metal pin lead 17 is connected with an outer printed circuit pattern 15e via a soldered portion 15a.
  • the third embodiment constitutes an ECM known as a legged type ECM.
  • the apparatus according to the third embodiment also enables assembly similar to those in the first and the second embodiments, and provides similar operation and advantages.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Telephone Set Structure (AREA)
EP19920102344 1991-02-12 1992-02-12 Microphone capacitif à élöctret et methode d'assemblage Expired - Lifetime EP0499237B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1860791A JPH04257200A (ja) 1991-02-12 1991-02-12 エレクトレットコンデンサマイクロホン
JP18607/91 1991-02-12

Publications (3)

Publication Number Publication Date
EP0499237A2 true EP0499237A2 (fr) 1992-08-19
EP0499237A3 EP0499237A3 (en) 1993-10-20
EP0499237B1 EP0499237B1 (fr) 1995-05-10

Family

ID=11976331

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19920102344 Expired - Lifetime EP0499237B1 (fr) 1991-02-12 1992-02-12 Microphone capacitif à élöctret et methode d'assemblage

Country Status (4)

Country Link
EP (1) EP0499237B1 (fr)
JP (1) JPH04257200A (fr)
CA (1) CA2060542C (fr)
DE (1) DE69202352T2 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002880C2 (nl) * 1996-04-16 1997-10-17 Microtronic Nederland Bv Elektroakoestische transducent.
EP1257150A2 (fr) 2001-05-10 2002-11-13 Matsushita Electric Industrial Co., Ltd. Microphone capacitif à électret et procédé pour sa fabrication
EP1298958A2 (fr) * 2001-09-28 2003-04-02 Sonion Microtronic Nederland B.V. Microphone pour une prothèse auditive ou un dispositif d'écoute avec un amortissement intern amélioré et une protection contre les impuretés exterieurs
US6549632B1 (en) * 1996-11-08 2003-04-15 Kabushiki Kaisha Audio-Technica Microphone
EP1303164A2 (fr) * 2001-10-09 2003-04-16 Sonion Microtronic Nederland B.V. Microphone comportant un circuit imprimé flexible pour le montage de composants
EP1649718A1 (fr) * 2003-07-29 2006-04-26 BSE Co., Ltd. Microphone a condensateur electret montable en surface
US7275298B2 (en) 2001-10-23 2007-10-02 Schindel David W Ultrasonic printed circuit board transducer
SG140458A1 (en) * 2003-07-29 2008-03-28 Bse Co Ltd Integrated base and electret condenser microphone using the same
EP1653770A3 (fr) * 2004-10-29 2009-11-11 Sonion Nederland B.V. Microphone avec amortissement interne
EP2271135A3 (fr) * 2009-07-03 2013-06-19 Hosiden Corporation Microphone à condensateur
CN109640241A (zh) * 2019-01-21 2019-04-16 深圳市广慧宏科技有限公司 一种驻极体传声器全自动组装系统

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223498A (ja) * 2000-11-21 2002-08-09 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン
KR100349200B1 (ko) * 2000-12-12 2002-08-21 주식회사 씨에스티 초박형 콘덴서 마이크로폰 조립체 및 그 조립방법
JP3908059B2 (ja) * 2002-02-27 2007-04-25 スター精密株式会社 エレクトレットコンデンサマイクロホン
KR100675026B1 (ko) * 2003-11-05 2007-01-29 주식회사 비에스이 메인 ｐｃｂ에 콘덴서 마이크로폰을 실장하는 방법
KR100675505B1 (ko) 2005-04-29 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰의 케이스

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0147373A1 (fr) * 1983-12-22 1985-07-03 Telefonaktiebolaget L M Ericsson Procédé de fabrication de transducteurs électro-acoustiques, notamment des microphones, et transducteurs obtenus par ce procédé
JPS627300A (ja) * 1985-07-03 1987-01-14 Matsushita Electric Ind Co Ltd エレクトレツトコンデンサマイクロホン
EP0371620A2 (fr) * 1988-11-30 1990-06-06 Matsushita Electric Industrial Co., Ltd. Microphone à électret

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0147373A1 (fr) * 1983-12-22 1985-07-03 Telefonaktiebolaget L M Ericsson Procédé de fabrication de transducteurs électro-acoustiques, notamment des microphones, et transducteurs obtenus par ce procédé
JPS627300A (ja) * 1985-07-03 1987-01-14 Matsushita Electric Ind Co Ltd エレクトレツトコンデンサマイクロホン
EP0371620A2 (fr) * 1988-11-30 1990-06-06 Matsushita Electric Industrial Co., Ltd. Microphone à électret

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 11, no. 174 (E-513)4 June 1987 & JP-A-62 007 300 ( MATSUSHITA ) 14 January 1987 *

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002880C2 (nl) * 1996-04-16 1997-10-17 Microtronic Nederland Bv Elektroakoestische transducent.
EP0802700A1 (fr) * 1996-04-16 1997-10-22 Microtronic Nederland B.V. Transducteur électro-acoustique
US6549632B1 (en) * 1996-11-08 2003-04-15 Kabushiki Kaisha Audio-Technica Microphone
EP1257150A2 (fr) 2001-05-10 2002-11-13 Matsushita Electric Industrial Co., Ltd. Microphone capacitif à électret et procédé pour sa fabrication
EP1257150A3 (fr) * 2001-05-10 2008-12-03 Panasonic Corporation Microphone capacitif à électret et procédé pour sa fabrication
EP1298958A2 (fr) * 2001-09-28 2003-04-02 Sonion Microtronic Nederland B.V. Microphone pour une prothèse auditive ou un dispositif d'écoute avec un amortissement intern amélioré et une protection contre les impuretés exterieurs
EP1298958A3 (fr) * 2001-09-28 2003-12-10 Sonion Microtronic Nederland B.V. Microphone pour une prothèse auditive ou un dispositif d'écoute avec un amortissement intern amélioré et une protection contre les impuretés exterieurs
EP1303164A3 (fr) * 2001-10-09 2006-08-16 Sonion Microtronic Nederland B.V. Microphone comportant un circuit imprimé flexible pour le montage de composants
US7239714B2 (en) 2001-10-09 2007-07-03 Sonion Nederland B.V. Microphone having a flexible printed circuit board for mounting components
EP1303164A2 (fr) * 2001-10-09 2003-04-16 Sonion Microtronic Nederland B.V. Microphone comportant un circuit imprimé flexible pour le montage de composants
US7275298B2 (en) 2001-10-23 2007-10-02 Schindel David W Ultrasonic printed circuit board transducer
CN100400184C (zh) * 2001-10-23 2008-07-09 大卫·W·申德尔 超声波印刷电路板换能器
EP1649718A1 (fr) * 2003-07-29 2006-04-26 BSE Co., Ltd. Microphone a condensateur electret montable en surface
SG140458A1 (en) * 2003-07-29 2008-03-28 Bse Co Ltd Integrated base and electret condenser microphone using the same
EP1649718A4 (fr) * 2003-07-29 2009-04-08 Bse Co Ltd Microphone a condensateur electret montable en surface
EP1653770A3 (fr) * 2004-10-29 2009-11-11 Sonion Nederland B.V. Microphone avec amortissement interne
CN1805611B (zh) * 2004-10-29 2013-01-02 索尼昂荷兰有限公司 具有内部缓冲的麦克风
EP2271135A3 (fr) * 2009-07-03 2013-06-19 Hosiden Corporation Microphone à condensateur
CN109640241A (zh) * 2019-01-21 2019-04-16 深圳市广慧宏科技有限公司 一种驻极体传声器全自动组装系统

Also Published As

Publication number Publication date
CA2060542A1 (fr) 1992-08-13
DE69202352D1 (de) 1995-06-14
CA2060542C (fr) 1998-12-01
DE69202352T2 (de) 1996-01-18
JPH04257200A (ja) 1992-09-11
EP0499237A3 (en) 1993-10-20
EP0499237B1 (fr) 1995-05-10

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