Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/101—Esters; Ether-esters of monocarboxylic acids
  • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/20—Carboxylic acid amides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
  • C08L33/24—Homopolymers or copolymers of amides or imides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/02—Polyalkylene oxides

Definitions

• This invention relates to a resin composition having a good antistatic property and heat resistance, which comprises a specific methacrylimide group-containing polymer, and incorporated therein, a specific polyhydric alcohol compound and/or a compound having polyoxyethylene segments.
• a methacrylimide group-containing polymer has a good heat resistance and transparency, a relatively high heat distortion temperature, a good rigidity, surface hardness, and molding processability, but this polymer has a problem in that the electric resistance value is large and the polymer is easily statically charged by for example, rubbing or peeling.
• a method of an internal kneading of an antistatic agent is generally adopted for imparting an antistatic property to plastics, and in this method, an antistatic agent having a good compatibility with a base resin must be selected. If an antistatic agent having a poor compatibility with the base resin is used, problems such as a sticky surface and the precipitation of a white powder are caused by an excessive migration or bleeding of the antistatic agent to the surface, and furthermore, the inherent transparency of the resin becomes poor. In contrast, if an antistatic agent having a good compatibility with the base resin is used, the antistatic agent is uniformly dispersed in the resin, and a substantial antistatic effect is not manifested.
• a methacrylimide group-containing polymer has a relatively high glass transition temperature, and therefore, a migration of an antistatic agent to the surface becomes more difficult. Moreover, since the molding temperature of this polymer is high, the antistatic agent per se must have a high heat stability.
• a resin material having an antistatic property and a good heat resistance has not been known, and a development of this resin material is required.
• a primary object of the present invention is to obviate the defect of a methacrylimide group-containing polymer, and provide a resin composition having a good antistatic property and a high heat resistance.
• a resin composition having a good antistatic property and heat resistance which comprises (A) 100 parts by weight of a polymer comprising at least 10% by weight of methacrylimide units represented by the following general formula (I): wherein R1 represents a hydrogen atom or an aliphatic, aromatic or alicyclic hydrocarbon having 1 to 20 carbon atoms, and (B) 0.5 to 20 parts by weight of at least one compound selected from polyhydric alcohol compounds and compounds having polyoxyethylene segments, which are represented by the following general formulae (II) through (X): and wherein R2 through R7 , R9 , R11 and R14 represent an alkyl group having 8 to 22 carbon atoms, R8 , R10 , R12 , R13 , R15 , R16 represent a hydrogen atom or an alkyl group having up to 22 carbon atoms, and a, b, c, d, e, and f are integers of from 1 to 200, with the pro
• the methacrylimide group-containing polymer used as the component (A) in the present invention comprises methacrylimide units as represented by general formula (I), and the polymer (A) can be either a homopolymer or a copolymer.
• R preferably represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group or a phenyl group.
• the methacrylimide group-containing polymer used in the present invention comprises at least 10% by weight, preferably at least 20% by weight, of the above-mentioned methacrylimide units. If the content of the methacrylimide units is lower than 10% by weight, the high heat resistance inherently possessed by this polymer is substantially not manifested.
• the methacrylimide group-containing polymer (A) may contain units which have not been imidized when a methacrylic polymer is subjected to imidization.
• Such groups include, for example, units derived from an alkyl methacrylate such as methyl methacrylate and units derived from an alkyl methacrylate and another ethylenically unsaturated monomer.
• the process for the preparation of the methacrylimide group-containing polymer used in the present invention is not particularly critical.
• a process comprising reacting at an elevated temperature a methacrylic resin such as polymethyl methacrylate with ammonia or a primary amine such as methylamine or ethylamine in an appropriate solvent, for example, an aromatic hydrocarbon such as benzene, toluene or xylene, an alcohol such as methanol, ethanol or propanol, or a mixed solvent of at least two solvents selected from these aromatic hydrocarbons and alcohols, at a temperature of 170 to 350°C, preferably 200 to 300°C, in an autoclave.
• the reaction can be carried out in an extruder, as disclosed in Japanese Unexamined Patent Publication No. 52-63989.
• At least one compound selected from polyhydric alcohol compounds and compounds having polyoxyethylene segments, which are represented by general formulae (II) through (X), are used as the component (B).
• the compound (B) there can be mentioned fatty acid/ethylene oxide adducts, aliphatic alcohol/ethylene oxide adducts, fatty acid amide/ethylene oxide adducts, glycerol monofatty acid ester/ethylene oxide adducts, glycerol monoaliphatic ethers, pentaerythritol monofatty acid esters, sorbitol monofatty acid esters, and trimethylolpropane monofatty acid esters.
• Fatty acids and aliphatic alcohols in these compounds are those having 8 to 22 carbon atoms, and as specific examples, there can be mentioned octanoic acid, lauric acid, myristic acid, palmitic acid, stearic acid, montanic acid, oleic acid, behenic acid, octyl alcohol, lauryl alcohol, stearyl alcohol, and behenyl alcohol. If a fatty acid or aliphatic alcohol having up to 7 carbon atoms is used, the compatibility of the compound (B) with the base resin is poor and surging occurs in an extruder at the pellet-making step. In view of the stability of manifestation of the antistatic property, a compound (B) comprising stearic acid or stearyl alcohol is preferably used, and glycerol monostearyl ether is especially preferably used.
• the number of added ethylene oxide units is 1 to 200 per molecule of the compound (B). If the number of added ethylene oxide units is larger than 200, the antistatic property of the obtained resin composition becomes poor.
• the compound (B) is incorporated in an amount of 0.5 to 20 parts by weight, preferably 2 to 15 parts by weight, more preferably 5 to 10 parts by weight, per 100 parts by weight of the methacrylimide group-containing polymer. If the amount of the compound (B) added is smaller than 0.5 part by weight, a substantial antistatic effect is not manifested. Incorporation of the compound (B) in an amount exceeding 20 parts by weight is not preferred from the economical viewpoint. In view of the stability of the manifestation of the antistatic effect, most preferably the compound (B) is incorporated in an amount of 5 to 10 parts by weight.
• the resin composition of the present invention is characterized in that the heat distortion temperature of the resin composition can be optionally adjusted according to the structure and content of the methacrylimide units in the methacrylimide group-containing polymer (A) and the amount of the compound (B) added.
• a heat distortion temperature of about 100°C is generally sufficient for ordinary use, and a resin composition having such a heat distortion temperature can be shaped under shaping conditions customarily adopted for methacrylic resins and the like.
• the heat distortion temperature can be adjusted to 100 to 170°C. Namely, the heat resistance of the resin composition can be freely adjusted according to the intended use.
• composition of the present invention can be prepared by melt-kneading the methacrylimide group-containing polymer (A) together with the compound (B) in an extruder or the like. A part or all of the compound (B) can be added at the step of preparing the acrylimide group-containing polymer (A). In general, the former process is preferably adopted, in view of the stability of the methacrylimide group-containing polymer.
• the thermal decomposition-preventing agent, an anti-oxidant, and an ultraviolet absorber can be incorporated in the resin composition of the present invention, to improve the heat resistance, light resistance, and resistance to oxidative deterioration. Furthermore, a plasticizer, a dye, a lubricant and the like can be incorporated in the resin composition of the present invention.
• the resin composition of the present invention can be shaped into various articles by known plastic shaping methods such as press molding, injection molding and extrusion shaping.
• the heat distortion temperature was determined according to ASTM D-648-56 under a load of 18.6 kg/cm2.
• the imidization degree (%) was determined from the nitrogen content in the elementary analysis values measured by a CHN coder (MT-3 supplied by Yanagimoto Seisakusho) and the proton NMR spectrum measured by a spectrometer 100 MHz (JNM-FX-100 supplied by JEOL).
• a sample was subjected to moisture conditioning at a temperature of 20°C and a relative humidity of 65% for 1 day, a voltage of 500 V was applied to the sample at a temperature of 20°C and a relative humidity of 65% for 1 minute, and the surface resistance value ( ⁇ ) was measured by a high megohm meter (TR-8601 supplied by Takeda-Riken).
• a sample was subjected to moisture conditioning at a temperature of 20°C and a relative humidity of 65% for 1 day, and the charge was measured under an applied voltage of 10,000 V at a sample rotating speed of 1,300 rpm, a temperature of 20°C and a relative humidity of 65% for an application time of 30 seconds.
• the time required for the sample voltage to drop to 1/2 of the initial voltage after the application of the voltage was stopped was measured by using a static honest meter (supplied by Shishido Shokai) and designated as the charge half-value times (seconds). Note, change half-value times longer than 2 minutes are indicated by the mark " ⁇ ".
• the transparency was evaluated based on the haze value measured by an integrating sphere haze meter (SEP-H-SS supplied by Nippon Seimitsu Kogaku).
• the flow time (ts) of a chloroform solution having a sample polymer concentration of 0.5% by weight and the flow time (to) of chloroform were measured at a temperature of 25°C ⁇ 0.1°C by a Deereax-Bishoff viscometer, the relative viscosity ⁇ rel of the polymer was determined from the value of ts/to, and the inherent viscosity was calculated according to the following formula: wherein C represents the number of grams of the polymer in 100 ml of the solvent.
• a 10-liter reaction vessel equipped with a paddle spiral agitator, a pressure gauge, a sample injector, and a jacket heater was charged with 100 parts of a thoroughly dried methyl methacrylate polymer having an inherent viscosity of 0.51, 90 parts of toluene and 10 parts of methanol, and the inner atmosphere was replaced by nitrogen.
• the temperature was elevated to 200°C and the mixture was stirred to prepare a solution.
• the reaction was carried out under heating and an inner pressure of 60 kg/cm2 for 3 hours, and a methacrylimide group-containing polymer (A-1) was obtained by this reaction.
• the polymer was dried and powdered to obtain a sample.
• a methacrylimide group-containing polymer (A-5) was prepared in the same manner as described in Example 1, except that ammonia was used at a molar ratio of 0.7 instead of methylamine.
• composition prepared by incorporating 10 parts of a compound (B) shown in Referential Example B in the methacrylimide group-containing polymer (A-1) obtained in Referential Example A-1 was extrusion-shaped into a pellet.
• the pellet was injection-molded under the injection molding conditions shown below to form a test piece for the evaluation of the heat resistance and a flat test piece.
• the heat distortion temperature, antistatic property, and transparency were determined, and the results are shown in Table 2.
• Injection molding machine Promat 165/75 supplied by Sumitomo Juki Molding temperature: 100°C Injection molding temperature: 300°C
• a resin composition prepared by incorporating 10 parts of a compound (B-1) shown in Referential Example (B) in 100 parts of the methacrylimide group-containing polymer (A) obtained in Referential Example A-2, A-3, A-4 or A-5 was molded into test pieces for the measurement of various physical properties by injection molding cylinder temperature 320°C, mold temperature 100°C). The results of the measurement of the physical properties are shown in Table 3.
• a composition prepared by incorporating the compound (B-1) shown in Referential Example B in an amount shown in Table 4 in 100 parts of the methacrylimide group-containing polymer (A-1) or (A-5) obtained in Referential Example A-1 or A-5 was molded into a test piece in the same manner as described in Example 1, and the various physical properties were measured. The results are shown in Table 4.
• a composition prepared by incorporating 10 parts of a cationic antistatic agent (Duspar 125B supplied by Miyoshi Yushi) in 100 parts of the methacrylimide group-containing polymer (A-1) obtained in Referential Example A-1 was molded into a test piece in the same manner as described in Example 1, and the physical properties were evaluated.
• a cationic antistatic agent Duspar 125B supplied by Miyoshi Yushi
• a composition formed by incorporating 5 parts of a cationic antistatic agent (Duspar 125B supplied by Miyoshi Yushi) in 100 parts of the methyl methacrylate polymer used in Referential Example A was extrusion-shaped into a pellet, and the pellet was molded into test pieces for the measurement of the physical properties by injection molding (cylinder temperature 230°C, mold temperature 70°C), and the physical properties were evaluated.
• a cationic antistatic agent Duspar 125B supplied by Miyoshi Yushi
• the surface resistance value was 8.9 x 1011 ⁇
• the charge half-value time was 2.1 seconds
• the haze value was lower than 2.0%
• the heat distortion temperature was 85°C
• the resin composition of the present invention can be advantageously used for the production of illuminating articles, covers and parts of electric devices and electronic instruments, meter covers, daily necessities, sheets, panels, and the like.

Landscapes

• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
• Compositions Of Macromolecular Compounds (AREA)

Priority Applications (2)

Applications Claiming Priority (1)

Publications (1)

Family

ID=8206291

Family Applications (1)

Country Status (2)

Cited By (1)

Family Cites Families (4)

• 1991
  • 1991-01-11 EP EP91100319A patent/EP0494331A1/de not_active Withdrawn
  • 1991-01-11 US US07/639,891 patent/US5124386A/en not_active Expired - Fee Related

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events