EP0375179A3 - Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind - Google Patents
Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind Download PDFInfo
- Publication number
- EP0375179A3 EP0375179A3 EP19890312444 EP89312444A EP0375179A3 EP 0375179 A3 EP0375179 A3 EP 0375179A3 EP 19890312444 EP19890312444 EP 19890312444 EP 89312444 A EP89312444 A EP 89312444A EP 0375179 A3 EP0375179 A3 EP 0375179A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper plating
- difficult
- plating process
- plate metals
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28999388A | 1988-12-21 | 1988-12-21 | |
US289993 | 1988-12-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0375179A2 EP0375179A2 (de) | 1990-06-27 |
EP0375179A3 true EP0375179A3 (de) | 1991-01-30 |
EP0375179B1 EP0375179B1 (de) | 1994-05-25 |
Family
ID=23114070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19890312444 Expired - Lifetime EP0375179B1 (de) | 1988-12-21 | 1989-11-29 | Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0375179B1 (de) |
JP (1) | JPH02232390A (de) |
DE (1) | DE68915519T2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2818294A1 (fr) * | 2000-12-15 | 2002-06-21 | Thomson Csf | Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede |
JP2010150622A (ja) * | 2008-12-26 | 2010-07-08 | Hitachi Ltd | めっき液,凸状金属構造体を有する導電体基板、及び、その製造方法 |
CN103668355B (zh) * | 2013-12-06 | 2016-05-11 | 南京三乐电子信息产业集团有限公司 | 一种行波管钨螺旋线表面的镀铜方法 |
FR3053352A1 (fr) | 2016-07-04 | 2018-01-05 | Airbus Safran Launchers Sas | Composition de protection anticorrosion |
DE102016113641A1 (de) | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur |
CN107447239B (zh) * | 2017-08-21 | 2018-08-28 | 安徽省含山县兴建铸造厂 | 一种耐腐蚀防振锤的制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU901363A1 (ru) * | 1980-06-10 | 1982-01-30 | Предприятие П/Я А-7155 | Электролит дл электролитического осаждени меди |
-
1989
- 1989-11-21 JP JP30096289A patent/JPH02232390A/ja active Granted
- 1989-11-29 DE DE1989615519 patent/DE68915519T2/de not_active Expired - Fee Related
- 1989-11-29 EP EP19890312444 patent/EP0375179B1/de not_active Expired - Lifetime
Non-Patent Citations (2)
Title |
---|
CHEMICAL ABSTRACTS, vol. 96, no. 24, 14th June 1982, page 531, abstract no. 207474k, Columbus, Ohio, US; & SU-A-901 363 (V.M. GOLIKOV et al.) 30-01-1982 * |
METALOBERFLÄCHE, vol. 33, no. 1, 1979, pages 9-16; M.F.M. EL GHANDOUR et al.: "Einfluss von Harnstoff und anderen Zusätzen, sowie der Herstellungsbedingungen auf die elektrolytische Abscheidung von Kupfer aus Kupfersulfatbädern" * |
Also Published As
Publication number | Publication date |
---|---|
EP0375179B1 (de) | 1994-05-25 |
JPH0317913B2 (de) | 1991-03-11 |
JPH02232390A (ja) | 1990-09-14 |
DE68915519D1 (de) | 1994-06-30 |
DE68915519T2 (de) | 1994-12-01 |
EP0375179A2 (de) | 1990-06-27 |
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Legal Events
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