JPS5662986A - Base metal applied with aluminum alloy plating and its production - Google Patents

Base metal applied with aluminum alloy plating and its production

Info

Publication number
JPS5662986A
JPS5662986A JP13895979A JP13895979A JPS5662986A JP S5662986 A JPS5662986 A JP S5662986A JP 13895979 A JP13895979 A JP 13895979A JP 13895979 A JP13895979 A JP 13895979A JP S5662986 A JPS5662986 A JP S5662986A
Authority
JP
Japan
Prior art keywords
base metal
plating
production
aluminum alloy
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13895979A
Other languages
Japanese (ja)
Inventor
Kanenobu Tsukamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Holdings Co Ltd
Original Assignee
Hitachi Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Koki Co Ltd filed Critical Hitachi Koki Co Ltd
Priority to JP13895979A priority Critical patent/JPS5662986A/en
Publication of JPS5662986A publication Critical patent/JPS5662986A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To improve current efficiency and film characteristic by adding Pb ions to the inside of a molten salt electric aluminum plating bath and applying the alloy plating comprising aluminum and lead on a base metal.
CONSTITUTION: In the case of applying electric aluminum plating on a base metal of titanium or titanium alloy, PbCl2 powder or the like is added and melted to and in a molten salt aluminum plating bath to allow Pb ions to coexist. If plating is performed by using this plating bath, current efficiency improves and lead acts as a kind of lustering agent, thus the film surface becomes uniformly white and throwing-power is improved.
COPYRIGHT: (C)1981,JPO&Japio
JP13895979A 1979-10-26 1979-10-26 Base metal applied with aluminum alloy plating and its production Pending JPS5662986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13895979A JPS5662986A (en) 1979-10-26 1979-10-26 Base metal applied with aluminum alloy plating and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13895979A JPS5662986A (en) 1979-10-26 1979-10-26 Base metal applied with aluminum alloy plating and its production

Publications (1)

Publication Number Publication Date
JPS5662986A true JPS5662986A (en) 1981-05-29

Family

ID=15234161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13895979A Pending JPS5662986A (en) 1979-10-26 1979-10-26 Base metal applied with aluminum alloy plating and its production

Country Status (1)

Country Link
JP (1) JPS5662986A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61295393A (en) * 1985-06-24 1986-12-26 Sumitomo Metal Ind Ltd Al alloy laminate-plated metallic material and its manufacture
CN102888631A (en) * 2011-07-20 2013-01-23 中国科学院过程工程研究所 Method for preparing Al-Bi alloy or plated Al-Bi alloy by low-temperature electro-deposition of ionic liquid

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61295393A (en) * 1985-06-24 1986-12-26 Sumitomo Metal Ind Ltd Al alloy laminate-plated metallic material and its manufacture
CN102888631A (en) * 2011-07-20 2013-01-23 中国科学院过程工程研究所 Method for preparing Al-Bi alloy or plated Al-Bi alloy by low-temperature electro-deposition of ionic liquid
CN102888631B (en) * 2011-07-20 2016-04-27 中国科学院过程工程研究所 A kind of ionic liquid low-temperature electro-deposition prepares the method for Al-Bi alloy or plating Al-Bi alloy

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