EP0368860A1 - Materiau de contact pour interrupteur a vide et procede pour sa fabrication - Google Patents
Materiau de contact pour interrupteur a vide et procede pour sa fabricationInfo
- Publication number
- EP0368860A1 EP0368860A1 EP88903830A EP88903830A EP0368860A1 EP 0368860 A1 EP0368860 A1 EP 0368860A1 EP 88903830 A EP88903830 A EP 88903830A EP 88903830 A EP88903830 A EP 88903830A EP 0368860 A1 EP0368860 A1 EP 0368860A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact material
- copper
- tellurium
- chromium
- additional component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 title claims description 4
- 239000010949 copper Substances 0.000 claims abstract description 35
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011669 selenium Substances 0.000 claims abstract description 20
- 239000011651 chromium Substances 0.000 claims abstract description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 15
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims 1
- 238000010310 metallurgical process Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- KTLOQXXVQYUCJU-UHFFFAOYSA-N [Cu].[Cu].[Se] Chemical compound [Cu].[Cu].[Se] KTLOQXXVQYUCJU-UHFFFAOYSA-N 0.000 abstract description 2
- QZCHKAUWIRYEGK-UHFFFAOYSA-N tellanylidenecopper Chemical compound [Te]=[Cu] QZCHKAUWIRYEGK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000470 constituent Substances 0.000 abstract 3
- 230000035939 shock Effects 0.000 abstract 1
- 150000004771 selenides Chemical class 0.000 description 8
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- GDJXZYTVUKHWQE-UHFFFAOYSA-N [Se-2].[Cr+3].[Cu+2] Chemical compound [Se-2].[Cr+3].[Cu+2] GDJXZYTVUKHWQE-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000004772 tellurides Chemical class 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MZEWONGNQNXVKA-UHFFFAOYSA-N [Cu].[Cu].[Te] Chemical compound [Cu].[Cu].[Te] MZEWONGNQNXVKA-UHFFFAOYSA-N 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
- H01H1/0206—Contacts characterised by the material thereof specially adapted for vacuum switches containing as major components Cu and Cr
Definitions
- the invention relates to a contact material for vacuum switches, consisting of the basic components copper (Cu) and chrome and a tellurium (Te) - or selenium (Se) -containing additional component.
- tellurium (Te) or selenium (Se) are preferred, which can favor the required so-called "soft" switching behavior due to their high vapor pressures.
- Te tellurium
- Se selenium
- Examples from the patent literature are DE-PS 22 40 493, DE-AS 30 06 275, EP-B-0 083 200 and EP-A-0 172 912.
- the additives tellurium or selenium form intermetallic phases with copper according to the state diagrams known from Hansen's "Constitution of Binary Alloys", Springer Verlag (1958). On the one hand, these have melting points above the melting point of copper and thus enable them to be brazed tendency contact materials, as is pointed out in DE-PS 22 54 623. Since such phases in the vapor pressure are significantly lower than the starting materials tellurium and selenium, the desired physical property of a high vapor pressure is noticeably weakened. However, this also limits the lowering of the tearing currents and voltage instabilities, since it is no longer the pure addition that is decisive, but the intermetallic phase that he forms.
- the intermetallic phase is generally not completely present on the button of the contact piece made from the contact materials; rather, it is only found there together with the components chrome and copper in a predetermined proportion.
- This structure must be chosen because, on the one hand, a minimum proportion of chromium is required for the erosion resistance of the contact material and for a sufficient greasing effect, and on the other hand, because of the requirements for current carrying capacity and switching capacity, a minimum proportion of copper is also required. This means that not as much copper can be replaced by the less conductive telluride or selenide.
- the reduction in the concentration of the intermetallic phase in the button therefore usually has a weakening of the desired tear-off current reducing. Effect.
- the object of the invention is therefore to specify a contact material and the associated manufacturing method, in which the latter conditions are met and which, in particular, enables switching behavior that is largely free of overvoltage.
- the object is achieved by the entirety of the features of claim 1.
- the characteristic of this claim includes in particular the new features compared to the older, not previously published European patent application 87100621.9 (VPA 86 P 3030).
- Advantageous further developments are specified in subclaims 2 to 6, a method for producing the material according to the invention in method claim 7.
- the copper telluride (Cu 2 Te) or copper selenide (Cu 2 Se) usually contained in CrCu materials is due to a ternary copper-chromium telluride or copper-chromium selenide with a specifically higher one Tellurium or selenium concentration replaced.
- the binary telluride or selenide mentioned can be substituted by a ternary telluride or selenide which is similar in melting point and vapor pressure, but which has a significantly higher tellurium or Selenium concentration. This means that with a comparable volume fraction of telluride or selenide in the CrCu structure, the addition of a ternary CrCu telluride or selenide is more advantageous than that of the usual binary Cu telluride or selenide.
- the ternary tellurides or selenides contained in the contact material according to the invention can be obtained by melting from the individual components chromium, copper and tellurium or selenium. They can then be added in powder form in the CrCu contact production in the desired amount and processed in a known manner.
- the ternary intermetallic phase can be distributed homogeneously throughout the CrCu structure; however, it can also be limited to a surface zone of the contact and, in particular, starting from the button, can be limited to a predetermined depth of the material, as in the European one Patent application 87100621.9 is described in detail.
- FIG. 1 shows a temperature-evaporation rate diagram for individual components in the chromium-copper-tellurium system
- FIG. 2 shows a tear-off current distribution diagram for the intermetallic phases mentioned in the system according to FIG. 1.
- the evaporation rate is chosen logarithmically as the abscissa and the temperature as the ordinate. From graphs 1 for copper and 2 for tellurium it can be seen that tellurium has a considerable evaporation rate even at low temperatures, whereas considerably higher temperatures have to be specified for copper.
- the well-known intermetallic phase in the copper-tellurium system namely Cu 2 Te contains approx. 33 atomic% tellurium and 67 atomic% copper; the graph 3 for the relevant evaporation rate is relatively close below the copper graphene 2.
- the tearing current is the abscissa and the Relative frequency of the stall current plotted so that the representation in this coordinate system provides a stall current distribution.
- a mixture of chrome, copper and tellurium powder in a mass ratio of approx. 1: 2: 5.5 is heated, melted and homogenized under vacuum or under protective gas to approx. 1300oC.
- a ternary copper-chromium telluride with a stoichiometry of approximately Cu 3 Cr 2 Te 4 is formed .
- the ternary copper-chromium telluride produced in this way is ground, sieved to a powder size of ⁇ 100 ⁇ m and mixed with chromium and copper powder with a particle size distribution of likewise ⁇ 100 ⁇ m in a mass ratio of 1: 2: 2. This mixture is applied in an approximately 3 mm high layer to an approximately equally high layer made of a CrCu
- contact pieces can be produced in which the additional components with the ternary tellurides or selenides are present in the entire contact material.
Landscapes
- Powder Metallurgy (AREA)
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
Abstract
On connaît des matériaux pour contact destinés à des interrupteurs à vide, dont les constituants de base sont le cuivre et le chrome et dont les constituants additionnels renferment du tellure ou du sélénium, du tellure de cuivre (Cu2Te) ou du séléniure de cuivre (Cu2Se) se formant à titre de phase intermétallique binaire. Selon l'invention, le constituant additionnel est une phase intermétallique ternaire composée de cuivre, chrome et tellure ou de cuivre, chrome et sélénium avec une teneur en tellure ou en sélénium supérieure à celle des phases intermétalliques connues. Les courants de choc des plots de contact fabriqués avec le matériau pour contact de l'invention sont ainsi réduits et le comportement en surtension s'en trouve amélioré.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3724990 | 1987-07-28 | ||
| DE3724990 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0368860A1 true EP0368860A1 (fr) | 1990-05-23 |
Family
ID=6332536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP88903830A Withdrawn EP0368860A1 (fr) | 1987-07-28 | 1988-05-04 | Materiau de contact pour interrupteur a vide et procede pour sa fabrication |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4997624A (fr) |
| EP (1) | EP0368860A1 (fr) |
| JP (1) | JPH02500554A (fr) |
| IN (1) | IN169611B (fr) |
| WO (1) | WO1989001231A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109205576A (zh) * | 2018-11-30 | 2019-01-15 | 武汉理工大学 | 一种铜基硫族化合物固溶体的室温超快速制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538896A3 (en) * | 1991-10-25 | 1993-11-18 | Meidensha Electric Mfg Co Ltd | Process for forming contact material |
| JP2011108380A (ja) * | 2009-11-13 | 2011-06-02 | Hitachi Ltd | 真空バルブ用電気接点およびそれを用いた真空遮断器 |
| CN103706783B (zh) * | 2013-10-15 | 2017-02-15 | 陕西斯瑞新材料股份有限公司 | 一种高抗熔焊性CuCr40Te触头材料及其制备方法 |
| CN106241752B (zh) * | 2016-09-20 | 2018-07-06 | 广东先导稀材股份有限公司 | 一种碲化亚铜的制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4836071B1 (fr) * | 1968-07-30 | 1973-11-01 | ||
| DE2240493C3 (de) * | 1972-08-17 | 1978-04-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Durchdringungsverbundmetall als Kontaktwerkstoff für Vakuumschalter und Verfahren zu seiner Herstellung |
| DE2254623C3 (de) * | 1972-11-08 | 1979-09-13 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Durchdringungsverbundmetall als Kontaktwerkstoff für Vakuumschalter mit hohen Schaltzahlen |
| JPS6059691B2 (ja) * | 1979-02-23 | 1985-12-26 | 三菱電機株式会社 | 真空しや断器用接点及びその製造方法 |
| JPS58108622A (ja) * | 1981-12-21 | 1983-06-28 | 三菱電機株式会社 | 真空開閉器用電極材料 |
| JPS58115728A (ja) * | 1981-12-28 | 1983-07-09 | 三菱電機株式会社 | 真空しや断器用接点 |
| EP0109088B1 (fr) * | 1982-11-16 | 1986-03-19 | Mitsubishi Denki Kabushiki Kaisha | Matériau de contact pour interrupteurs sous vide |
| JPS60172116A (ja) * | 1984-02-16 | 1985-09-05 | 三菱電機株式会社 | 真空しや断器用接点 |
| KR900001613B1 (ko) * | 1986-01-10 | 1990-03-17 | 미쯔비시 덴끼 가부시기가이샤 | 진공차단기용 접점재료 |
| EP0234246A1 (fr) * | 1986-01-30 | 1987-09-02 | Siemens Aktiengesellschaft | Pièces de contact interrupteur pour appareils interrupteurs sous vide et procédé pour leur fabrication |
| DE3864979D1 (de) * | 1987-11-02 | 1991-10-24 | Siemens Ag | Verfahren zur herstellung von schmelzwerkstoffen aus kupfer, chrom und wenigstens einer leichtverdampflichen komponente sowie abschmelzelektrode zur verwendung bei einem derartigen verfahren. |
-
1988
- 1988-05-04 EP EP88903830A patent/EP0368860A1/fr not_active Withdrawn
- 1988-05-04 WO PCT/EP1988/000371 patent/WO1989001231A1/fr not_active Application Discontinuation
- 1988-05-04 JP JP63503817A patent/JPH02500554A/ja active Pending
- 1988-06-06 IN IN461/CAL/88A patent/IN169611B/en unknown
-
1990
- 1990-01-19 US US07/458,696 patent/US4997624A/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| See references of WO8901231A1 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109205576A (zh) * | 2018-11-30 | 2019-01-15 | 武汉理工大学 | 一种铜基硫族化合物固溶体的室温超快速制备方法 |
| CN109205576B (zh) * | 2018-11-30 | 2022-01-11 | 武汉理工大学 | 一种铜基硫族化合物固溶体的室温超快速制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02500554A (ja) | 1990-02-22 |
| US4997624A (en) | 1991-03-05 |
| IN169611B (fr) | 1991-11-23 |
| WO1989001231A1 (fr) | 1989-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19890512 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): CH DE FR GB IT LI NL SE |
|
| 17Q | First examination report despatched |
Effective date: 19920124 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 19920908 |