EP0259754A3 - Flexible Schaltungen - Google Patents
Flexible Schaltungen Download PDFInfo
- Publication number
- EP0259754A3 EP0259754A3 EP87112720A EP87112720A EP0259754A3 EP 0259754 A3 EP0259754 A3 EP 0259754A3 EP 87112720 A EP87112720 A EP 87112720A EP 87112720 A EP87112720 A EP 87112720A EP 0259754 A3 EP0259754 A3 EP 0259754A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- flexible circuits
- average pore
- flexible
- elegantly
- going
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011148 porous material Substances 0.000 abstract 3
- 239000012190 activator Substances 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 abstract 1
- 238000003631 wet chemical etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/24996—With internal element bridging layers, nonplanar interface between layers, or intermediate layer of commingled adjacent foam layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863631011 DE3631011A1 (de) | 1986-09-12 | 1986-09-12 | Flexible schaltungen |
DE3631011 | 1986-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0259754A2 EP0259754A2 (de) | 1988-03-16 |
EP0259754A3 true EP0259754A3 (de) | 1989-10-18 |
Family
ID=6309406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87112720A Withdrawn EP0259754A3 (de) | 1986-09-12 | 1987-09-01 | Flexible Schaltungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US4847139A (de) |
EP (1) | EP0259754A3 (de) |
JP (1) | JPS6370594A (de) |
DE (1) | DE3631011A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2538043B2 (ja) * | 1989-04-05 | 1996-09-25 | 松下電器産業株式会社 | パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法 |
NL194941C (nl) * | 1990-02-15 | 2003-08-04 | Cordis Corp | Werkwijze voor het aanbrengen van een fysiologisch actieve verbinding op een substraatoppervlak. |
US5141829A (en) * | 1990-09-10 | 1992-08-25 | General Electric Company | Method of preparing a photo-mask for imaging three-dimensional objects |
US5178976A (en) * | 1990-09-10 | 1993-01-12 | General Electric Company | Technique for preparing a photo-mask for imaging three-dimensional objects |
US5348574A (en) * | 1993-07-02 | 1994-09-20 | Monsanto Company | Metal-coated polyimide |
JPH0948864A (ja) * | 1995-08-03 | 1997-02-18 | Kanegafuchi Chem Ind Co Ltd | ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム |
US5879531A (en) * | 1996-03-06 | 1999-03-09 | The Whitaker Corporation | Method of manufacturing an array of electrical conductors |
US6030681A (en) * | 1997-07-10 | 2000-02-29 | Raychem Corporation | Magnetic disk comprising a substrate with a cermet layer on a porcelain |
US7348045B2 (en) * | 2002-09-05 | 2008-03-25 | 3M Innovative Properties Company | Controlled depth etched dielectric film |
EP1785505B1 (de) * | 2004-08-10 | 2009-09-02 | Nippon Mining & Metals Co., Ltd. | Barrierefilm für flexbilbes kupfersubstrat und sputtertarget zur bildung eines barrierefilms |
US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US9924591B2 (en) * | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US10183258B2 (en) * | 2016-06-30 | 2019-01-22 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Metallopolyimide precursor fibers for aging-resistant carbon molecular sieve hollow fiber membranes with enhanced selectivity |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
CN116285320B (zh) * | 2023-05-09 | 2023-08-22 | 中齐电缆有限公司 | 一种低压柔性电缆 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2702283B2 (de) * | 1976-01-20 | 1980-04-17 | Matsushita Electric Works, Ltd., Kadoma, Osaka (Japan) | Übertragungsmaterial für rauhe Oberflächen und Verfahren zu dessen Herstellung |
EP0081129A1 (de) * | 1981-12-05 | 1983-06-15 | Bayer Ag | Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3854973A (en) * | 1970-01-26 | 1974-12-17 | Macdermid Inc | Method of making additive printed circuit boards |
US3959523A (en) * | 1973-12-14 | 1976-05-25 | Macdermid Incorporated | Additive printed circuit boards and method of manufacture |
JPS5418875A (en) * | 1977-07-12 | 1979-02-13 | Nippon Denki Kagaku Co Ltd | Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate |
US4358479A (en) * | 1980-12-01 | 1982-11-09 | International Business Machines Corporation | Treatment of copper and use thereof |
US4615763A (en) * | 1985-01-02 | 1986-10-07 | International Business Machines Corporation | Roughening surface of a substrate |
-
1986
- 1986-09-12 DE DE19863631011 patent/DE3631011A1/de not_active Withdrawn
-
1987
- 1987-08-25 US US07/089,095 patent/US4847139A/en not_active Expired - Fee Related
- 1987-09-01 EP EP87112720A patent/EP0259754A3/de not_active Withdrawn
- 1987-09-08 JP JP62223188A patent/JPS6370594A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2702283B2 (de) * | 1976-01-20 | 1980-04-17 | Matsushita Electric Works, Ltd., Kadoma, Osaka (Japan) | Übertragungsmaterial für rauhe Oberflächen und Verfahren zu dessen Herstellung |
EP0081129A1 (de) * | 1981-12-05 | 1983-06-15 | Bayer Ag | Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung |
Also Published As
Publication number | Publication date |
---|---|
EP0259754A2 (de) | 1988-03-16 |
US4847139A (en) | 1989-07-11 |
JPS6370594A (ja) | 1988-03-30 |
DE3631011A1 (de) | 1988-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19870901 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): BE CH DE FR GB IT LI NL SE |
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PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
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AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): BE CH DE FR GB IT LI NL SE |
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17Q | First examination report despatched |
Effective date: 19910702 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19911025 |
|
R18W | Application withdrawn (corrected) |
Effective date: 19911025 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: WOLF, GERHARD DIETER, DR. Inventor name: MERTEN, RUDOLF, DR. Inventor name: VON GIZYCKI, ULRICH, DR. Inventor name: SIRINYAN, KIRKOR, DR. |