EP0228119B1 - Dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches - Google Patents

Dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches Download PDF

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Publication number
EP0228119B1
EP0228119B1 EP86202170A EP86202170A EP0228119B1 EP 0228119 B1 EP0228119 B1 EP 0228119B1 EP 86202170 A EP86202170 A EP 86202170A EP 86202170 A EP86202170 A EP 86202170A EP 0228119 B1 EP0228119 B1 EP 0228119B1
Authority
EP
European Patent Office
Prior art keywords
pins
plate
case
support
centering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP86202170A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0228119A1 (fr
Inventor
Michel Jean Claude Monnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Koninklijke Philips NV
Original Assignee
Laboratoires dElectronique Philips SAS
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique Philips SAS, Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Laboratoires dElectronique Philips SAS
Publication of EP0228119A1 publication Critical patent/EP0228119A1/fr
Application granted granted Critical
Publication of EP0228119B1 publication Critical patent/EP0228119B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53978—Means to assemble or disassemble including means to relatively position plural work parts

Definitions

  • the invention relates to a centering device for carrying out the pinout of a multispindle housing, housing intended to receive an integrated circuit board, and the pins of which have the shape of a rod provided with a flat head, the rod passing through a flat part called the support of the housing in previously metallized holes and protruding from one of the faces of the support of a length sufficient to ensure the fixing of the housing, and the flat head bearing on the other face of the support via of a metallic form in an alloy suitable for ensuring by fusion the fixing of the pins.
  • a centering device is known p. esc. from document US-A-3414962.
  • the invention also relates to the method for producing such a housing by means of this device.
  • centering devices known to those skilled in the art are graphite dies, pierced with holes calibrated to the diameter of the pin rods, and distributed according to the geometrical arrangement provided for these pins. These centering devices are each subject to a housing during the fixing operation of the pins and are therefore subjected, together with the housings, to the high temperatures necessary for this fixing. Consequently, the repetition of these operations renders this kind of centering device quickly out of use. These known centering devices can only be used a very small number of times.
  • multispindle type housings by which we mean having at least 300 or 400 pins, are expected to take a big development in the near future.
  • this device is characterized in that it consists of three parts, the first part being formed of a first metal plate, the second part being formed of a second metal plate serving as a gauge for centering the drilled pins. of holes arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing and calibrated so as to both maintain and center the rods in the holes in the housing, and the third part consisting of a clamping device for blocking the support of the housing provided with its pins on the first metal plate, and in that the materials chosen to produce the first plate have a coefficient of expansion close to that of the support of the housing in the temperature range where the pins are fixed, this first metal plate on which the support of the bo is blocked casing during the fixing of the pins, being only brought to this fixing temperature.
  • such a device provides the following advantages: It is unique for a whole series of manufactured cases, that is to say reusable a large number of times, because the part which is produced with precision and which serves as a gauge for centering the pins, is not worn at high temperatures at the same time as the case during the spindle fixing operation. Only a simple metal plate without precision accompanies the case during this operation.
  • the multispindle housing mainly consists of a support 120 plane, the two faces of which bear the references 121 and 122.
  • This support is pierced with holes 3 intended to receive the pins.
  • Each hole is metallized prior to the positioning of the pins, by metallization 13 supplemented by an annular metallization 11 on the face 121 and 12 on the face 122.
  • the metallizations of the holes, and therefore subsequently the pins are connected to a circuit 110 which may be multilayer.
  • Zone 31 is intended to receive the integrated circuit board.
  • FIG. 1b shows, in simplified section, a part of the housing, provided with its pins, as obtained by means of the production method using the centering device according to the invention.
  • This finished housing includes an integrated circuit board 130 whose output pads are connected to the circuit 110 for example by flexible wires 6, and which is protected for example by the cover 141.
  • This housing further comprises pins 5 formed of a rod 2 and a flat head 1. These pins are made tear-off because the flat head 1 of the pins bears on the face 122 of the support 120, and because the pins are fixed by a metallic compound filling the gap 23 between the pins and the walls of the metallized holes, until forming the fillets 21 and 22.
  • the centering device known to date for those skilled in the art generally consists of a graphite plate pierced with calibrated holes.
  • Graphite has the property of being easily machinable and of a moderate price. But this material has a coefficient of expansion which is not best suited to that of ceramic in the temperature range where the pins are fixed. However, it is brought to the high temperature of the metal compound used for fixing the pins, at the same time as the housing. Under these conditions, it is quickly rendered unusable by thermal and mechanical degradation: it crumbles after a very small number of uses.
  • the present invention proposes a centering device which can be reused a large number of times, and which can therefore be used in the manufacture of a large number of cases.
  • this centering device in a position remote from the housing, comprises three parts.
  • the first part is formed by a first metal plate 100.
  • the second part is formed by a second metal plate 101 serving as a gauge for centering the pins, pierced with holes 103 arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing. These holes 103 are calibrated so as to ensure both the maintenance and the centering of the rods 2 in the holes 3 of the housing.
  • the third part is intended to block the housing 120 on the first metal plate 100, once the pins have been centered by means of the caliber 101.
  • This locking device is shown in detail in Figures 3a and 3b.
  • it comprises at least two strips 51 of thickness less than the distance between two pins. These strips are integral with a backsplash 52 which maintains their spacing. This spacing must correspond to an interval between a certain number of pins.
  • the slats 51 are mounted on the backsplash 52, mutually parallel and perpendicular to the backsplash. They can slide in the grooves 61 of a fixed terminal 60 ( Figure 3a).
  • the blocking device further comprises, integral with the first metal plate 100, a stirrup 53 fixed by the lugs 48, made of a material which is both refractory to the fixing temperatures of the pins and capable of possessing at these temperatures elastic properties suitable for the upper part 54 of this stirrup constitutes, at these same temperatures, a spring.
  • This material may for example be bronze-beryllium.
  • In the upper part 54 of this stirrup turns a screw 55 which drives a plate 56 (FIG. 3b) parallel to the upper part 54 of the stirrup.
  • the stirrup and the plate 56 form a system known as the "Mohr clamp".
  • the material intended to produce the slats 51, the backsplash 52 and the plate 56 is chosen from any material whose sole property is to be refractory to the fixing temperatures of the pins.
  • the position of the plate 56 and the dimensions of the bracket 53 are such that the strips 51 can be easily slid under the plate 56 perpendicular to the plane of the first plate 100 on which the bracket is fixed.
  • At least two of these blocking devices will be necessary to block the support 120 on the first plate 100, during the operation of fixing the pins.
  • these two locking devices will be arranged on two opposite parallel sides of the support 120.
  • the support 120 of the multi-spindle housing is made of ceramic
  • the metallic material from which the first plate 100 of the centering device is made must have a coefficient of expansion compatible with ceramic in the temperature range where the support is carried to ensure the fusion of the metallic compound for fixing in the gap 23 between the pins and the walls of the metallized holes of the support 120. In fact it is this single plate 100 which will be brought to the fixing temperatures of the pins at the same time as the housing 120.
  • a ceramic support 120 it can be advantageously chosen to carry out metallization holes using a screen-conductive copper conductive compound under a non-oxidizing atmosphere, for example the compound known from French patent application FR-2 305 478 or FR-2 437 427.
  • the screen-printing ink intended for the metallization of the holes 3 is diffused in the holes for example by suction so as to coat the walls of the hole, then it undergoes baking. Crowns 11 and 12 are produced during the same operation, around the holes 3, on each of the faces 121 and 122 of the substrate 120, respectively. This technique is described for example in French patent application FR-85 05 262.
  • an advantageous metal for forming the pins is for example iron-nickel-cobalt.
  • annular preform 14 of this ternary compound (or any other compound chosen for fixing the pins) can be made, and arranged on the face 122 of the support 120 between the flat head 1 of the pin to be fixed and the annular metallization 12.
  • the plate 101 is threaded onto the rods 2 while the plate 100 keeps the flat heads 1 applied against the preforms 14 and the surface 122 of the support 120.
  • the centering device is then locked in this position by the clamping devices as shown in Figures 3a, 3b and 3c.
  • the lamella 51 are abrod slid, perpendicular to the plane of the first plate 100, in the guide slots 61, of the terminal 60 fixed to the plate 100 ( Figure 3a).
  • the strips 51 are finally slid between two pins in slots 102 provided in the second plate 101. These slots have on the one hand an opening sufficient to allow the strips 51 to penetrate and on the other hand are spaced apart by the same distance as the distance at which the slats are attached to the backsplashes 52 ( Figure 3c).
  • the screw 55 is then tightened.
  • the plate 100 therefore blocks the pins, by pressing on their flat head 1, exactly in the position where they have been centered by the second so-called calibration plate 101 (FIG. 2b).
  • Said plate 101 can then be removed. And only the assembly formed by the plate 100, the support 120 provided with pins and preforms 14, blocked together by the refractory clamping device, is brought to the melting temperature of the fixing alloy which composes the preforms 14 ( Figure 2c).
  • the assembly formed of the centering device-housing support must be such that the plate 100, the preforms 14 and the flat heads 1 are in a lower position. relative to the intervals 23, to the support 120 and to the rods 2.
  • the plate 101 is fragile because it is produced with the precision necessary for centering the pins. This plate will be used for a long time because it is used exclusively for positioning and centering pins, and is never brought to the melting temperatures of the fixing alloy. It therefore has no opportunity to be damaged. On the other hand, the plate 101 which undergoes temperature rises is not very fragile. It will therefore not be easily deteriorated and will also make long use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Plates (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP86202170A 1985-12-13 1986-12-04 Dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches Expired - Lifetime EP0228119B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8518471A FR2591810B1 (fr) 1985-12-13 1985-12-13 Dispositif de centrage pour la realisation du brochage d'un boitier multibroches
FR8518471 1985-12-13

Publications (2)

Publication Number Publication Date
EP0228119A1 EP0228119A1 (fr) 1987-07-08
EP0228119B1 true EP0228119B1 (fr) 1991-04-03

Family

ID=9325750

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86202170A Expired - Lifetime EP0228119B1 (fr) 1985-12-13 1986-12-04 Dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches

Country Status (5)

Country Link
US (1) US4741090A (ja)
EP (1) EP0228119B1 (ja)
JP (1) JPH0752665B2 (ja)
DE (1) DE3678547D1 (ja)
FR (1) FR2591810B1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127150A (en) * 1989-12-18 1992-07-07 Texas Instruments Incorporated Hermetic motor protector
US5067228A (en) * 1990-05-09 1991-11-26 Saratoga Spa & Bath Co. Apparatus and method for blind attachment of a liner to a pool support structure
US5303466A (en) * 1991-03-25 1994-04-19 Daiichi Denshi Kogyo Kabushiki Kaisha Method of mounting surface connector
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design
DE60032807T2 (de) 1999-12-13 2007-04-26 Dow Global Technologies, Inc., Midland Leichtgewicht-reifenstützkörper, zusammensetzung dafür und herstellungsverfahren
US6415493B1 (en) * 2000-03-29 2002-07-09 Lucent Technologies Inc. Method and apparatus for precise positioning of a circuit board to a mounting plate
US6457224B1 (en) * 2000-08-21 2002-10-01 Advanced Micro Devices, Inc. Dambar punch setup jig
KR100853646B1 (ko) * 2000-09-11 2008-08-25 다우 글로벌 테크놀로지스 인크. 타이어 지지체 제조 방법 및 장치
US6742246B2 (en) * 2002-01-23 2004-06-01 Safety Syringes, Inc. Systems for assembling injection devices
US6874219B2 (en) * 2003-05-22 2005-04-05 Hitachi Global Storage Technologies Netherlands B.V. System, method, and apparatus for preventing rotation of a disk clamp while being assembled to the hub of a spindle motor in a hard disk drive and fastener centering features
DE102005056378A1 (de) * 2005-11-24 2007-05-31 Heiko Schmidt Verfahren zum Einbringen und Verankern wenigstens eines Verbindungselementes in einem Werkstück sowie Vorrichtung zum Durchführen des Verfahrens
US8256754B2 (en) * 2007-12-12 2012-09-04 Applied Materials, Inc. Lift pin for substrate processing
US9821424B2 (en) * 2014-10-03 2017-11-21 GM Global Technology Operations LLC Manufacturing fixture

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276854A (en) * 1963-11-05 1966-10-04 Western Electric Co Method and apparatus for assembling wires in a plurality of apertured parts
US3299502A (en) * 1964-10-01 1967-01-24 Western Electric Co Methods and apparatus for assembling articles
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices
US3414962A (en) * 1966-07-25 1968-12-10 Atlas Chem Ind Electrode assembly jig and method thereof
FR2031024A5 (ja) * 1969-03-08 1970-11-13 Bosch
US3745422A (en) * 1972-03-07 1973-07-10 Motorola Inc Power semi-conductor device mountable on either its top or bottom surface
US3992770A (en) * 1974-08-30 1976-11-23 Rca Corporation Automatic assembly of semiconductor devices
US3978579A (en) * 1974-08-30 1976-09-07 Rca Corporation Automatic assembly of semiconductor devices
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
JPS5842262A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 混成集積回路のリ−ド線接続方法

Also Published As

Publication number Publication date
JPH0752665B2 (ja) 1995-06-05
JPS62145677A (ja) 1987-06-29
DE3678547D1 (de) 1991-05-08
US4741090A (en) 1988-05-03
FR2591810B1 (fr) 1988-02-19
EP0228119A1 (fr) 1987-07-08
FR2591810A1 (fr) 1987-06-19

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