EP0228119B1 - Centering device for the realization of the pin insertion of a multipin case - Google Patents

Centering device for the realization of the pin insertion of a multipin case Download PDF

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Publication number
EP0228119B1
EP0228119B1 EP86202170A EP86202170A EP0228119B1 EP 0228119 B1 EP0228119 B1 EP 0228119B1 EP 86202170 A EP86202170 A EP 86202170A EP 86202170 A EP86202170 A EP 86202170A EP 0228119 B1 EP0228119 B1 EP 0228119B1
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EP
European Patent Office
Prior art keywords
pins
plate
case
support
centering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP86202170A
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German (de)
French (fr)
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EP0228119A1 (en
Inventor
Michel Jean Claude Monnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Koninklijke Philips NV
Original Assignee
Laboratoires dElectronique Philips SAS
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
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Application filed by Laboratoires dElectronique Philips SAS, Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Laboratoires dElectronique Philips SAS
Publication of EP0228119A1 publication Critical patent/EP0228119A1/en
Application granted granted Critical
Publication of EP0228119B1 publication Critical patent/EP0228119B1/en
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Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49895Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53961Means to assemble or disassemble with work-holder for assembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53978Means to assemble or disassemble including means to relatively position plural work parts

Definitions

  • the invention relates to a centering device for carrying out the pinout of a multispindle housing, housing intended to receive an integrated circuit board, and the pins of which have the shape of a rod provided with a flat head, the rod passing through a flat part called the support of the housing in previously metallized holes and protruding from one of the faces of the support of a length sufficient to ensure the fixing of the housing, and the flat head bearing on the other face of the support via of a metallic form in an alloy suitable for ensuring by fusion the fixing of the pins.
  • a centering device is known p. esc. from document US-A-3414962.
  • the invention also relates to the method for producing such a housing by means of this device.
  • centering devices known to those skilled in the art are graphite dies, pierced with holes calibrated to the diameter of the pin rods, and distributed according to the geometrical arrangement provided for these pins. These centering devices are each subject to a housing during the fixing operation of the pins and are therefore subjected, together with the housings, to the high temperatures necessary for this fixing. Consequently, the repetition of these operations renders this kind of centering device quickly out of use. These known centering devices can only be used a very small number of times.
  • multispindle type housings by which we mean having at least 300 or 400 pins, are expected to take a big development in the near future.
  • this device is characterized in that it consists of three parts, the first part being formed of a first metal plate, the second part being formed of a second metal plate serving as a gauge for centering the drilled pins. of holes arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing and calibrated so as to both maintain and center the rods in the holes in the housing, and the third part consisting of a clamping device for blocking the support of the housing provided with its pins on the first metal plate, and in that the materials chosen to produce the first plate have a coefficient of expansion close to that of the support of the housing in the temperature range where the pins are fixed, this first metal plate on which the support of the bo is blocked casing during the fixing of the pins, being only brought to this fixing temperature.
  • such a device provides the following advantages: It is unique for a whole series of manufactured cases, that is to say reusable a large number of times, because the part which is produced with precision and which serves as a gauge for centering the pins, is not worn at high temperatures at the same time as the case during the spindle fixing operation. Only a simple metal plate without precision accompanies the case during this operation.
  • the multispindle housing mainly consists of a support 120 plane, the two faces of which bear the references 121 and 122.
  • This support is pierced with holes 3 intended to receive the pins.
  • Each hole is metallized prior to the positioning of the pins, by metallization 13 supplemented by an annular metallization 11 on the face 121 and 12 on the face 122.
  • the metallizations of the holes, and therefore subsequently the pins are connected to a circuit 110 which may be multilayer.
  • Zone 31 is intended to receive the integrated circuit board.
  • FIG. 1b shows, in simplified section, a part of the housing, provided with its pins, as obtained by means of the production method using the centering device according to the invention.
  • This finished housing includes an integrated circuit board 130 whose output pads are connected to the circuit 110 for example by flexible wires 6, and which is protected for example by the cover 141.
  • This housing further comprises pins 5 formed of a rod 2 and a flat head 1. These pins are made tear-off because the flat head 1 of the pins bears on the face 122 of the support 120, and because the pins are fixed by a metallic compound filling the gap 23 between the pins and the walls of the metallized holes, until forming the fillets 21 and 22.
  • the centering device known to date for those skilled in the art generally consists of a graphite plate pierced with calibrated holes.
  • Graphite has the property of being easily machinable and of a moderate price. But this material has a coefficient of expansion which is not best suited to that of ceramic in the temperature range where the pins are fixed. However, it is brought to the high temperature of the metal compound used for fixing the pins, at the same time as the housing. Under these conditions, it is quickly rendered unusable by thermal and mechanical degradation: it crumbles after a very small number of uses.
  • the present invention proposes a centering device which can be reused a large number of times, and which can therefore be used in the manufacture of a large number of cases.
  • this centering device in a position remote from the housing, comprises three parts.
  • the first part is formed by a first metal plate 100.
  • the second part is formed by a second metal plate 101 serving as a gauge for centering the pins, pierced with holes 103 arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing. These holes 103 are calibrated so as to ensure both the maintenance and the centering of the rods 2 in the holes 3 of the housing.
  • the third part is intended to block the housing 120 on the first metal plate 100, once the pins have been centered by means of the caliber 101.
  • This locking device is shown in detail in Figures 3a and 3b.
  • it comprises at least two strips 51 of thickness less than the distance between two pins. These strips are integral with a backsplash 52 which maintains their spacing. This spacing must correspond to an interval between a certain number of pins.
  • the slats 51 are mounted on the backsplash 52, mutually parallel and perpendicular to the backsplash. They can slide in the grooves 61 of a fixed terminal 60 ( Figure 3a).
  • the blocking device further comprises, integral with the first metal plate 100, a stirrup 53 fixed by the lugs 48, made of a material which is both refractory to the fixing temperatures of the pins and capable of possessing at these temperatures elastic properties suitable for the upper part 54 of this stirrup constitutes, at these same temperatures, a spring.
  • This material may for example be bronze-beryllium.
  • In the upper part 54 of this stirrup turns a screw 55 which drives a plate 56 (FIG. 3b) parallel to the upper part 54 of the stirrup.
  • the stirrup and the plate 56 form a system known as the "Mohr clamp".
  • the material intended to produce the slats 51, the backsplash 52 and the plate 56 is chosen from any material whose sole property is to be refractory to the fixing temperatures of the pins.
  • the position of the plate 56 and the dimensions of the bracket 53 are such that the strips 51 can be easily slid under the plate 56 perpendicular to the plane of the first plate 100 on which the bracket is fixed.
  • At least two of these blocking devices will be necessary to block the support 120 on the first plate 100, during the operation of fixing the pins.
  • these two locking devices will be arranged on two opposite parallel sides of the support 120.
  • the support 120 of the multi-spindle housing is made of ceramic
  • the metallic material from which the first plate 100 of the centering device is made must have a coefficient of expansion compatible with ceramic in the temperature range where the support is carried to ensure the fusion of the metallic compound for fixing in the gap 23 between the pins and the walls of the metallized holes of the support 120. In fact it is this single plate 100 which will be brought to the fixing temperatures of the pins at the same time as the housing 120.
  • a ceramic support 120 it can be advantageously chosen to carry out metallization holes using a screen-conductive copper conductive compound under a non-oxidizing atmosphere, for example the compound known from French patent application FR-2 305 478 or FR-2 437 427.
  • the screen-printing ink intended for the metallization of the holes 3 is diffused in the holes for example by suction so as to coat the walls of the hole, then it undergoes baking. Crowns 11 and 12 are produced during the same operation, around the holes 3, on each of the faces 121 and 122 of the substrate 120, respectively. This technique is described for example in French patent application FR-85 05 262.
  • an advantageous metal for forming the pins is for example iron-nickel-cobalt.
  • annular preform 14 of this ternary compound (or any other compound chosen for fixing the pins) can be made, and arranged on the face 122 of the support 120 between the flat head 1 of the pin to be fixed and the annular metallization 12.
  • the plate 101 is threaded onto the rods 2 while the plate 100 keeps the flat heads 1 applied against the preforms 14 and the surface 122 of the support 120.
  • the centering device is then locked in this position by the clamping devices as shown in Figures 3a, 3b and 3c.
  • the lamella 51 are abrod slid, perpendicular to the plane of the first plate 100, in the guide slots 61, of the terminal 60 fixed to the plate 100 ( Figure 3a).
  • the strips 51 are finally slid between two pins in slots 102 provided in the second plate 101. These slots have on the one hand an opening sufficient to allow the strips 51 to penetrate and on the other hand are spaced apart by the same distance as the distance at which the slats are attached to the backsplashes 52 ( Figure 3c).
  • the screw 55 is then tightened.
  • the plate 100 therefore blocks the pins, by pressing on their flat head 1, exactly in the position where they have been centered by the second so-called calibration plate 101 (FIG. 2b).
  • Said plate 101 can then be removed. And only the assembly formed by the plate 100, the support 120 provided with pins and preforms 14, blocked together by the refractory clamping device, is brought to the melting temperature of the fixing alloy which composes the preforms 14 ( Figure 2c).
  • the assembly formed of the centering device-housing support must be such that the plate 100, the preforms 14 and the flat heads 1 are in a lower position. relative to the intervals 23, to the support 120 and to the rods 2.
  • the plate 101 is fragile because it is produced with the precision necessary for centering the pins. This plate will be used for a long time because it is used exclusively for positioning and centering pins, and is never brought to the melting temperatures of the fixing alloy. It therefore has no opportunity to be damaged. On the other hand, the plate 101 which undergoes temperature rises is not very fragile. It will therefore not be easily deteriorated and will also make long use.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Plates (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

L'invention concerne un dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches, boîtier destiné à recevoir une plaquette de circuit intégré, et dont les broches présentent la forme d'une tige munie d'une tête plate, la tige traversant une partie plane dite support du boîtier dans des trous préalablement métallisés et dépassant d'une des faces du support d'une longueur suffisant à assurer la fixation du boîtier, et la tête plate prenant appui sur l'autre face du support par l'intermédiaire d'une forme métallique en un alliage propre à assurer par fusion la fixation des broches. Un tel dispositif de centrage est connu p. esc. du document US-A-3414962.The invention relates to a centering device for carrying out the pinout of a multispindle housing, housing intended to receive an integrated circuit board, and the pins of which have the shape of a rod provided with a flat head, the rod passing through a flat part called the support of the housing in previously metallized holes and protruding from one of the faces of the support of a length sufficient to ensure the fixing of the housing, and the flat head bearing on the other face of the support via of a metallic form in an alloy suitable for ensuring by fusion the fixing of the pins. Such a centering device is known p. esc. from document US-A-3414962.

L'invention concerne également le procédé de réalisation d'un tel boîtier au moyen de ce dispositif.The invention also relates to the method for producing such a housing by means of this device.

Un boîtier multibroches de ce type est décrit dans la demande de brevet européen EP 188 838 publiée le 30 juillet 1986. Mais les dispositifs de centrage des broches utilisés jusqu'à ce jour, et d'ailleurs non décrits dans le document cité, présentent de nombreux inconvénients.A multispindle housing of this type is described in European patent application EP 188 838 published on July 30, 1986. However, the pin centering devices used to date, and moreover not described in the cited document, present many disadvantages.

Ces dispositifs de centrage connus de l'homme du métier sont des matrices en graphite, percées de trous calibrés au diamètre des tiges broches, et répartis selon la disposition géométrique prévue pour ces broches. Ces dispositifs de centrage sont assujettis chacun à un boîtier pendant l'opération de fixation des broches et sont donc soumis en même temps que les boîtiers, aux températures élevées nécessaires à cette fixation. En conséquence, la répétition de ces opérations rend ce genre de dispositif de centrage rapidement hors d'usage. Ces dispositifs de centrage connus ne peuvent être utilisés qu'un très petit nombre de fois.These centering devices known to those skilled in the art are graphite dies, pierced with holes calibrated to the diameter of the pin rods, and distributed according to the geometrical arrangement provided for these pins. These centering devices are each subject to a housing during the fixing operation of the pins and are therefore subjected, together with the housings, to the high temperatures necessary for this fixing. Consequently, the repetition of these operations renders this kind of centering device quickly out of use. These known centering devices can only be used a very small number of times.

Il est évident que cette caractéristique rend le travail de préparation de la fabrication d'une série de boîtiers fort long, puisqu'il faut préparer auparavant une série d'un grand nombre de matrices, lesquelles doivent être réalisées avec précision, et qu'il faut les renouveler fréquemment. Cette préparation est donc de ce fait coûteuse en matière première et en heures de travail.It is obvious that this characteristic makes the preparatory work for the manufacture of a series of very long housings, since it is necessary to prepare beforehand a series of a large number of dies, which must be produced with precision, and which must be renewed frequently. This preparation is therefore expensive in terms of raw material and working hours.

L'utilisation de tels dispositifs de centrage des broches explique en partie le coût extrêmement élevé des boîtiers multibroches à ce jour.The use of such pin centering devices partly explains the extremely high cost of multispindle housings to date.

Or les boîtiers du type multibroches, on entend par là possédant au moins 300 ou 400 broches, sont appelés à prendre dans un proche avenir un grand développement.However, multispindle type housings, by which we mean having at least 300 or 400 pins, are expected to take a big development in the near future.

C'est pourquoi la présente invention propose un dispositif tel que défini dans le préambule, qui permet de pallier ces inconvénients.This is why the present invention provides a device as defined in the preamble, which overcomes these drawbacks.

Selon la présente invention ce dispositif est caractérisé en ce qu'il est constitué de trois parties, la première partie étant formée d'une première plaque métallique, la seconde partie étant formée d'une seconde plaque métallique servant de calibre de centrage des broches percée de trous disposés selon un motif géométrique conforme au motif choisi pour la disposition des broches sur le boîtier et calibrés de manière à assurer à la fois le maintien et le centrage des tiges dans les trous du boîtier, et la troisième partie étant constituée d'un dispositif de serrage pour réaliser le blocage du support du boîtier muni de ses broches sur la première plaque métallique, et en ce que les matériaux choisis pour réaliser la première plaque présentent un coefficient de dilatation proche de celui du support du boîtier dans le domaine de température où se fait la fixation des broches, cette première plaque métallique sur laquelle est bloquée le support du boîtier durant la fixation des broches, étant seule portée à cette température de fixation.According to the present invention, this device is characterized in that it consists of three parts, the first part being formed of a first metal plate, the second part being formed of a second metal plate serving as a gauge for centering the drilled pins. of holes arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing and calibrated so as to both maintain and center the rods in the holes in the housing, and the third part consisting of a clamping device for blocking the support of the housing provided with its pins on the first metal plate, and in that the materials chosen to produce the first plate have a coefficient of expansion close to that of the support of the housing in the temperature range where the pins are fixed, this first metal plate on which the support of the bo is blocked casing during the fixing of the pins, being only brought to this fixing temperature.

Un tel dispositif fournit entre autres, les avantages suivants :
Il est unique pour toute une série de boîtiers fabriqués, c'est-à-dire réutilisable un grand nombre de fois, du fait que la partie qui est réalisée avec précision et qui sert de calibre de centrage des broches, n'est pas portée à des températures élevées en même temps que le boîtier pendant l'opération de fixation des broches. Seule une simple plaque métallique sans précision accompagne le boîtier pendant cette opération.
Among other things, such a device provides the following advantages:
It is unique for a whole series of manufactured cases, that is to say reusable a large number of times, because the part which is produced with precision and which serves as a gauge for centering the pins, is not worn at high temperatures at the same time as the case during the spindle fixing operation. Only a simple metal plate without precision accompanies the case during this operation.

Ce dispositif rend donc la fabrication des boîtiers beaucoup moins coûteuse. D'autre part, les broches des boîtiers réalisés à l'aide de ce dispositif présentent une particulièrement bonne résistance mécanique à l'arrachement.This device therefore makes the manufacture of the boxes much less expensive. On the other hand, the pins of the housings produced using this device have particularly good mechanical resistance to tearing.

L'invention sera mieux comprise à l'aide de la description suivante illustrée par les figures annexées dont :

  • la figure 1a qui représente en coupe simplifiée une partie du boîtier multibroches avant la mise en place des broches ;
  • la figure 1b qui représente, vue en coupe simplifiée, une partie d'un boîtier multibroches munie de ses broches ;
  • la figure 2a qui représente, en position éloignée du boîtier, le dispositif de centrage selon l'invention ;
  • la figure 2b qui représente, en position de centrage des broches, le dispositif de centrage selon l'invention ;
  • la figure 2c qui représente en position de fixation des broches, le dispositif de centrage selon l'invention.
  • les figures 3 qui montrent en détail, le dispositif de serrage du boîtier sur la première plaque du dispositif selon l'invention, la figure 3a étant une vue de côté, la figure 3b étant une vue en coupe perpendiculairement à la vue de la figure 3a, et la figure 3c étant une vue du dessus qui montre les positions relatives d'un dispositif de blocage et des deux plaques formant le dispositif de centage.
The invention will be better understood using the following description illustrated by the appended figures, of which:
  • Figure 1a which shows in simplified section a part of the multi-spindle housing before the introduction of the pins;
  • Figure 1b which shows, in simplified section, a part of a multispindle housing provided with its pins;
  • Figure 2a which shows, in a position remote from the housing, the centering device according to the invention;
  • Figure 2b which shows, in the pin centering position, the centering device according to the invention;
  • Figure 2c which shows in the fixing position of the pins, the centering device according to the invention.
  • Figures 3 which show in detail, the clamping device of the housing on the first plate of the device according to the invention, Figure 3a being a side view, Figure 3b being a sectional view perpendicular to the view of Figure 3a , and Figure 3c being a top view which shows the relative positions of a locking device and the two plates forming the centering device.

Tel que représenté sur la figure 1a, en coupe simplifiée, le boîtier multibroches est principalement constitué d'un support 120 plan, dont les deux faces portent les références 121 et 122. Ce support est percé de trous 3 destinés à recevoir les broches. Chaque trou est métallisé préalablement à la mise en place des broches, par la métallisation 13 complétée par une métallisation annulaire 11 sur la face 121 et 12 sur la face 122. Par le moyen des métallisations annulaires 11, les métallisations des trous, et donc ultérieurement les broches, sont connectées à un circuit 110 éventuellement multicouches. La zone 31 est destinée à recevoir la plaquette de circuit intégré.As shown in Figure 1a, in section simplified, the multispindle housing mainly consists of a support 120 plane, the two faces of which bear the references 121 and 122. This support is pierced with holes 3 intended to receive the pins. Each hole is metallized prior to the positioning of the pins, by metallization 13 supplemented by an annular metallization 11 on the face 121 and 12 on the face 122. By means of the annular metallizations 11, the metallizations of the holes, and therefore subsequently the pins are connected to a circuit 110 which may be multilayer. Zone 31 is intended to receive the integrated circuit board.

La figure 1b représente, en coupe simplifiée, une partie du boîtier, muni de ses broches, tel qu'obtenu au moyen du procédé de réalisation mettant en oeuvre le dispositif de centrage selon l'invention.FIG. 1b shows, in simplified section, a part of the housing, provided with its pins, as obtained by means of the production method using the centering device according to the invention.

Ce boîtier terminé comporte une plaquette de circuit intégré 130 dont les plots de sortie sont reliés au circuit 110 par exemple par des fils souples 6, et qui est protégée par exemple par le capot 141.This finished housing includes an integrated circuit board 130 whose output pads are connected to the circuit 110 for example by flexible wires 6, and which is protected for example by the cover 141.

Ce boîtier comporte en outre des broches 5 formées d'une tige 2 et d'une tête plate 1. Ces broches sont rendues inarrachables du fait que la tête plate 1 des broches prend appui sur la face 122 du support 120, et du fait que les broches sont fixées par un composé métallique emplissant l'intervalle 23 entre les broches et les parois des trous métallisées, jusqu'à former les congés 21 et 22.This housing further comprises pins 5 formed of a rod 2 and a flat head 1. These pins are made tear-off because the flat head 1 of the pins bears on the face 122 of the support 120, and because the pins are fixed by a metallic compound filling the gap 23 between the pins and the walls of the metallized holes, until forming the fillets 21 and 22.

Il est donc indispensable de maintenir par un dispositif de centrage les broches du boîtier, lors de leur fixation dans les trous, afin d'obtenir une bonne répartition du composé métallique de fixation dans l'intervalle 23.It is therefore essential to hold the pins of the housing by a centering device, when fixing them in the holes, in order to obtain a good distribution of the metallic fixing compound in the interval 23.

Pour un boîtier dont le support 120 est en céramique, le dispositif de centrage connu à ce jour de l'homme du métier est formé généralement d'une plaque en graphite percée de trous calibrés. Le graphite possède la propriété d'être facilement usinable et d'un prix modéré. Mais ce matériau a un coefficient de dilatation qui n'est pas des mieux adaptés à celui de la céramique dans le domaine des températures où se fait la fixation des broches. Or, il est porté à la température élevée du composé métallique servant à la fixation des broches, en même temps que le boîtier. Dans ces conditions il est rendu rapidement inutilisable par dégradation thermique et mécanique : il s'effrite apprès un très petit nombre d'utilisation.For a housing whose support 120 is made of ceramic, the centering device known to date for those skilled in the art generally consists of a graphite plate pierced with calibrated holes. Graphite has the property of being easily machinable and of a moderate price. But this material has a coefficient of expansion which is not best suited to that of ceramic in the temperature range where the pins are fixed. However, it is brought to the high temperature of the metal compound used for fixing the pins, at the same time as the housing. Under these conditions, it is quickly rendered unusable by thermal and mechanical degradation: it crumbles after a very small number of uses.

La présente invention propose au contraire un dispositif de centrage réutilisable un grand nombre de fois, et qui peut donc être employé à la fabrication d'un grand nombre de boîtiers.The present invention, on the contrary, proposes a centering device which can be reused a large number of times, and which can therefore be used in the manufacture of a large number of cases.

Tel que représenté sur la figure 2a, en position éloignée du boîtier, ce dispositif de centrage comprend trois parties. La première partie est formée d'une première plaque métallique 100. La seconde partie est formée d'une seconde plaque métallique 101 servant de calibre de centrage des broches, percée de trous 103 disposés selon un motif géométrique conforme au motif choisi pour la disposition des broches sur le boîtier. Ces trous 103 sont calibrés de manière à assurer à la fois le maintien et le centrage des tiges 2 dans les trous 3 du boîtier. La troisième partie est destinée à réaliser le blocage du boîtier 120 sur la première plaque métallique 100, une fois que le centrage des broches a été effectué au moyen du calibre 101.As shown in Figure 2a, in a position remote from the housing, this centering device comprises three parts. The first part is formed by a first metal plate 100. The second part is formed by a second metal plate 101 serving as a gauge for centering the pins, pierced with holes 103 arranged in a geometric pattern conforming to the pattern chosen for the arrangement of the pins on the housing. These holes 103 are calibrated so as to ensure both the maintenance and the centering of the rods 2 in the holes 3 of the housing. The third part is intended to block the housing 120 on the first metal plate 100, once the pins have been centered by means of the caliber 101.

Ce dispositif de blocage est représenté en détail sur les figures 3a et 3b. Il comprend d'une part au moins deux lamelles 51 d'épaisseur inférieure à la distance entre deux broches. Ces lamelles sont solidaires d'un dosseret 52 qui maintient leur écartement. Cet écartement doit correspondre à un intervalle entre un certain nombre de broches. Les lamelles 51 sont montées sur le dosseret 52, parallèles entre elles et perpendiculaires au dosseret. Elle peuvent glisser dans les rainures 61 d'une borne fixe 60 (figure 3a).This locking device is shown in detail in Figures 3a and 3b. On the one hand, it comprises at least two strips 51 of thickness less than the distance between two pins. These strips are integral with a backsplash 52 which maintains their spacing. This spacing must correspond to an interval between a certain number of pins. The slats 51 are mounted on the backsplash 52, mutually parallel and perpendicular to the backsplash. They can slide in the grooves 61 of a fixed terminal 60 (Figure 3a).

Le dispositif de blocage comprend en outre, solidaire de la première plaque métallique 100, un étrier 53 fixé par les pattes 48, réalisé dans un matériau qui est à la fois réfractaire aux températures de fixation des broches et capable de posséder à ces températures des propriétés élastiques aptes à ce que la partie supérieure 54 de cet étrier constitue, à ces mêmes températures, un ressort. Ce matériau peut être par exemple du bronze-béryllium. Dans la partie supérieure 54 de cet étrier, tourne une vis 55 qui entraîne une plaquette 56 (figure 3b) parallèle à la partie supérieure 54 de l'étrier. L'étrier et la plaquette 56 forme un système connu sous le nom de "pince de Mohr". Le matériau destiné à réaliser les lamelles 51, le dosseret 52 et la plaquette 56 est choisi parmi des matériaux quelconques dont la seule propriété est d'être réfractaire aux températures de fixation des broches. La position de la plaquette 56 et les dimensions de l'étrier 53 sont telles que les lamelles 51 peuvent être facilement glissées sous la plaquette 56 perpendiculairement au plan de la première plaque 100 sur laquelle est fixé l'étrier.The blocking device further comprises, integral with the first metal plate 100, a stirrup 53 fixed by the lugs 48, made of a material which is both refractory to the fixing temperatures of the pins and capable of possessing at these temperatures elastic properties suitable for the upper part 54 of this stirrup constitutes, at these same temperatures, a spring. This material may for example be bronze-beryllium. In the upper part 54 of this stirrup, turns a screw 55 which drives a plate 56 (FIG. 3b) parallel to the upper part 54 of the stirrup. The stirrup and the plate 56 form a system known as the "Mohr clamp". The material intended to produce the slats 51, the backsplash 52 and the plate 56 is chosen from any material whose sole property is to be refractory to the fixing temperatures of the pins. The position of the plate 56 and the dimensions of the bracket 53 are such that the strips 51 can be easily slid under the plate 56 perpendicular to the plane of the first plate 100 on which the bracket is fixed.

Au moins deux, de ces dispositif de blocage, seront nécessaires pour bloquer le support 120 sur la première plaque 100, durant l'opération de fixation des broches. A cet effet, ces deux dispositifs de blocage seront disposés sur deux côtés parallèles opposés du support 120.At least two of these blocking devices will be necessary to block the support 120 on the first plate 100, during the operation of fixing the pins. To this end, these two locking devices will be arranged on two opposite parallel sides of the support 120.

Si le support 120 du boîtier multibroches est en céramique le matériau métallique dont est fait la première plaque 100 du dispositif de centrage, doit présenter un coefficient de dilatation compatible avec la céramique dans le domaine de température où est porté le support pour assurer la fusion du composé métallique de fixation dans l'intervalle 23 entre les broches et les parois des trous métallisés du support 120. En effet c'est cette seule plaque 100 qui sera portée aux températures de fixation des broches en même temps que le boîtier 120.If the support 120 of the multi-spindle housing is made of ceramic, the metallic material from which the first plate 100 of the centering device is made, must have a coefficient of expansion compatible with ceramic in the temperature range where the support is carried to ensure the fusion of the metallic compound for fixing in the gap 23 between the pins and the walls of the metallized holes of the support 120. In fact it is this single plate 100 which will be brought to the fixing temperatures of the pins at the same time as the housing 120.

Dans le cas d'un support 120 en céramique il peut être choisi de façon avantageuse de réaliser la métallisation des trous à l'aide d'un composé conducteur au cuivre sérigraphiable sous atmosphère non oxydante comme par exemple le composé connu de la demande de brevet français FR-2 305 478 ou bien FR-2 437 427.In the case of a ceramic support 120, it can be advantageously chosen to carry out metallization holes using a screen-conductive copper conductive compound under a non-oxidizing atmosphere, for example the compound known from French patent application FR-2 305 478 or FR-2 437 427.

Ces composés admettent une température de cuisson sous azote comprise entre 850°C et 950°C et une très bonne conductivité électrique de l'ordre de 1,5 milliohms par carré pour des couches d'épaisseur 20/um (20 microns).These compounds admit a cooking temperature under nitrogen of between 850 ° C. and 950 ° C. and a very good electrical conductivity of the order of 1.5 milliohms per square for layers of thickness 20 / μm (20 microns).

L'encre sérigraphiable destinée à la métallisation des trous 3 est diffusée dans le trous par exemple par aspiration de manière à enduire les parois du trou, puis elle subit une cuisson. Des couronnes 11 et 12 sont réalisées au cours de la même opération, autour des trous 3, sur chacune des faces 121 et 122 du substrat 120, respectivement. Cette technique est décrite par exemple dans la demande de brevet français FR - 85 05 262.The screen-printing ink intended for the metallization of the holes 3 is diffused in the holes for example by suction so as to coat the walls of the hole, then it undergoes baking. Crowns 11 and 12 are produced during the same operation, around the holes 3, on each of the faces 121 and 122 of the substrate 120, respectively. This technique is described for example in French patent application FR-85 05 262.

D'autre part, pour cette application, un métal avantageux pour former les broches est par exemple le fer-nickel-cobalt.On the other hand, for this application, an advantageous metal for forming the pins is for example iron-nickel-cobalt.

Enfin l'étude des coefficients de dilatation de la céramique dans le domaine des températures comprises entre 750°C et 850°C montre que les matériaux tels que le molybdène, ou les alliages de fer-nickel-cobalt présentent des coefficients de dilatation parfaitement adaptés à celui de la céramique dans ce domaine de températures. Ces matériaux seront donc parfaitement appropriés à constituer la première plaque 100 du dispositif de centrage selon l'invention.Finally, the study of the expansion coefficients of ceramics in the range of temperatures between 750 ° C and 850 ° C shows that materials such as molybdenum or iron-nickel-cobalt alloys have perfectly adapted expansion coefficients to that of ceramics in this temperature range. These materials will therefore be perfectly suitable for constituting the first plate 100 of the centering device according to the invention.

Il pourra alors être choisi, pour réaliser la fixation des broches et emplir l'intervalle 23, par exemple un alliage d'argent (≃ 71 %), cuivre ( ≃28 %), nickel ( ≃ 1 % en poids) qui présente un intervalle de température entre solidus et liquidus compris entre 780°C et 795°C permettant un cycle de fusion peu critique.It can then be chosen to fix the pins and fill the gap 23, for example a silver alloy (≃ 71%), copper (≃28%), nickel (≃ 1% by weight) which has a temperature range between solidus and liquidus between 780 ° C and 795 ° C allowing an uncritical melting cycle.

A cet effet une préforme annulaire 14 de ce composé ternaire (ou tout autre composé choisi pour la fixation des broches) peut être faite, et disposée sur la face 122 du support 120 entre la tête plate 1 de la broche à fixer et la métallisation annulaire 12.For this purpose an annular preform 14 of this ternary compound (or any other compound chosen for fixing the pins) can be made, and arranged on the face 122 of the support 120 between the flat head 1 of the pin to be fixed and the annular metallization 12.

Les broches 5 et les préformes annulaire 14 étant mises en place, la plaque 101 est enfilée sur les tiges 2 tandis que la plaque 100 maintient les têtes plates 1 appliquées contre les préformes 14 et la surface 122 du support 120.The pins 5 and the annular preforms 14 being put in place, the plate 101 is threaded onto the rods 2 while the plate 100 keeps the flat heads 1 applied against the preforms 14 and the surface 122 of the support 120.

Le dispositif de centrage est alors bloqué dans cette position par les dispositifs de serrage de la façon suivante illustrée par les figures 3a, 3b et 3c.The centering device is then locked in this position by the clamping devices as shown in Figures 3a, 3b and 3c.

Pour chacun des au moins deux dispositifs de blocage, les lamelle 51 sont d'abrod glissées, perpendiculairement au plan de la première plaque 100, dans les fentes de guidage 61, de la borne 60 fixée à la plaque 100 (Figure 3a).For each of the at least two locking devices, the lamella 51 are abrod slid, perpendicular to the plane of the first plate 100, in the guide slots 61, of the terminal 60 fixed to the plate 100 (Figure 3a).

Puis, les lamelles 51 sont ensuite glissées, perpendiculairement au plan de la première plaque 100, sous la plaquette 56 de la pince de Mohr, la vis 55 ayant été débloquée pour permettre leur passage (Figure 3b).Then, the strips 51 are then slid, perpendicular to the plane of the first plate 100, under the plate 56 of the Mohr forceps, the screw 55 having been released to allow their passage (Figure 3b).

Les lamelles 51 sont enfin glissées entre deux broches dans des fentes 102 prévues dans la seconde plaque 101. Ces fentes présentent d'une part une ouverture suffisant à laisser pénétrer les lamelles 51 et d'autre part sont distantes entre elles de la même distance que la distance de fixation des lamelles sur les dosserets 52 (Figure 3c).The strips 51 are finally slid between two pins in slots 102 provided in the second plate 101. These slots have on the one hand an opening sufficient to allow the strips 51 to penetrate and on the other hand are spaced apart by the same distance as the distance at which the slats are attached to the backsplashes 52 (Figure 3c).

La vis 55 est alors serrée. La plaque 100 bloque donc les broches, en appuyant sur leur tête plate 1, exactement dans la position où elles ont été centrées par la seconde plaque 101 dite de calibrage (Figure 2b).The screw 55 is then tightened. The plate 100 therefore blocks the pins, by pressing on their flat head 1, exactly in the position where they have been centered by the second so-called calibration plate 101 (FIG. 2b).

Ladite plaque 101 peut alors être retirée. Et seul l'ensemble formé par la plaque 100, le support 120 muni des broches et des préformes 14, bloqués ensemble par le dispositif de serrage réfractaire, est porté à la température de fusion de l'alliage de fixation qui compose les préformes 14 (Figure 2c).Said plate 101 can then be removed. And only the assembly formed by the plate 100, the support 120 provided with pins and preforms 14, blocked together by the refractory clamping device, is brought to the melting temperature of the fixing alloy which composes the preforms 14 ( Figure 2c).

Pour obtenir une bonne répartition du composé de fixation des broches, dans les intervalles 23, l'ensemble formé du dispositif de centrage-support de boîtier doit être tel que la plaque 100, les préformes 14 et les têtes plates 1 sont dans une position inférieure par rapport aux intervalles 23, au support 120 et aux tiges 2.To obtain a good distribution of the fixing component of the pins, in the intervals 23, the assembly formed of the centering device-housing support must be such that the plate 100, the preforms 14 and the flat heads 1 are in a lower position. relative to the intervals 23, to the support 120 and to the rods 2.

En effet, lorsque le composé de fixation des broches est porté à sa température de fusion, les préformes 14 fondent et le composé de fixation "monte" dans les intervalles 23, par capillarité.In fact, when the fixing compound of the pins is brought to its melting temperature, the preforms 14 melt and the fixing compound "rises" in the intervals 23, by capillarity.

Le procédé mettant en oeuvre le dispositif de centrage selon l'invention comprend donc les étapes de :

  • a) enfilage des broches 5 dans les trous métallisés 3 du support 120, la tête plate 1 des broches s'appuyant sur la surface 122 de ce support munie des métallisations annulaires 12 et des préformes annulaires 14 du composé de fixation ;
  • b) maintien des têtes plates 1 à l'aide de la plaque 100 du dispositif ;
  • c) enfilage des tiges 2 dans les trous 103 de la plaque 101 du dispositif afin d'assurer leur centrage ;
  • d) fixation du boîtier 120 centré sur la plaque 100 au moyen du dispositif de serrage ;
  • e) enlèvement de la plaque 101 qui est mise de côté ;
  • f) passage de l'ensemble boîtier-plaque 100 bloqué, à la température propre à assurer la fusion des préformes 14 ;
  • g) refroidissement, démontage et récupération de la plaque 100 pour une utilisation ultérieure.
The method using the centering device according to the invention therefore comprises the steps of:
  • a) threading of the pins 5 into the metallized holes 3 of the support 120, the flat head 1 of the pins resting on the surface 122 of this support provided with annular metallizations 12 and annular preforms 14 of the fixing compound;
  • b) holding the flat heads 1 using the plate 100 of the device;
  • c) threading the rods 2 into the holes 103 of the plate 101 of the device in order to ensure their centering;
  • d) fixing of the housing 120 centered on the plate 100 by means of the clamping device;
  • e) removing the plate 101 which is set aside;
  • f) passage of the blocked housing-plate 100 assembly, at the temperature suitable for ensuring the fusion of the preforms 14;
  • g) cooling, dismantling and recovery of the plate 100 for later use.

Dans le dispositif de centrage selon l'invention, il est clair que seule la plaque 101 est fragile du fait qu'elle est réalisée avec la précision nécessaire au centrage des broches. Or cette plaque fera un long usage car elle est utilisée exclusivement pour la mise en place et le centrage des broches, et n'est jamais portée aux températures de fusion de l'alliage de fixation. Elle n'a donc aucune occasion d'être détériorée. Par contre la plaque 101 qui subit les montées en températures est peu fragile. Elle ne sera donc pas non plus facilement détériorée et fera également un long usage.In the centering device according to the invention, it is clear that only the plate 101 is fragile because it is produced with the precision necessary for centering the pins. This plate will be used for a long time because it is used exclusively for positioning and centering pins, and is never brought to the melting temperatures of the fixing alloy. It therefore has no opportunity to be damaged. On the other hand, the plate 101 which undergoes temperature rises is not very fragile. It will therefore not be easily deteriorated and will also make long use.

Les boîtiers réalisés conformément à l'invention sont donc d'un coût réduit puisque le dispositif de centrage est récupérable et que le procédé de brochage est simplifié. D'autre part ces boîtiers sont d'une grande solidité puisque les broches sont inarrachables.The boxes produced in accordance with the invention are therefore of reduced cost since the centering device is recoverable and the broaching process is simplified. On the other hand these boxes are very solid since the pins are tear-away.

Claims (7)

  1. A centering device for realizing the pin insertion of a multipin case, which case is designed to accommodate an integrated circuit board (130) and whose pins (5) have the form of a stem (2) provided with a flat head (1), the stem (2) passing through a flat portion called support of the case (120) in previously metallized holes (3) and projecting from one of the surfaces (121) of the support (120) over a sufficient length to ensure the fixation of the case, while the flat head (1) makes contact with the other surface (122) of the support (120) via a metal form (14) made of an alloy suitable for ensuring the fixation of the pins by fusion, characterized in that it consists of three parts, the first part being formed by a first metal plate (100), the second part being formed by a second metal plate (101) serving as a pin centering jig (5) having pierced holes (103) arranged in accordance with a geometric pattern conforming to the pattern chosen for the disposition of the pins (5) on the case (120) and calibrated in such a way that the stems (2) are simultaneously held and centered in the holes (3) of the case (120), and the third part being formed by a locking device for clamping the support (120) of the case provided with its pins (5) on the first metal plate (100), and in that the materials chosen for realizing the first plate (100) have a coefficient of expansion close to that of the support (120) of the case in the temperature region in which the pins (5) are fixed, this first metal plate (100) on which the support (120) of the case is clamped during fixing of the pins (5) being the only part to be brought to this fixation temperature.
  2. A centering device as claimed in Claim 1, characterized in that the locking device for clamping the support (120) of the case on the first metal plate (100) comprises:
    a) at least two parallel strips (51) of a thickness smaller than the distance between two pins (5), forming one whole with a backplate (52) which maintains their interspacing at a distance corresponding to the distance between several pins (5) and capable of gliding perpendicularly to the first metal plate (100) in grooves (61) made in a retaining block (60) fixed to this first metal plate (100);
    b) a bracket (53) forming one whole with this first metal plate (100), placed between the retaining block (60) and the area of the first plate (100) occupied by the support (120) of the case, and made of a refractory material which has elastic properties at the pin fixing temperature;
    c) a screw (55) turning in the upper portion of the bracket (53) and moving a plate (56) which runs parallel to the upper portion of the bracket (53);
    the position of the plate (56) and the dimensions of the bracket (53) being such that the ends of the strips (51) can glide below the plate (56), so that they can be put into position above the support (120) of the case between the pins (5) thanks to grooves (102) whose distance is the same as that of the strips (51) and which are provided in a second plate (101); while the locking effect is obtained by tightening of the screw (55).
  3. A centering device as claimed in Claim 2, characterized in that the bracket of the locking device is made of beryllium bronze.
  4. A centering device as claimed in the Claims 1 to 3, characterized in that it comprises at least two locking devices situated on either side of the case support on parallel sides.
  5. A centering device as claimed in the Claims 1 to 4, characterized in that provision is made for realizing the pin insertion in a case having a support (120) of ceramic material, in that the materials to be used for the first plate (100) are chosen from molybdenum and iron-nickel-cobalt alloys, the fixation of the pins (5) being effected by means of a metal alloy having a fusion temperature in the order of 800°C.
  6. A manufacturing process in which a centering device as claimed in any one of the Claims 1 to 5 is used, characterized in that it comprises the following steps:
    a) threading of the pins (5) in the metallized holes (3) of the support (120), the flat heads (1) of the pins (5) bearing on the lower surface (122) of this support (120) provided with ring-shaped metallizations (12) and pre-shaped rings (14) made of the fixation alloy;
    b) holding of the flat heads (1) by means of the first plate (100) of the device;
    c) threading of the stems (2) in the holes (103) of the second plate 101 of the device in order to ensure their central position;
    d) fixing of the case (120) centered on the first plate (100) by means of the locking devices;
    e) lifting of the second plate (101), which is put aside;
    f) bringing the assembly of the case and the first plate (100) locked together to the correct temperature for obtaining the fusion of the pre-formed metal fixation rings (14);
    g) cooling down, dismantling, and recuperation of the plate (100) for further use.
  7. A manufacturing process as claimed in Claim 6, in as far as it depends on the preceding Claim 5, characterized in that the pins are made from an iron-nickel-cobalt alloy, and in that the pre-shaped rings forming the metal fixation alloy are made of a ternary alloy of silver-copper-nickel in the approximate weight ratios 71%, 28%, 1%, respectively, of which the fusion temperature is in the order of 800°C.
EP86202170A 1985-12-13 1986-12-04 Centering device for the realization of the pin insertion of a multipin case Expired - Lifetime EP0228119B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8518471 1985-12-13
FR8518471A FR2591810B1 (en) 1985-12-13 1985-12-13 CENTERING DEVICE FOR REALIZING THE BLOCKING OF A MULTI-PIN HOUSING

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EP0228119A1 EP0228119A1 (en) 1987-07-08
EP0228119B1 true EP0228119B1 (en) 1991-04-03

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EP (1) EP0228119B1 (en)
JP (1) JPH0752665B2 (en)
DE (1) DE3678547D1 (en)
FR (1) FR2591810B1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127150A (en) * 1989-12-18 1992-07-07 Texas Instruments Incorporated Hermetic motor protector
US5067228A (en) * 1990-05-09 1991-11-26 Saratoga Spa & Bath Co. Apparatus and method for blind attachment of a liner to a pool support structure
US5303466A (en) * 1991-03-25 1994-04-19 Daiichi Denshi Kogyo Kabushiki Kaisha Method of mounting surface connector
FR2733553B1 (en) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq LAMINATION DEVICE FOR SOLIDARIZING A METAL STRIP AND A STRIP OF INSULATING MATERIAL
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design
CN100389952C (en) 1999-12-13 2008-05-28 陶氏环球技术公司 Lightweight tire support and composition and method for making tire support
US6415493B1 (en) * 2000-03-29 2002-07-09 Lucent Technologies Inc. Method and apparatus for precise positioning of a circuit board to a mounting plate
US6457224B1 (en) * 2000-08-21 2002-10-01 Advanced Micro Devices, Inc. Dambar punch setup jig
CN1326683C (en) * 2000-09-11 2007-07-18 陶氏环球技术公司 Method and device for preparing a tire support
US6742246B2 (en) * 2002-01-23 2004-06-01 Safety Syringes, Inc. Systems for assembling injection devices
US6874219B2 (en) * 2003-05-22 2005-04-05 Hitachi Global Storage Technologies Netherlands B.V. System, method, and apparatus for preventing rotation of a disk clamp while being assembled to the hub of a spindle motor in a hard disk drive and fastener centering features
DE102005056378A1 (en) * 2005-11-24 2007-05-31 Heiko Schmidt Insertion and anchoring process for connecting element in workpiece involves jointing connecting element to workpiece via seeking and/or centering element
US8256754B2 (en) * 2007-12-12 2012-09-04 Applied Materials, Inc. Lift pin for substrate processing
US9821424B2 (en) * 2014-10-03 2017-11-21 GM Global Technology Operations LLC Manufacturing fixture

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276854A (en) * 1963-11-05 1966-10-04 Western Electric Co Method and apparatus for assembling wires in a plurality of apertured parts
US3299502A (en) * 1964-10-01 1967-01-24 Western Electric Co Methods and apparatus for assembling articles
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices
US3414962A (en) * 1966-07-25 1968-12-10 Atlas Chem Ind Electrode assembly jig and method thereof
FR2031024A5 (en) * 1969-03-08 1970-11-13 Bosch
US3745422A (en) * 1972-03-07 1973-07-10 Motorola Inc Power semi-conductor device mountable on either its top or bottom surface
US3978579A (en) * 1974-08-30 1976-09-07 Rca Corporation Automatic assembly of semiconductor devices
US3992770A (en) * 1974-08-30 1976-11-23 Rca Corporation Automatic assembly of semiconductor devices
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
JPS5842262A (en) * 1981-09-07 1983-03-11 Toshiba Corp Connection of lead wire for hybrid integrated circuit

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EP0228119A1 (en) 1987-07-08
JPH0752665B2 (en) 1995-06-05
DE3678547D1 (en) 1991-05-08
FR2591810A1 (en) 1987-06-19
US4741090A (en) 1988-05-03
JPS62145677A (en) 1987-06-29
FR2591810B1 (en) 1988-02-19

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