FR2591810B1 - Dispositif de centrage pour la realisation du brochage d'un boitier multibroches - Google Patents

Dispositif de centrage pour la realisation du brochage d'un boitier multibroches

Info

Publication number
FR2591810B1
FR2591810B1 FR8518471A FR8518471A FR2591810B1 FR 2591810 B1 FR2591810 B1 FR 2591810B1 FR 8518471 A FR8518471 A FR 8518471A FR 8518471 A FR8518471 A FR 8518471A FR 2591810 B1 FR2591810 B1 FR 2591810B1
Authority
FR
France
Prior art keywords
realizing
blocking
centering device
pin housing
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8518471A
Other languages
English (en)
Other versions
FR2591810A1 (fr
Inventor
Michel Jean Claude Monnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Original Assignee
Laboratoires dElectronique et de Physique Appliquee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique et de Physique Appliquee filed Critical Laboratoires dElectronique et de Physique Appliquee
Priority to FR8518471A priority Critical patent/FR2591810B1/fr
Priority to US06/937,640 priority patent/US4741090A/en
Priority to EP86202170A priority patent/EP0228119B1/fr
Priority to DE8686202170T priority patent/DE3678547D1/de
Priority to JP61295050A priority patent/JPH0752665B2/ja
Publication of FR2591810A1 publication Critical patent/FR2591810A1/fr
Application granted granted Critical
Publication of FR2591810B1 publication Critical patent/FR2591810B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53978—Means to assemble or disassemble including means to relatively position plural work parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Of Plates (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8518471A 1985-12-13 1985-12-13 Dispositif de centrage pour la realisation du brochage d'un boitier multibroches Expired FR2591810B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8518471A FR2591810B1 (fr) 1985-12-13 1985-12-13 Dispositif de centrage pour la realisation du brochage d'un boitier multibroches
US06/937,640 US4741090A (en) 1985-12-13 1986-12-03 Centering device for inserting pins in a multipin housing
EP86202170A EP0228119B1 (fr) 1985-12-13 1986-12-04 Dispositif de centrage pour la réalisation du brochage d'un boîtier multibroches
DE8686202170T DE3678547D1 (de) 1985-12-13 1986-12-04 Zentrierungsvorrichtung zur durchfuehrung des stiftesteckens eines mehrsteckstiftegehaeuses.
JP61295050A JPH0752665B2 (ja) 1985-12-13 1986-12-12 多数ピンハウジングへのピン挿入用センタリング装置およびその使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8518471A FR2591810B1 (fr) 1985-12-13 1985-12-13 Dispositif de centrage pour la realisation du brochage d'un boitier multibroches

Publications (2)

Publication Number Publication Date
FR2591810A1 FR2591810A1 (fr) 1987-06-19
FR2591810B1 true FR2591810B1 (fr) 1988-02-19

Family

ID=9325750

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8518471A Expired FR2591810B1 (fr) 1985-12-13 1985-12-13 Dispositif de centrage pour la realisation du brochage d'un boitier multibroches

Country Status (5)

Country Link
US (1) US4741090A (fr)
EP (1) EP0228119B1 (fr)
JP (1) JPH0752665B2 (fr)
DE (1) DE3678547D1 (fr)
FR (1) FR2591810B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127150A (en) * 1989-12-18 1992-07-07 Texas Instruments Incorporated Hermetic motor protector
US5067228A (en) * 1990-05-09 1991-11-26 Saratoga Spa & Bath Co. Apparatus and method for blind attachment of a liner to a pool support structure
US5303466A (en) * 1991-03-25 1994-04-19 Daiichi Denshi Kogyo Kabushiki Kaisha Method of mounting surface connector
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design
WO2001042000A1 (fr) * 1999-12-13 2001-06-14 The Dow Chemical Company Support leger pour pneu, composition et procede servant a preparer un support de pneu
US6415493B1 (en) * 2000-03-29 2002-07-09 Lucent Technologies Inc. Method and apparatus for precise positioning of a circuit board to a mounting plate
US6457224B1 (en) * 2000-08-21 2002-10-01 Advanced Micro Devices, Inc. Dambar punch setup jig
BR0114127A (pt) * 2000-09-11 2003-07-22 Dow Global Technologies Inc Método de dispositivo para preparar suporte de pneu
US6742246B2 (en) * 2002-01-23 2004-06-01 Safety Syringes, Inc. Systems for assembling injection devices
US6874219B2 (en) * 2003-05-22 2005-04-05 Hitachi Global Storage Technologies Netherlands B.V. System, method, and apparatus for preventing rotation of a disk clamp while being assembled to the hub of a spindle motor in a hard disk drive and fastener centering features
DE102005056378A1 (de) * 2005-11-24 2007-05-31 Heiko Schmidt Verfahren zum Einbringen und Verankern wenigstens eines Verbindungselementes in einem Werkstück sowie Vorrichtung zum Durchführen des Verfahrens
US8256754B2 (en) * 2007-12-12 2012-09-04 Applied Materials, Inc. Lift pin for substrate processing
US9821424B2 (en) * 2014-10-03 2017-11-21 GM Global Technology Operations LLC Manufacturing fixture

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276854A (en) * 1963-11-05 1966-10-04 Western Electric Co Method and apparatus for assembling wires in a plurality of apertured parts
US3299502A (en) * 1964-10-01 1967-01-24 Western Electric Co Methods and apparatus for assembling articles
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices
US3414962A (en) * 1966-07-25 1968-12-10 Atlas Chem Ind Electrode assembly jig and method thereof
FR2031024A5 (fr) * 1969-03-08 1970-11-13 Bosch
US3745422A (en) * 1972-03-07 1973-07-10 Motorola Inc Power semi-conductor device mountable on either its top or bottom surface
US3992770A (en) * 1974-08-30 1976-11-23 Rca Corporation Automatic assembly of semiconductor devices
US3978579A (en) * 1974-08-30 1976-09-07 Rca Corporation Automatic assembly of semiconductor devices
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
JPS5842262A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 混成集積回路のリ−ド線接続方法

Also Published As

Publication number Publication date
JPS62145677A (ja) 1987-06-29
FR2591810A1 (fr) 1987-06-19
EP0228119A1 (fr) 1987-07-08
JPH0752665B2 (ja) 1995-06-05
US4741090A (en) 1988-05-03
EP0228119B1 (fr) 1991-04-03
DE3678547D1 (de) 1991-05-08

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse