EP0189781B1 - Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc - Google Patents

Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc Download PDF

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Publication number
EP0189781B1
EP0189781B1 EP86100419A EP86100419A EP0189781B1 EP 0189781 B1 EP0189781 B1 EP 0189781B1 EP 86100419 A EP86100419 A EP 86100419A EP 86100419 A EP86100419 A EP 86100419A EP 0189781 B1 EP0189781 B1 EP 0189781B1
Authority
EP
European Patent Office
Prior art keywords
flat coil
spiral
layer
coil support
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP86100419A
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German (de)
English (en)
Other versions
EP0189781A1 (fr
Inventor
Georg Naser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0189781A1 publication Critical patent/EP0189781A1/fr
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Publication of EP0189781B1 publication Critical patent/EP0189781B1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances

Definitions

  • the invention relates to a method for producing a spiral flat coil for a shock wave tube and a spiral flat coil for the shock wave tube. It relates to a flat coil for a shock wave tube for crushing concrements in a patient, for example kidney stones.
  • DE-A 3 312 014 Shock wave tubes of this type have been known per se for a long time ("Akustician Beihefte", 1962, Issue 1, pages 185 to 202). According to recent investigations, e.g. specified in DE-A 3 312 014, used in medical technology for crushing concrements in the body of a patient. DE-A 3 312 014 describes a shock wave tube for this purpose. Due to the high pressure pulse emitted of approx. 100 bar, the materials of such a shock wave tube are subjected to high loads with every shock wave emission. The discharge coil and the membrane in particular are exposed to high mechanical forces. In the subject of DE-A 3 312 014 (Fig. 2) a spherical cap-shaped coil is provided, the spherical cap shape of which is e.g.
  • DE-A 3 312 014 (FIG. 1) describes a spherical cap-shaped coil which is produced by spirally winding a wire and arranging it on a spherical cap-shaped surface of a housing part. This procedure is also disadvantageous, since it involves manufacturing problems to wind such a coil. In order to ensure effective insulation between the coil and the membrane upstream of it, in the case of DE-A 3 312 014 an insulating film is arranged between the components mentioned.
  • the object of the invention is to design a method of the type mentioned at the outset in such a way that a flat coil with any spiral shape can be produced using simple means.
  • the first-mentioned object is achieved according to claim 1, characterized in that a mask in spiral form is photographically transferred to a circuit board with a carrier layer, with an electrically conductive layer above and with a light-sensitive top layer, that the top layer is developed so that the spaces between the spiral paths of the transferred mask are etched away from the electrically conductive layer, that the spiral paths remaining on the electrically conductive layer are galvanically reinforced and that the printed circuit board is then glued onto a flat coil support.
  • the advantage of the method is that coils with any spiral shape can be easily produced. No complex mechanical processing tools such as a lathe or milling machine are required for this.
  • a particularly advantageous embodiment of the method is that the circuit board is glued to the flat coil carrier with its surface carrying the spiral.
  • this measure ensures that the non-conductive part of the circuit board simultaneously serves as an insulating film between the coil and a membrane located in front of it.
  • the assembly of the essential components of the shock wave tube, namely flat coil, insulating film and membrane, is considerably simplified.
  • the flat coil according to the invention a special insulating film between the flat coil and a membrane in front of it is therefore superfluous, since the carrier layer fulfills this function.
  • the flat coil according to the invention thus enables a simplified structure of a shock wave tube.
  • FIG 1 designates a shock wave tube, which in its essential components consists of a flat coil carrier 3 associated spiral coil 4 (shown in Figures 3 and 4), an insulating film 5 and a membrane 7. Holding means for the coil 4, the insulating film 5 and the membrane 7 are not shown.
  • a high-voltage pulse of short duration is applied to the flat coil 4 in order to trigger a shock wave. Due to the electromagnetic interaction of the coil 4 with the membrane 7, the membrane 7 is knocked away from the coil 4; it creates the shock wave.
  • the coil 4 must have a defined shape for the shock wave tube 1 to function properly and to produce a certain desired wave shape.
  • the surface of the coil 4 can e.g. be flat if the generation of a flat shock wave is desired, or concave dome-shaped if the shock wave generated thereby is to focus on a point.
  • the voltage pulses that act on the coil 4 are in the order of magnitude between 10 and 30 kV.
  • a round ceramic disk is assumed.
  • This disc has, for example, a thickness of 40 mm with a diameter of 155 mm.
  • a printed circuit board 9 is another starting material. It is provided for the production of the actual coil 4.
  • the printed circuit board 9 consists of an electrically non-conductive carrier layer 11, which preferably consists of polyimide. This polyimide film can have a thickness of approximately 200 J lm.
  • One side of the carrier layer 11 is provided with a thin layer 13 made of an electrically conductive substance, in particular a copper layer of approximately 7 ⁇ m thick.
  • a light-sensitive top layer 15 is in turn applied to the copper layer 13.
  • FIG. 2 shows the flat coil carrier 3 and the printed circuit board 9 processed after a first and second method step.
  • a mask not shown
  • the printed circuit board 9 shown in FIG. 2 results between the spiral paths 13a. It consists of the carrier layer 11 and parts of the original copper layer 13.
  • the spiral paths 13a now form a flat coil 4 with a spiral course of the turns.
  • FIG. 3 shows the spiral copper layer 13a after the latter has been galvanized to a total thickness of e.g. 7 ⁇ m to a total thickness of e.g. approx. 150 J.Lm was reinforced.
  • the spiral produced in this way with the spiral ducts 13a is suitable for withstanding the high voltage and current surge during the generation of shock waves if the individual spiral ducts 13a are at a sufficient distance from one another.
  • the finished arrangement of flat coil carrier 3 and integrated coil 4 is shown in FIG.
  • the spaces between the spiral copper layer 13a have now been filled with a synthetic resin 17.
  • the coil 4 is glued to the end of the flat coil carrier 3.
  • the entire end face of the flat coil carrier 3 can also be coated with synthetic resin in one operation.
  • the printed circuit board 9 can be glued both to the carrier layer 11 and to the layer 13 against the flat coil carrier 3.
  • the advantage of the second embodiment is that the carrier layer 11 can simultaneously serve as an insulating film 5 in order to electrically isolate the coil 4 from the membrane 7.
  • Aluminum oxide ceramics are preferably used as materials for the flat coil carrier 3, but good results have also been achieved with filled and unfilled epoxy resin.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Surgical Instruments (AREA)

Claims (9)

1. Procédé pour fabriquer une bobine plate (4) de forme spirale pour un tube à onde de choc, caractérisé par le fait qu'on transfère par voie photographique un masque possédant une forme spirale sur une plaquette à circuits imprimés (9) possédant une couche de support (11), une couche électriquement conductrice (13) située sur la précédente et une couche supérieure photosensible (15), qu'on développe la couche supérieure (15), qu'on dégage par corrosion les zones intercalaires présentes entre les filets spiraux (13a) du masque transféré, à partir de la couche électriquement conductrice (13), qu'on renforce galvaniquement les filets spiraux (13a) subsistant dans la couche électriquement conductrice (16) et qu'on colle ensuite la plaquette à circuits imprimés (9) sur un support (3) de la bobine plate.
2. Procédé suivant la revendication 1, caractérisé par le fait qu'on utilise comme couche de support (11) une feuille de polyamide et comme couche électriquement conductrice (13) une couche de cuivre.
3. Procédé suivant la revendication 2, caractérisé par le fait que la feuille de polyimide (11) possède une épaisseur d'environ 200 Jlm et que la couche de cuivre (13) possède une épaisseur d'environ 7 µm (figures 1, 2).
4. Procédé suivant l'une des revendications 1 à 3, caractérisé par le fait qu'on renforce galvaniquement les filets spiraux (13a) pour qu'ils atteignent une épaisseur d'environ 150 µm (figure 3).
5. Procédé suivant l'une des revendications 1 à 4, caractérisé par le fait qu'on colle la plaquette à circuits imprimés (9) par sa surface portant les filets spiraux (13a) sur le support (3) de la bobine plate.
6. Bobine plate de forme spirale pour un tube à ondes de choc, comportant
a) une couche de support (11) non conductrice du point de vue électrique et présentant une certaine étendue en surface,
b) une spirale (13a) en cuivre fixée sur la couche de support (11), et
c) un support en forme de disque (3) pour la bobine plate, constitué en un matériau réverbérant du point de vue acoustique et non conducteur du point de vue électrique, la couche de support (11) étant disposée de manière que la spirale (13a) en cuivre, qui est fixée sur cette couche, soit tournée vers le support (3) de la bobine plate, et ce support (3) comportant la spirale (13a) en cuivre et/ou la couche de support (11) étant collé de sorte que la spirale (13a) est disposée en sandwich entre le support (3) de la bobine plate et la couche de support (11).
7. Bobine plate suivant la revendication 6, caractérisé par le fait qu'il est prévu une céramique comme matériau pour le support (3) de la bobine plate.
8. Bobine plate suivant la revendication 6, caractérisée par le fait qu'il est prévu une résine époxy comme matériau pour le support (3) de la bobine plate.
9. Bobine plate suivant l'une des revendications 6 à 8, caractérisée par le fait qu'il est prévu une résine (17) pour le collage du support (3) de la bobine plate portant la spirale (13a) en cuivre et/ou la couche de support (11).
EP86100419A 1985-01-28 1986-01-14 Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc Expired EP0189781B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853502770 DE3502770A1 (de) 1985-01-28 1985-01-28 Verfahren zur herstellung einer flachspule sowie flachspule fuer ein stosswellenrohr
DE3502770 1985-01-28

Publications (2)

Publication Number Publication Date
EP0189781A1 EP0189781A1 (fr) 1986-08-06
EP0189781B1 true EP0189781B1 (fr) 1989-05-03

Family

ID=6260970

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86100419A Expired EP0189781B1 (fr) 1985-01-28 1986-01-14 Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc

Country Status (3)

Country Link
EP (1) EP0189781B1 (fr)
JP (1) JPS61176334A (fr)
DE (2) DE3502770A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006040728A1 (de) * 2006-08-31 2008-03-13 Siemens Ag Verfahren und Vorrichtung zum Herstellen eines elektronischen Moduls

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026470A (en) * 1989-12-19 1991-06-25 International Business Machines Sputtering apparatus
JPH05100223A (ja) * 1991-04-03 1993-04-23 Riyoosan:Kk 光源装置
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
DE10144422B4 (de) 2001-09-10 2004-07-15 Siemens Ag Stosswellenquelle
DE10144421B4 (de) 2001-09-10 2004-07-15 Siemens Ag Stosswellenquelle

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189767A (en) * 1963-01-28 1965-06-15 Gen Electric Ultrasonic transmitting means and method of producing same
JPS4978159A (fr) * 1972-12-05 1974-07-27
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors
DE3312014C2 (de) * 1983-04-02 1985-11-07 Wolfgang Prof. Dr. 7140 Ludwigsburg Eisenmenger Einrichtung zur berührungsfreien Zertrümmerung von Konkrementen im Körper von Lebewesen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006040728A1 (de) * 2006-08-31 2008-03-13 Siemens Ag Verfahren und Vorrichtung zum Herstellen eines elektronischen Moduls

Also Published As

Publication number Publication date
EP0189781A1 (fr) 1986-08-06
DE3663208D1 (en) 1989-06-08
DE3502770A1 (de) 1986-07-31
JPH0459897B2 (fr) 1992-09-24
JPS61176334A (ja) 1986-08-08

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