EP0135597B1 - Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten - Google Patents

Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten Download PDF

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Publication number
EP0135597B1
EP0135597B1 EP83109475A EP83109475A EP0135597B1 EP 0135597 B1 EP0135597 B1 EP 0135597B1 EP 83109475 A EP83109475 A EP 83109475A EP 83109475 A EP83109475 A EP 83109475A EP 0135597 B1 EP0135597 B1 EP 0135597B1
Authority
EP
European Patent Office
Prior art keywords
alignment
signals
periodical
patterns
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP83109475A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0135597A1 (de
Inventor
Franz Dr. Dipl.-Phys. Schedewie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
International Business Machines Corp
Original Assignee
IBM Deutschland GmbH
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH, International Business Machines Corp filed Critical IBM Deutschland GmbH
Priority to EP83109475A priority Critical patent/EP0135597B1/de
Priority to DE8383109475T priority patent/DE3372673D1/de
Priority to JP59116743A priority patent/JPS6077426A/ja
Priority to US06/653,988 priority patent/US4626907A/en
Publication of EP0135597A1 publication Critical patent/EP0135597A1/de
Application granted granted Critical
Publication of EP0135597B1 publication Critical patent/EP0135597B1/de
Expired legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Definitions

  • the object of the present invention is therefore to specify a method for the mutual alignment of objects of the type mentioned at the beginning, with which positioning accuracies in the submicron range can be achieved quickly and automatically; the facilities for performing this method should not require a great deal of effort and should be able to be installed in existing devices.
  • the proposed procedure will be periodic structures in the form of optical line gratings, which are attached to the mask and the semiconductor wafer, are used as the alignment pattern.
  • the alignment patterns are projected onto a television camera by means of suitable optical imaging means in such a way that the grids are scanned by the electron beam of the television camera perpendicular to the direction of the grating edges.
  • the resulting electrical periodic signals are then processed electronically to determine the relative phase of the two periodic signals.
  • the signals are either digitized and subjected to a fast digital Fourier analysis or fed to a phase-sensitive amplifier as analog signals. In both cases, a measure of the relative displacement is obtained from the phase difference between the two gratings.
  • B. can be used as a control variable for automatic alignment.
  • the alignment marks 1a to 1d of the mask and 2a to 2d of the wafer each consist of periodically arranged line marks with a mutual spacing of approximately 2.5 ⁇ m.
  • the distance between the line marks of the mask is chosen to be somewhat smaller than that of the line marks on the wafer.
  • the alignment method according to the invention will now be described with reference to a preferred device, the block diagram of which is shown in FIG. 2.
  • the image detail 10 shown in FIG. 1 with the grids 1a, 2a is converted into electrical signals by a television camera 20 with associated camera control 22 and optionally displayed on a monitor 21.
  • the selection of the image section 10 can either be done manually with the aid of the monitor 21 or automatically with the aid of simple image processing circuits 23 which react to the periodic grid structure and position the camera image accordingly. Details of this are explained in more detail below.
  • phase-sensitive detector circuit reflects the time difference (the phase difference) of the two input signals.
  • this output signal therefore directly represents a measure of the quality of the mutual alignment of mask and wafer.
  • Delay lines with a displaceable tap can be used as the delay device for the analog signals. Since the phase-sensitive detector devices work relatively sluggishly in comparison to the frequency of the scanning signal, averaging is also carried out there over the signals of several edges of the grating and thus an alignment accuracy that is increased compared to the simple measurement.
  • the selection of the image section 10 can take place automatically with the aid of methods as are known in the field of pattern recognition.
  • Another possibility here is to provide analog or digital filters which respond to the known spatial frequency of the grids and are accommodated, for example, in the circuit 23 for the line selection.
  • Another possibility is to digitize larger parts of the field of view of the television tube and to provide corresponding algorithms for pattern recognition in the microprocessor 26. Manual adjustment of the mapping of the alignment pattern onto selected scanning lines of the television camera with the aid of a monitor is also possible; the selected scanning lines then emit the periodic output signal via corresponding electronic circuits.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
EP83109475A 1983-09-23 1983-09-23 Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten Expired EP0135597B1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP83109475A EP0135597B1 (de) 1983-09-23 1983-09-23 Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten
DE8383109475T DE3372673D1 (en) 1983-09-23 1983-09-23 Process and device for mutually aligning objects
JP59116743A JPS6077426A (ja) 1983-09-23 1984-06-08 整合方法
US06/653,988 US4626907A (en) 1983-09-23 1984-09-24 Method and apparatus for mutually aligning objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP83109475A EP0135597B1 (de) 1983-09-23 1983-09-23 Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten

Publications (2)

Publication Number Publication Date
EP0135597A1 EP0135597A1 (de) 1985-04-03
EP0135597B1 true EP0135597B1 (de) 1987-07-22

Family

ID=8190696

Family Applications (1)

Application Number Title Priority Date Filing Date
EP83109475A Expired EP0135597B1 (de) 1983-09-23 1983-09-23 Verfahren und Einrichtung zum gegenseitigen Ausrichten von Objekten

Country Status (4)

Country Link
US (1) US4626907A (enrdf_load_stackoverflow)
EP (1) EP0135597B1 (enrdf_load_stackoverflow)
JP (1) JPS6077426A (enrdf_load_stackoverflow)
DE (1) DE3372673D1 (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606185B2 (ja) * 1985-06-17 1997-04-30 ソニー株式会社 固体撮像素子のレジストレーション測定方法
EP0222072B1 (en) * 1985-10-11 1993-12-15 Hitachi, Ltd. Method of loading surface mounted device and an apparatus therefor
US4965842A (en) * 1986-07-22 1990-10-23 Schlumberger Technologies, Inc. Method and apparatus for measuring feature dimensions using controlled dark-field illumination
US5109430A (en) * 1986-07-22 1992-04-28 Schlumberger Technologies, Inc. Mask alignment and measurement of critical dimensions in integrated circuits
US4742233A (en) * 1986-12-22 1988-05-03 American Telephone And Telgraph Company Method and apparatus for automated reading of vernier patterns
JP2539856B2 (ja) * 1987-10-15 1996-10-02 株式会社ヒューテック 印刷パタ―ン周期長のずれ検知方法
JPH01283993A (ja) * 1988-05-11 1989-11-15 Hitachi Ltd 回路プリント板、その面付け部品位置認識装置、及び面付け部品検査装置
JPH07119570B2 (ja) * 1988-05-27 1995-12-20 株式会社ニコン アライメント方法
JP2666859B2 (ja) * 1988-11-25 1997-10-22 日本電気株式会社 目合せ用バーニヤパターンを備えた半導体装置
JP2757036B2 (ja) * 1989-08-26 1998-05-25 株式会社新川 マーキング方法及び装置
CA2074218C (en) * 1991-10-10 2000-07-18 Timothy H. Schipper Adjustable dual worksurface support
US5513275A (en) * 1993-01-12 1996-04-30 Board Of Trustees Of The Leland Stanford Junior University Automated direct patterned wafer inspection
US5559601A (en) * 1994-01-24 1996-09-24 Svg Lithography Systems, Inc. Mask and wafer diffraction grating alignment system wherein the diffracted light beams return substantially along an incident angle
US5793701A (en) * 1995-04-07 1998-08-11 Acuson Corporation Method and apparatus for coherent image formation
US5667373A (en) * 1994-08-05 1997-09-16 Acuson Corporation Method and apparatus for coherent image formation
US5836560A (en) * 1995-11-22 1998-11-17 Steelcase Inc. Articulated keyboard shelf
US6069984A (en) * 1997-12-29 2000-05-30 Hewlett-Packard Company Method and apparatus for correcting optical spot position
US6463184B1 (en) * 1999-06-17 2002-10-08 International Business Machines Corporation Method and apparatus for overlay measurement
JP2003031477A (ja) * 2001-07-17 2003-01-31 Hitachi Ltd 半導体装置の製造方法およびシステム
CA2411180C (en) 2002-10-30 2007-07-31 Knape & Vogt Manufacturing Company Adjustable support assembly for a data entry/interface device for computers or the like
JP4101076B2 (ja) 2003-02-06 2008-06-11 キヤノン株式会社 位置検出方法及び装置
DE10326086B4 (de) * 2003-06-10 2006-04-13 Infineon Technologies Ag Verfahren und Justiermarken zur Positionierung eines Messkopfes auf einer Leiterplatte
JP4795300B2 (ja) * 2006-04-18 2011-10-19 キヤノン株式会社 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
US9620400B2 (en) * 2013-12-21 2017-04-11 Kla-Tencor Corporation Position sensitive substrate device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082975A (en) * 1964-05-07 1967-09-13 Plessey Uk Ltd Apparatus for frequency and phase comparison of two periodic signals
NL7100212A (enrdf_load_stackoverflow) * 1971-01-08 1972-07-11
US4408885A (en) * 1971-03-22 1983-10-11 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
US3899634A (en) * 1971-05-26 1975-08-12 Western Electric Co Video controlled positioning method and apparatus
US3867038A (en) * 1972-11-27 1975-02-18 Baird Atomic Inc Optical alignment system
JPS49119584A (enrdf_load_stackoverflow) * 1973-03-15 1974-11-15
US4200395A (en) * 1977-05-03 1980-04-29 Massachusetts Institute Of Technology Alignment of diffraction gratings
US4347001A (en) * 1978-04-03 1982-08-31 Kla Instruments Corporation Automatic photomask inspection system and apparatus
EP0005462B1 (de) * 1978-05-22 1983-06-08 Siemens Aktiengesellschaft Verfahren zum Positionieren von zwei aufeinander einzujustierenden Objekten
JPS5537919A (en) * 1978-09-11 1980-03-17 Ngk Insulators Ltd Automatic outer configuration measurement device
JPS5588347A (en) * 1978-12-27 1980-07-04 Fujitsu Ltd Automatic aligning system
NL177552C (nl) * 1979-05-02 1985-10-01 Nederlanden Staat Inrichting voor het onder gebruikmaking van een digitale correlatiemethode vaststellen van de aanwezigheid van elke van een aantal vaste frequenties in een signaal.
JPS5627414A (en) * 1979-08-10 1981-03-17 Optimetrix Corp Improved xxy addressable positioning device for object being handled having sensor for xxy address mark
JPS5693321A (en) * 1979-12-26 1981-07-28 Fujitsu Ltd Method for pattern inspection
US4385839A (en) * 1980-07-31 1983-05-31 Baird Corporation Automatic alignment system
CA1188735A (en) * 1982-01-18 1985-06-11 Andrzej Barszczewski Fast frequency measuring system
US4549084A (en) * 1982-12-21 1985-10-22 The Perkin-Elmer Corporation Alignment and focusing system for a scanning mask aligner

Also Published As

Publication number Publication date
EP0135597A1 (de) 1985-04-03
JPH0337294B2 (enrdf_load_stackoverflow) 1991-06-05
US4626907A (en) 1986-12-02
DE3372673D1 (en) 1987-08-27
JPS6077426A (ja) 1985-05-02

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