EP0118841B1 - Verfahren zum Abdichten eines Relais - Google Patents

Verfahren zum Abdichten eines Relais Download PDF

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Publication number
EP0118841B1
EP0118841B1 EP84102158A EP84102158A EP0118841B1 EP 0118841 B1 EP0118841 B1 EP 0118841B1 EP 84102158 A EP84102158 A EP 84102158A EP 84102158 A EP84102158 A EP 84102158A EP 0118841 B1 EP0118841 B1 EP 0118841B1
Authority
EP
European Patent Office
Prior art keywords
relay
gas
filling
hood
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP84102158A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0118841A3 (en
EP0118841A2 (de
Inventor
Werner Minks
Bernhard Franz Nitschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV filed Critical Alcatel NV
Priority to AT84102158T priority Critical patent/ATE32151T1/de
Publication of EP0118841A2 publication Critical patent/EP0118841A2/de
Publication of EP0118841A3 publication Critical patent/EP0118841A3/de
Application granted granted Critical
Publication of EP0118841B1 publication Critical patent/EP0118841B1/de
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Definitions

  • the present invention relates to a method for sealing an electromagnetic relay according to the preamble of claim 1.
  • Such a method is known from DE-A2 461 427.
  • a filling opening is provided in the floor, which is only closed after the base part has been poured and the interior of the relay has been filled with gas.
  • a similar process is known from DE-A-2 618 492. The opening is there to allow pressure equalization between the interior and exterior during curing.
  • the object is to be achieved in a sealing method of the type mentioned at the outset to prevent casting compound or too much casting compound from flowing inwards during sealing.
  • the internal atmosphere of the relay should remain free of harmful gases, particularly those that occur during potting.
  • the internal pressure in the relay prevents the potting compound from running inwards and coming into contact with components and thus impairing the usability of the relay. It was not possible to determine any air ducts that formed in the casting compound.
  • the harmful gases can escape through the opening of the wall of the gas filling opening in the cup-like hood after the gelling compound has hardened or hardened.
  • the interior can then be degassed and flushed or filled with inert gas and then the ventilation hole closed.
  • the opening of the hood is easier to do than in a base part, since the hood is not exposed to the high temperature of the base part when soldering into a printed circuit, for example, and can therefore be made of thermoplastic material.
  • Fig. 1 designates a cup-shaped hood, in the top 2 of which an inwardly projecting funnel-shaped, outwardly widening gas filling opening 3 is provided.
  • the wall 4 of the gas filling opening 3 is initially closed.
  • the hood 1 is advantageously an injection molded or pressed part made of plastic.
  • the side walls 5 extend downward and extend with their end edge 6 to the underside 7 of a housing base 8 or even protrude slightly above them.
  • the housing base 8 is part of an inner housing lower part, which contains the magnet system 9 and the contact system 10 (FIG. 5) as well as the connection elements 11 (FIG. 5).
  • a plurality of ribs 12 are provided on the inside of the hood, the ends 13 of which, in the assembled state, rest on the upper edge of the lower housing part or its side walls.
  • the wall 4 of the gas filling opening 3 can be pierced, so that a hole 14 is formed (Fig. 3).
  • This hole 14 is only made so large that a potting compound filled in for subsequent sealing does not drip into the housing due to the capillary action and / or the surface tension and / or the viscosity.
  • the ventilation hole is preferably 0.1 to 0.8 mm in diameter or a slot with a slot width of 0.1 to 0.6 mm.
  • the inside of the lower end edges 6 of the hood side walls 5 is chamfered (FIG. 4), so that potting compound applied from below can run better into the separating slot 16 between the hood side walls 5 and the housing base 8.
  • a dense relay that works perfectly even with a very large number of switching cycles is obtained in that the relay is first assembled and the hood 1 is pushed on (FIG. 5, method section I). The relay is then set up or held so that the top 2 of the hood 1 points downwards (FIG. 5, method section 11). In this position, a self-curing or z. B. applied by energy supply curable potting compound 15 (process section 111) and then the potting compound by supplying energy, in particular by a heating device 17 or hot air, etc., gelled or fully cured. The wall 4 of the filling opening 3 of the hood 1 is then pierced or pierced, for example by means of a fine needle, and the ventilation hole 14 is thereby formed.
  • the ventilation hole 14 can also on one of the Side walls 5 of the hood 1 may be provided.
  • the interior of the relay can be degassed through the ventilation hole 14, after which the ventilation hole 14 is closed, or the interior is previously flushed with dry air, hydrogen and / or inert gas in a special process section (process section V) or, for example, at a negative pressure of up to 10 - Degassed 5 bar in a vacuum chamber 18.
  • Degassing is preferably carried out at an elevated temperature between 130 and 180 ° C with the relay in the normal position. Harmful components escape from the plastics used for later operation. From this, the interior is expediently, preferably after cooling to normal temperature, with an inert gas, such as. B. helium, argon or nitrogen, or filled with hydrogen or dried air and then placed in the normal position of the relay potting compound 15 in the filler opening 3 and then cured.
  • an inert gas such as. B. helium, argon or nitrogen
  • a heated needle is used to pierce the wall 4 of the filling opening 3. .
  • the wall material consists of a thermoplastic.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Casings For Electric Apparatus (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Cable Accessories (AREA)
  • Glass Compositions (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
EP84102158A 1983-03-12 1984-03-01 Verfahren zum Abdichten eines Relais Expired EP0118841B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT84102158T ATE32151T1 (de) 1983-03-12 1984-03-01 Verfahren zum abdichten eines relais.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3308791 1983-03-12
DE3308791A DE3308791C2 (de) 1983-03-12 1983-03-12 Verfahren zur Herstellung eines dichten elektromagnetischen Relais

Publications (3)

Publication Number Publication Date
EP0118841A2 EP0118841A2 (de) 1984-09-19
EP0118841A3 EP0118841A3 (en) 1985-01-23
EP0118841B1 true EP0118841B1 (de) 1988-01-20

Family

ID=6193247

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84102158A Expired EP0118841B1 (de) 1983-03-12 1984-03-01 Verfahren zum Abdichten eines Relais

Country Status (7)

Country Link
US (1) US4675987A (ja)
EP (1) EP0118841B1 (ja)
JP (1) JPS59175528A (ja)
AT (1) ATE32151T1 (ja)
CA (1) CA1234462A (ja)
DE (1) DE3308791C2 (ja)
ES (1) ES8504406A1 (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481130A (en) * 1987-09-21 1989-03-27 Omron Tateisi Electronics Co Electrical contact
DE8900466U1 (de) * 1989-01-17 1989-03-02 Siemens AG, 1000 Berlin und 8000 München Gehäuse für ein elektromechanisches Bauelement, insbesondere für ein Relais
GB8929126D0 (en) * 1989-12-22 1990-02-28 Eev Ltd Relay arrangements
JPH05290703A (ja) * 1992-04-08 1993-11-05 Nec Tohoku Ltd 電磁継電器
CH683727A5 (de) * 1992-06-11 1994-04-29 Alcatel Str Ag Relais.
US5477008A (en) * 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
US5759668A (en) * 1994-02-04 1998-06-02 Omron Corporation Heat seal structure
DE19642403A1 (de) * 1996-10-14 1998-04-16 Cherry Mikroschalter Gmbh In eine Vergußmasse eingebettetes Schaltelement und Verfahren zu seiner Herstellung
GB2340667B (en) * 1998-05-29 2000-04-12 Electronic Tech Housing for an electronic component
CN101609773B (zh) * 2008-06-18 2012-05-16 清华大学 真空器件的封接方法
US8330062B2 (en) * 2009-09-18 2012-12-11 Leviton Manufacturing Co., Inc. Electrical switching component
US8281951B2 (en) * 2009-10-15 2012-10-09 Leviton Manufacturing Co., Inc. Electrical component enclosure
US8324761B2 (en) * 2009-11-13 2012-12-04 Leviton Manufacturing Co., Inc. Electrical switching module
US8463453B2 (en) 2009-11-13 2013-06-11 Leviton Manufacturing Co., Inc. Intelligent metering demand response
US8755944B2 (en) * 2009-11-13 2014-06-17 Leviton Manufacturing Co., Inc. Electrical switching module
US8736193B2 (en) 2011-12-22 2014-05-27 Leviton Manufacturing Company, Inc. Threshold-based zero-crossing detection in an electrical dimmer
US8664886B2 (en) 2011-12-22 2014-03-04 Leviton Manufacturing Company, Inc. Timer-based switching circuit synchronization in an electrical dimmer
US9681526B2 (en) 2014-06-11 2017-06-13 Leviton Manufacturing Co., Inc. Power efficient line synchronized dimmer
CN108281326A (zh) * 2018-02-12 2018-07-13 裴喜乐 继电器中基座与壳体自动装配设备
US11939980B2 (en) 2018-05-08 2024-03-26 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Electronic unit and electric fluid pump, and closure element
JP7204365B2 (ja) * 2018-07-31 2023-01-16 富士通コンポーネント株式会社 電磁継電器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2092445A (en) * 1934-03-09 1937-09-07 Doulgheridis Alcibiad Michael Method of sealing containers
NL59324C (ja) * 1943-08-18
DE843350C (de) * 1948-10-02 1952-07-07 Ernst Augsten Konservengefaessdeckel und Hilfsmittel zum OEffnen desselben
US2810889A (en) * 1956-07-30 1957-10-22 Rca Corp Electromechanical filter assembly
NL113667C (ja) * 1958-07-04
US4035909A (en) * 1972-12-12 1977-07-19 P. R. Mallory & Co., Inc. Method of making a miniature concentric battery
DE2461427A1 (de) * 1974-12-24 1976-07-08 Lothar Sachsse Elektromagnetisches umschaltrelais mit geschuetztem kontaktsystem
DE2618492C2 (de) * 1976-04-27 1984-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Waschdichte Schutzvorrichtung für ein elektromechanisches Bauelement
JPS6021878Y2 (ja) * 1979-10-23 1985-06-29 富士通株式会社 プリント板用継電器
US4062469A (en) * 1976-12-23 1977-12-13 American Zettler, Inc. Electronic instrument case
JPS5539154A (en) * 1978-09-12 1980-03-18 Matsushita Electric Works Ltd Method of fabricating gassfilled electric switch
DE3045719A1 (de) * 1980-12-04 1982-07-08 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von cycloaliphatischen und/oder aromatischen aminen
JPS5797347U (ja) * 1980-12-05 1982-06-15
DE3111311A1 (de) * 1981-03-23 1982-09-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zur abdichtung von elektromechanischen bauelementen
JPH017959Y2 (ja) * 1981-05-06 1989-03-02

Also Published As

Publication number Publication date
ES530501A0 (es) 1985-04-01
ES8504406A1 (es) 1985-04-01
DE3308791C2 (de) 1986-08-21
EP0118841A3 (en) 1985-01-23
CA1234462A (en) 1988-03-29
ATE32151T1 (de) 1988-02-15
JPH0572049B2 (ja) 1993-10-08
DE3308791A1 (de) 1984-09-20
EP0118841A2 (de) 1984-09-19
US4675987A (en) 1987-06-30
JPS59175528A (ja) 1984-10-04

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