EP0000786A1 - Geschlossene Siedekühlvorrichtung - Google Patents

Geschlossene Siedekühlvorrichtung Download PDF

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Publication number
EP0000786A1
EP0000786A1 EP78100639A EP78100639A EP0000786A1 EP 0000786 A1 EP0000786 A1 EP 0000786A1 EP 78100639 A EP78100639 A EP 78100639A EP 78100639 A EP78100639 A EP 78100639A EP 0000786 A1 EP0000786 A1 EP 0000786A1
Authority
EP
European Patent Office
Prior art keywords
refrigerant
cooling
liquid refrigerant
reservoir
boiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP78100639A
Other languages
English (en)
French (fr)
Inventor
Sadayuki Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP0000786A1 publication Critical patent/EP0000786A1/de
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
    • F25D9/005—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00 using fluorinated halogenous hydrocarbons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/18—Liquid cooling by evaporating liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This apparatus operates in such a manner that, in pruportion to the volume of the heat generated by a heat generating member, the boiling refrigerant can be shifted into the reservoir to provide the condenser section with a greater volume for gaseous refrigerant, with the result that the performance of the condenser section can be automatically accomodated in response to the volume of heat generated and the temperature ot the boiling refrigerant can be maintained at its boiling point.
  • the open-type boiling cooling apparatus is disadvantageous in that the boiling refrigerant tends to flow out when the cooling vessel is tilted or inversed during transport.
  • the cooling apparatus is transported by car, train or the like, the refrigerant and the sealing liquid tend to flow out due to vibrations.
  • Another object of this invention is to provide a closed-type boiling cooling apparatus in which the gaseous refrigerant is not in direct contact with air so that the waste of the refrigerant can extremely be reduced.
  • a further object of this invention is to provide a closed-type boiling cooling apparatus which is safe with respect to vibration, tilting and inversion of the cooling vessel.
  • Another function is to prevent the gaseous refrigerant 8c from directly entering the liquid refrigerant reservoir 6. This is because the gaseous refrigerant does not readily flow downwardly through the liquid refrigerant.
  • the liquid refrigerant reservoir 6 is.provided for storing the liquid refrigerant 8b which does not directly take part in the cooling operation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP78100639A 1977-08-12 1978-08-09 Geschlossene Siedekühlvorrichtung Withdrawn EP0000786A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9601877A JPS5430552A (en) 1977-08-12 1977-08-12 Boiling cooling apparatus
JP96018/77 1977-08-12

Publications (1)

Publication Number Publication Date
EP0000786A1 true EP0000786A1 (de) 1979-02-21

Family

ID=14153511

Family Applications (1)

Application Number Title Priority Date Filing Date
EP78100639A Withdrawn EP0000786A1 (de) 1977-08-12 1978-08-09 Geschlossene Siedekühlvorrichtung

Country Status (2)

Country Link
EP (1) EP0000786A1 (de)
JP (1) JPS5430552A (de)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2451009A1 (fr) * 1979-03-05 1980-10-03 Hitachi Ltd Dispositif de refroidissement en ebullition du type a pression constante
EP0046043A2 (de) * 1980-08-07 1982-02-17 European Atomic Energy Community (Euratom) Vorrichtung für den passiven Wärmetransport und integrierter Solarkollektor, in den diese Vorrichtung eingebaut ist
FR2525748A1 (fr) * 1982-04-23 1983-10-28 Hitachi Ltd Appareil de refrigeration magnetique
DE3422039A1 (de) * 1984-06-14 1985-12-19 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Siedekuehlung, insbesondere zur kuehlung von stromrichtern der leistungselektronik
EP0290212A2 (de) * 1987-05-02 1988-11-09 Marconi Electronic Devices Limited Kühlungsanordnung und Verfahren zum Überwachen ihres Betriebs
EP0321945A2 (de) * 1987-12-22 1989-06-28 Kenji Okayasu Wärmeleitende Vorrichtung
EP0321944A2 (de) * 1987-12-22 1989-06-28 Kenji Okayasu Kühlungsvorrichtung für eine elektronische Anlage
WO1995007547A1 (en) * 1993-09-10 1995-03-16 Aavid Laboratories, Inc. Two-phase component cooler
WO1999030091A1 (en) * 1997-11-21 1999-06-17 Telefonaktiebolaget Lm Ericsson (Publ) Cooling capacity control
WO2000070289A1 (en) * 1999-05-18 2000-11-23 3M Innovative Properties Company Two-phase heat transfer without de-gassing
WO2001055662A1 (en) * 2000-01-31 2001-08-02 Thermal Corp. Leak detector for a liquid cooling circuit
GB2442743A (en) * 2006-10-12 2008-04-16 Energetix Group Ltd A Closed Cycle Heat Transfer Device
WO2013104768A1 (fr) * 2012-01-13 2013-07-18 Astrium Sas Dispositif de refroidissement adapte a la regulation thermique d'une source de chaleur d'un satellite, procede de realisation du dispositif de refroidissement et satellite associes
CN104833248A (zh) * 2015-05-22 2015-08-12 东南大学 一种月球车辐射散热器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919608A (ja) * 1982-07-22 1984-02-01 Citizen Watch Co Ltd 旋盤における切削工具刃先高調整装置
JPS63133948U (de) * 1987-02-25 1988-09-01
DE3822615A1 (de) * 1988-07-04 1990-01-18 Samson Ag Bohreinrichtung mit mindestens einem umlaufenden bohrkopf mit einem quer zur drehachse fein einstellbaren werkzeugtraeger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
EP2753887B1 (de) * 2011-09-09 2020-08-12 CERN - European Organization For Nuclear Research Kompaktes kühlsystem und verfahren zur genauen temperaturregelung
JP6605819B2 (ja) * 2015-03-06 2019-11-13 株式会社東芝 冷却装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH95902A (de) * 1921-05-02 1922-08-16 Haefely & Cie Ag Emil Verfahren und Einrichtung zur Kühlung elektrischer Apparate und Maschinen.
DE659848C (de) * 1935-09-25 1938-05-11 Arnold Besag Dipl Ing Warmwasserausdehnungsgefaess, insbesondere fuer Warmwasserheizungsanlagen
DE723857C (de) * 1939-05-20 1942-08-12 Dornier Werke Gmbh Heizeinrichtung, insbesondere fuer Luftfahrzeuge
US2961476A (en) * 1958-06-24 1960-11-22 Westinghouse Electric Corp Electrical apparatus
FR1319387A (fr) * 1962-01-17 1963-03-01 Chausson Usines Sa Procédé et dispositif pour le refroidissement d'éléments semi-conducteurs, notamment de transistors
US3682237A (en) * 1969-07-25 1972-08-08 Aga Ab Semiconductor cooling system and method
DE2412631A1 (de) * 1973-03-16 1974-10-03 Hitachi Ltd Waermeuebergangsvorrichtung
DE2344063B1 (de) * 1973-08-31 1975-01-16 Moriz Dipl-Ing Dipl-Ing Goetz Ausdehnungseinrichtung fuer eine geschlossene Heizungsanlage,insbesondere fuer eine Warmwasserheizungsanlage
DE2642160A1 (de) * 1975-09-20 1977-03-31 Hitachi Ltd Siedekuehlvorrichtung

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH95902A (de) * 1921-05-02 1922-08-16 Haefely & Cie Ag Emil Verfahren und Einrichtung zur Kühlung elektrischer Apparate und Maschinen.
DE659848C (de) * 1935-09-25 1938-05-11 Arnold Besag Dipl Ing Warmwasserausdehnungsgefaess, insbesondere fuer Warmwasserheizungsanlagen
DE723857C (de) * 1939-05-20 1942-08-12 Dornier Werke Gmbh Heizeinrichtung, insbesondere fuer Luftfahrzeuge
US2961476A (en) * 1958-06-24 1960-11-22 Westinghouse Electric Corp Electrical apparatus
FR1319387A (fr) * 1962-01-17 1963-03-01 Chausson Usines Sa Procédé et dispositif pour le refroidissement d'éléments semi-conducteurs, notamment de transistors
US3682237A (en) * 1969-07-25 1972-08-08 Aga Ab Semiconductor cooling system and method
DE2412631A1 (de) * 1973-03-16 1974-10-03 Hitachi Ltd Waermeuebergangsvorrichtung
DE2344063B1 (de) * 1973-08-31 1975-01-16 Moriz Dipl-Ing Dipl-Ing Goetz Ausdehnungseinrichtung fuer eine geschlossene Heizungsanlage,insbesondere fuer eine Warmwasserheizungsanlage
DE2642160A1 (de) * 1975-09-20 1977-03-31 Hitachi Ltd Siedekuehlvorrichtung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELEKTRIE, vol. 25, no. 8, August 1971, Berlin, TITKIN S.A. "Verdampfungsk}hlung von Siliziumleistungsdioden mit einseitiger W{rmeabf}hrung", page U160 *

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2451009A1 (fr) * 1979-03-05 1980-10-03 Hitachi Ltd Dispositif de refroidissement en ebullition du type a pression constante
EP0046043A2 (de) * 1980-08-07 1982-02-17 European Atomic Energy Community (Euratom) Vorrichtung für den passiven Wärmetransport und integrierter Solarkollektor, in den diese Vorrichtung eingebaut ist
EP0046043A3 (en) * 1980-08-07 1982-04-14 European Atomic Energy Community (Euratom) Device for passive heat transport and integrated solar collector incorporating same
FR2525748A1 (fr) * 1982-04-23 1983-10-28 Hitachi Ltd Appareil de refrigeration magnetique
DE3422039A1 (de) * 1984-06-14 1985-12-19 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Siedekuehlung, insbesondere zur kuehlung von stromrichtern der leistungselektronik
EP0290212A2 (de) * 1987-05-02 1988-11-09 Marconi Electronic Devices Limited Kühlungsanordnung und Verfahren zum Überwachen ihres Betriebs
EP0290212A3 (de) * 1987-05-02 1989-03-01 Marconi Electronic Devices Limited Kühlungsanordnung und Verfahren zum Überwachen ihres Betriebs
EP0321945A2 (de) * 1987-12-22 1989-06-28 Kenji Okayasu Wärmeleitende Vorrichtung
EP0321944A2 (de) * 1987-12-22 1989-06-28 Kenji Okayasu Kühlungsvorrichtung für eine elektronische Anlage
EP0321944A3 (en) * 1987-12-22 1990-01-17 Kenji Okayasu Electronic equipment cooling device
EP0321945A3 (en) * 1987-12-22 1990-01-17 Kenji Okayasu Heat conducting device
WO1995007547A1 (en) * 1993-09-10 1995-03-16 Aavid Laboratories, Inc. Two-phase component cooler
WO1999030091A1 (en) * 1997-11-21 1999-06-17 Telefonaktiebolaget Lm Ericsson (Publ) Cooling capacity control
WO2000070289A1 (en) * 1999-05-18 2000-11-23 3M Innovative Properties Company Two-phase heat transfer without de-gassing
WO2001055662A1 (en) * 2000-01-31 2001-08-02 Thermal Corp. Leak detector for a liquid cooling circuit
GB2442743A (en) * 2006-10-12 2008-04-16 Energetix Group Ltd A Closed Cycle Heat Transfer Device
US8141362B2 (en) 2006-10-12 2012-03-27 Energetix Genlec Limited Closed cycle heat transfer device and method
WO2013104768A1 (fr) * 2012-01-13 2013-07-18 Astrium Sas Dispositif de refroidissement adapte a la regulation thermique d'une source de chaleur d'un satellite, procede de realisation du dispositif de refroidissement et satellite associes
FR2985808A1 (fr) * 2012-01-13 2013-07-19 Astrium Sas Dispositif de refroidissement adapte a la regulation thermique d'une source de chaleur d'un satellite, procede de realisation du dispositif de refroidissement et satellite associes
CN104246407A (zh) * 2012-01-13 2014-12-24 阿斯特里姆有限公司 适于调节卫星的热源的温度的冷却装置和用于生产相关联的冷却装置和卫星的方法
CN104833248A (zh) * 2015-05-22 2015-08-12 东南大学 一种月球车辐射散热器

Also Published As

Publication number Publication date
JPS5430552A (en) 1979-03-07

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Designated state(s): DE FR

17P Request for examination filed
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19810402

RIN1 Information on inventor provided before grant (corrected)

Inventor name: OKADA, SADAYUKI

Inventor name: SONOBE, HISAO