JPS5430552A - Boiling cooling apparatus - Google Patents

Boiling cooling apparatus

Info

Publication number
JPS5430552A
JPS5430552A JP9601877A JP9601877A JPS5430552A JP S5430552 A JPS5430552 A JP S5430552A JP 9601877 A JP9601877 A JP 9601877A JP 9601877 A JP9601877 A JP 9601877A JP S5430552 A JPS5430552 A JP S5430552A
Authority
JP
Japan
Prior art keywords
cooling apparatus
boiling cooling
liquid tank
liquid
allowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9601877A
Other languages
Japanese (ja)
Inventor
Teigo Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9601877A priority Critical patent/JPS5430552A/en
Priority to EP78100639A priority patent/EP0000786A1/en
Publication of JPS5430552A publication Critical patent/JPS5430552A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D9/00—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00
    • F25D9/005—Devices not associated with refrigerating machinery and not covered by groups F25D1/00 - F25D7/00; Combinations of devices covered by two or more of the groups F25D1/00 - F25D7/00 using fluorinated halogenous hydrocarbons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/10—Liquid cooling
    • H01F27/18—Liquid cooling by evaporating liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To remove the consumption of cooling liquid and obtain a good cooling performance by forming a liquid tank in a closed structure and allowing the volume of the liquid tank to be varied in free expansion and allowing cooling liquid to flow into or out freely from the liquid tank.
JP9601877A 1977-08-12 1977-08-12 Boiling cooling apparatus Pending JPS5430552A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9601877A JPS5430552A (en) 1977-08-12 1977-08-12 Boiling cooling apparatus
EP78100639A EP0000786A1 (en) 1977-08-12 1978-08-09 Closed type boiling cooling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9601877A JPS5430552A (en) 1977-08-12 1977-08-12 Boiling cooling apparatus

Publications (1)

Publication Number Publication Date
JPS5430552A true JPS5430552A (en) 1979-03-07

Family

ID=14153511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9601877A Pending JPS5430552A (en) 1977-08-12 1977-08-12 Boiling cooling apparatus

Country Status (2)

Country Link
EP (1) EP0000786A1 (en)
JP (1) JPS5430552A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919608A (en) * 1982-07-22 1984-02-01 Citizen Watch Co Ltd Edge point height regulating device of cutting tool in lathe
JPS63133948U (en) * 1987-02-25 1988-09-01
JPH0271913A (en) * 1988-07-04 1990-03-12 Samson Ag Boring device
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
JP2014526667A (en) * 2011-09-09 2014-10-06 ヨーロピアン オーガナイゼーション フォー ニュークリア リサーチ Mini cooling system and method for accurate temperature control
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
GB2081435A (en) * 1980-08-07 1982-02-17 Euratom Device for passive downwards heat transport and integrated solar collectur incorporating same
JPS58184471A (en) * 1982-04-23 1983-10-27 株式会社日立製作所 Magnetic refrigerator
DE3422039A1 (en) * 1984-06-14 1985-12-19 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Evaporative cooling, in particular for cooling converters in power electronics
GB2204113A (en) * 1987-05-02 1988-11-02 Marconi Electronic Devices A phase charge cooling arrangement
JP2519959B2 (en) * 1987-12-22 1996-07-31 謙治 岡安 Electronic device cooling device
JP2594446B2 (en) * 1987-12-22 1997-03-26 謙治 岡安 Heat transfer device
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
SE518336C2 (en) * 1997-11-21 2002-09-24 Ericsson Telefon Ab L M Temperature control device and method for controlling the temperature of such a device
WO2000070289A1 (en) * 1999-05-18 2000-11-23 3M Innovative Properties Company Two-phase heat transfer without de-gassing
AU2001229759A1 (en) * 2000-01-31 2001-08-07 Thermal Corp. Leak detector for a liquid cooling circuit
GB2442743A (en) 2006-10-12 2008-04-16 Energetix Group Ltd A Closed Cycle Heat Transfer Device
FR2985808B1 (en) * 2012-01-13 2018-06-15 Airbus Defence And Space COOLING DEVICE SUITABLE FOR THERMAL REGULATION OF A HEAT SOURCE OF A SATELLITE, METHOD OF MAKING THE COOLING DEVICE AND SATELLITE THEREFOR
CN104833248B (en) * 2015-05-22 2017-01-11 东南大学 Lunar vehicle radiation radiator

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH95902A (en) * 1921-05-02 1922-08-16 Haefely & Cie Ag Emil Process and device for cooling electrical apparatus and machines.
NL42398C (en) * 1935-09-25
DE723857C (en) * 1939-05-20 1942-08-12 Dornier Werke Gmbh Heating device, in particular for aircraft
US2961476A (en) * 1958-06-24 1960-11-22 Westinghouse Electric Corp Electrical apparatus
FR1319387A (en) * 1962-01-17 1963-03-01 Chausson Usines Sa Method and device for cooling semiconductor elements, in particular transistors
FR2056295A5 (en) * 1969-07-25 1971-05-14 Aga Ab
US3933198A (en) * 1973-03-16 1976-01-20 Hitachi, Ltd. Heat transfer device
DE2344063C2 (en) * 1973-08-31 1975-09-11 Moriz Dipl.-Ing. Dipl.-Ing. 8000 Muenchen Goetz Expansion device for a closed heating system, in particular for a hot water heating system
JPS5812509B2 (en) * 1975-09-20 1983-03-08 株式会社日立製作所 Kaihougatutututoreikiyakusouchi

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919608A (en) * 1982-07-22 1984-02-01 Citizen Watch Co Ltd Edge point height regulating device of cutting tool in lathe
JPS63133948U (en) * 1987-02-25 1988-09-01
JPH0271913A (en) * 1988-07-04 1990-03-12 Samson Ag Boring device
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
JP2014526667A (en) * 2011-09-09 2014-10-06 ヨーロピアン オーガナイゼーション フォー ニュークリア リサーチ Mini cooling system and method for accurate temperature control
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device

Also Published As

Publication number Publication date
EP0000786A1 (en) 1979-02-21

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