DK1602678T3 - Hærdningsacceleratorer - Google Patents

Hærdningsacceleratorer

Info

Publication number
DK1602678T3
DK1602678T3 DK05253231T DK05253231T DK1602678T3 DK 1602678 T3 DK1602678 T3 DK 1602678T3 DK 05253231 T DK05253231 T DK 05253231T DK 05253231 T DK05253231 T DK 05253231T DK 1602678 T3 DK1602678 T3 DK 1602678T3
Authority
DK
Denmark
Prior art keywords
epoxy resin
accelerators
imidazoles
image
resin composition
Prior art date
Application number
DK05253231T
Other languages
English (en)
Inventor
Philip C Hadley
Michelle M Irons
John Cawse
Original Assignee
Hexcel Composites Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Composites Ltd filed Critical Hexcel Composites Ltd
Application granted granted Critical
Publication of DK1602678T3 publication Critical patent/DK1602678T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
DK05253231T 2004-06-02 2005-05-26 Hærdningsacceleratorer DK1602678T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0412196.8A GB0412196D0 (en) 2004-06-02 2004-06-02 Cure accelerators

Publications (1)

Publication Number Publication Date
DK1602678T3 true DK1602678T3 (da) 2008-08-25

Family

ID=32696459

Family Applications (1)

Application Number Title Priority Date Filing Date
DK05253231T DK1602678T3 (da) 2004-06-02 2005-05-26 Hærdningsacceleratorer

Country Status (8)

Country Link
US (2) US7781542B2 (da)
EP (1) EP1602678B9 (da)
JP (1) JP4843256B2 (da)
AT (1) ATE398148T1 (da)
DE (1) DE602005007422D1 (da)
DK (1) DK1602678T3 (da)
ES (1) ES2307120T3 (da)
GB (1) GB0412196D0 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9067395B2 (en) 2010-08-20 2015-06-30 3M Innovative Properties Company Low temperature curable epoxy tape and method of making same
DE102012025256A1 (de) 2012-12-21 2014-06-26 Heinrich-Heine-Universität Diepoxide und deren Verwendung in Füllmaterialmischungen
US9611560B2 (en) * 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
GB201508510D0 (en) 2015-05-18 2015-07-01 Aqdot Ltd Curling compositions
GB2566269A (en) * 2017-09-06 2019-03-13 Hexcel Composites Ltd A resin composition and materials containing a resin composition
DE102017221072A1 (de) * 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
CN113853413B (zh) * 2019-05-31 2024-02-13 积水化学工业株式会社 粘接剂组合物、光学部件、电子部件及电子模块

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3591556A (en) * 1968-09-30 1971-07-06 Jefferson Chem Co Inc Curing agent combinations of sulfonamides and polyoxyalkylene folyamines for polyepoxides
GB1459638A (en) 1974-04-24 1976-12-22 Dow Chemical Co Epoxy resin compositions
JPS5949224A (ja) * 1982-09-14 1984-03-21 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS60199020A (ja) 1984-03-24 1985-10-08 Matsushita Electric Works Ltd 半導体封止材料
GB2164944B (en) * 1984-08-01 1988-06-08 Toho Rayon Kk Prepregs and method for production thereof
DE3429149A1 (de) * 1984-08-08 1986-02-20 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von stabilisierten polyaminen, stabilisierte polyamine retardierter reaktivitaet und ihre verwendung zur polyurethanherstellung
JPS61120826A (ja) * 1984-11-15 1986-06-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPS61151229A (ja) 1984-12-26 1986-07-09 Toshiba Corp 加圧成形用エポキシ樹脂組成物
JPS61192721A (ja) * 1985-02-22 1986-08-27 Ajinomoto Co Inc 一液性エポキシ樹脂組成物
US4689388A (en) * 1985-01-24 1987-08-25 Ajinomoto Co., Inc. One pack type alicyclic epoxy resin compositions
JPS61183317A (ja) * 1985-02-08 1986-08-16 Matsushita Electric Ind Co Ltd 低温速硬化型エポキシ樹脂組成物
US4618526A (en) * 1985-07-22 1986-10-21 The Dow Chemical Company Curable compositions containing multiglycidyl ethers and a sulfonic acid amide
US4756954A (en) * 1986-01-22 1988-07-12 The Dow Chemical Company Epoxy resin laminating varnish and laminates prepared therefrom
JPS62260820A (ja) * 1986-05-07 1987-11-13 Toagosei Chem Ind Co Ltd 重合用組成物
JPS638414A (ja) 1986-06-28 1988-01-14 Somar Corp 熱硬化性粉体組成物
JPS63120726A (ja) 1986-11-08 1988-05-25 Matsushita Electric Works Ltd 一液性封止材料
JPS63120727A (ja) 1986-11-08 1988-05-25 Matsushita Electric Works Ltd エポキシ樹脂組成物
US5294233A (en) * 1989-02-10 1994-03-15 Nippon Zeon Co., Ltd. Additive for organic medium or thermoplastic polymer
US5001175A (en) * 1989-04-11 1991-03-19 Estron Chemical, Inc. Epoxy-sulfonamide compounds and compositions
US4931528A (en) * 1989-05-08 1990-06-05 Texaco Chemical Company 1-isopropyl-2-methyl imidazole as an epoxy resin curative
JPH06184511A (ja) * 1991-11-14 1994-07-05 Aisin Chem Co Ltd 接着剤組成物
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
JPH0940889A (ja) 1995-07-25 1997-02-10 Nippon Paint Co Ltd エンジン・シリンダーブロックの粉体塗装方法及び粉体塗料組成物
JPH09165494A (ja) * 1995-11-16 1997-06-24 Yuka Shell Epoxy Kk 硬化性エポキシ樹脂組成物およびその使用
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
ES2154013T3 (es) * 1997-10-02 2001-03-16 Hexcel Corp Agentes de curado para resinas epoxidicas.
US6136944A (en) * 1998-09-21 2000-10-24 Shell Oil Company Adhesive of epoxy resin, amine-terminated polyamide and polyamine
JP2001011287A (ja) * 1999-04-28 2001-01-16 Toray Ind Inc 繊維強化プラスチック製部材
JP2001026742A (ja) * 1999-07-15 2001-01-30 Nof Corp エポキシ樹脂系塗料組成物
WO2001005888A1 (fr) * 1999-07-16 2001-01-25 Polyplastics Co., Ltd. Composition de resine polyacetal et procede de production correspondant
KR100550705B1 (ko) 1999-10-06 2006-02-08 닛토덴코 가부시키가이샤 반도체 밀봉용 수지 조성물, 및 이를 이용한 반도체 장치및 반도체 장치의 제조 방법
WO2001072921A1 (en) * 2000-03-28 2001-10-04 Fujitsu Limited Adhesive composition
SG102636A1 (en) * 2000-09-07 2004-03-26 Mitsui Chemicals Inc Polar group-containing olefin copolymer, process for preparing the same, thermoplatic resin composition containing the copolymer, and uses thereof
US20030059618A1 (en) 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
DE60223646T3 (de) * 2001-03-30 2015-02-26 Toray Industries, Inc. Epoxidharzzusammensetzung, verfahren zur herstellung von faserverstärkten verbundwerkstoffen und faserstärkte verbundwerkstoffe
EP1436339B1 (en) * 2001-08-28 2005-10-19 Resolution Research Nederland B.V. Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications
DE10358932A1 (de) * 2002-12-17 2005-07-28 Henkel Kgaa Verfahren zur Herstellung von Polyurethan-Prepolymeren in Gegenwart eines Katalysators

Also Published As

Publication number Publication date
US20110067812A1 (en) 2011-03-24
ATE398148T1 (de) 2008-07-15
EP1602678A1 (en) 2005-12-07
US20050272883A1 (en) 2005-12-08
US7781542B2 (en) 2010-08-24
DE602005007422D1 (de) 2008-07-24
ES2307120T3 (es) 2008-11-16
JP2005344112A (ja) 2005-12-15
EP1602678B9 (en) 2008-11-05
JP4843256B2 (ja) 2011-12-21
EP1602678B1 (en) 2008-06-11
GB0412196D0 (en) 2004-07-07
US8859694B2 (en) 2014-10-14

Similar Documents

Publication Publication Date Title
DK1602678T3 (da) Hærdningsacceleratorer
EP1731545A4 (en) HARDENER FOR EPOXY RESIN AND COMPOSITION OF THE EPOXY RESIN
DE602007006345D1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
TW200602375A (en) Thermosetting resin composition and use thereof
TWI317743B (en) Curing accelerator, epoxy resin composition, and semiconductor device
HK1118303A1 (en) Latent hardener for epoxy resin and epoxy resin composition
HK1086851A1 (en) Curable resin composition, curable film and cured film
TWI367899B (en) Epoxy resin curing agent and epoxy resin composition
DE502007003952D1 (de) Schnellhärtendes chemisches befestigungssystem und dessen verwendung
ATE409712T1 (de) Epoxidharz zusammensetzung
DE602005013079D1 (de) Konstruktionsverfahren unter verwendung eines umkapselten klebstoffs
EP2025695A4 (en) EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN
DE602007005661D1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
BRPI0907273A2 (pt) Composição curável baseada em epóxi, processo para formar uma composição curável baseada em epóxi, resina termofixa e peça baseada em epóxi
TWI369368B (en) Epoxy resin, epoxy resin composition and cured object thereof
TW200613356A (en) Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same
DE602007005610D1 (de) Verfahren zur herstellung einer halbleitervorrichtung und dadurch hergestellte halbleitervorrichtung
WO2009069562A1 (ja) 樹脂組成物
DE602006000562D1 (de) Härtungsmittelzusammensetzung für Epoxidharz und Epoxidharzzusammensetzung
TW201129666A (en) Adhesive composition for semiconductor device and die attach film
DE50106154D1 (de) Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte
TWI366592B (en) Epoxy resin adhesion composition and adhesive for optical semiconductor
ATE490474T1 (de) Sensorpaket
BRPI0921656A2 (pt) cartão com chip comportando um corpo de cartão provido com uma cavidade e um módulo eletrônico
DE602007000866D1 (de) Härter für Epoxidharze und Epoxidharzzusammensetzung