DK149489A - Fremgangsmaade til fremstilling af fotohaerdede belaegninger - Google Patents
Fremgangsmaade til fremstilling af fotohaerdede belaegningerInfo
- Publication number
- DK149489A DK149489A DK149489A DK149489A DK149489A DK 149489 A DK149489 A DK 149489A DK 149489 A DK149489 A DK 149489A DK 149489 A DK149489 A DK 149489A DK 149489 A DK149489 A DK 149489A
- Authority
- DK
- Denmark
- Prior art keywords
- photo
- procedure
- preparation
- hardened coatings
- hardened
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
- G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Epoxy Resins (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17457988A | 1988-03-29 | 1988-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK149489D0 DK149489D0 (da) | 1989-03-28 |
| DK149489A true DK149489A (da) | 1989-09-30 |
Family
ID=22636685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK149489A DK149489A (da) | 1988-03-29 | 1989-03-28 | Fremgangsmaade til fremstilling af fotohaerdede belaegninger |
Country Status (14)
| Country | Link |
|---|---|
| EP (1) | EP0335629A3 (da) |
| JP (1) | JPH029480A (da) |
| KR (1) | KR890014180A (da) |
| CN (1) | CN1037041A (da) |
| AU (1) | AU607318B2 (da) |
| BR (1) | BR8901395A (da) |
| DK (1) | DK149489A (da) |
| FI (1) | FI891480A7 (da) |
| IL (1) | IL89775A0 (da) |
| MX (1) | MX169037B (da) |
| MY (1) | MY103987A (da) |
| NO (1) | NO891226L (da) |
| PH (1) | PH26033A (da) |
| ZA (1) | ZA892266B (da) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2604438B2 (ja) * | 1988-09-19 | 1997-04-30 | 旭電化工業株式会社 | 樹脂の光学的造形方法 |
| JP2632961B2 (ja) * | 1988-09-13 | 1997-07-23 | 旭電化工業株式会社 | 樹脂の光学的造形方法 |
| AU655580B2 (en) * | 1990-04-23 | 1995-01-05 | Minnesota Mining And Manufacturing Company | Energy curable cationically and free-radically polymerizable pressure-sensitive compositions |
| US5102924A (en) * | 1990-08-16 | 1992-04-07 | Minnesota Mining And Manufacturing Company | Polymeric mixtures and process therefor |
| US5238744A (en) * | 1990-08-16 | 1993-08-24 | Minnesota Mining And Manufacturing Company | Tough polymeric mixtures |
| CA2048232A1 (en) * | 1990-09-05 | 1992-03-06 | Jerry W. Williams | Energy curable pressure-sensitive compositions |
| DE69131158T2 (de) * | 1990-11-22 | 1999-12-16 | Canon K.K., Tokio/Tokyo | Photoempfindliches Aufzeichnungsmedium enthaltendes Volumen-Phasenhologram und Verfahren zum Herstellen von einem Volumen-Phasenhologram mit diesem Medium |
| JP2849021B2 (ja) * | 1993-04-12 | 1999-01-20 | 日本ペイント株式会社 | 体積ホログラム記録用感光性組成物 |
| JPH0732696U (ja) * | 1993-11-25 | 1995-06-16 | 防衛庁技術研究本部長 | 水中吸音材ユニット |
| IT1274039B (it) * | 1994-09-02 | 1997-07-14 | Atohaas C V Ora Atohaas Holdin | Processo per la preparazione di articoli formati a base di polimeri acrilici rivestiti con un film antigraffio e antiabrasione |
| US6100007A (en) * | 1998-04-06 | 2000-08-08 | Ciba Specialty Chemicals Corp. | Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures |
| AU770404B2 (en) * | 1999-09-22 | 2004-02-19 | Surmodics, Inc. | Water-soluble coating agents bearing initiator groups and coating process |
| JP4967656B2 (ja) * | 2004-06-17 | 2012-07-04 | 株式会社スリーボンド | 光カチオン重合性組成物及びそれを用いたオプトエレクトロニクス部品 |
| CN100399138C (zh) * | 2006-06-26 | 2008-07-02 | 友达光电股份有限公司 | 液晶面板及其制造方法 |
| JP5163602B2 (ja) * | 2009-07-06 | 2013-03-13 | 大日本印刷株式会社 | 高低パターン層形成体の製造方法 |
| JP5726912B2 (ja) * | 2010-02-13 | 2015-06-03 | マクアリスター テクノロジーズ エルエルシー | 再放射面を有する化学反応器ならびにその関連システムおよび方法 |
| JP5607486B2 (ja) * | 2010-10-08 | 2014-10-15 | サーモディクス，インコーポレイティド | 開始剤基を有する水溶性コーティング剤およびコーティング方法 |
| CN102566285B (zh) * | 2010-12-09 | 2014-05-28 | 远东新世纪股份有限公司 | 制造微结构的方法及该微结构 |
| DE102011077612A1 (de) * | 2011-06-16 | 2012-12-20 | Evonik Röhm Gmbh | Verfahren zur kontinuierlichen inline Herstellung von beschichteten polymeren Substraten oder Laminaten |
| JP5855899B2 (ja) | 2011-10-27 | 2016-02-09 | 日立オートモティブシステムズ株式会社 | Ｄｃ−ｄｃコンバータ及び電力変換装置 |
| EP3397711B1 (en) * | 2015-12-30 | 2023-02-15 | 3M Innovative Properties Company | Dual stage structural bonding adhesive |
| US10858541B2 (en) | 2017-12-19 | 2020-12-08 | Rohm And Haas Electronic Materials Llc | Curable composition |
| CN109467387A (zh) * | 2018-01-15 | 2019-03-15 | 杭州创屹机电科技有限公司 | 一种低孔隙率3d打印陶瓷制品及其制备方法 |
| CN109467385B (zh) * | 2018-01-15 | 2021-09-03 | 杭州创屹机电科技有限公司 | 一种抗菌环保3d打印陶瓷材料及其制备方法 |
| CN109485436A (zh) * | 2018-01-15 | 2019-03-19 | 杭州创屹机电科技有限公司 | 一种3d打印陶瓷材料两步光固化成型方法 |
| JP2019137721A (ja) * | 2018-02-06 | 2019-08-22 | スリーエム イノベイティブ プロパティズ カンパニー | 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法 |
| JP7591818B2 (ja) * | 2020-07-07 | 2024-11-29 | フェニックス電機株式会社 | 露光用の光照射装置および露光装置 |
| CN114641145A (zh) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | 一种线路板及其线路板阻焊层的制作方法 |
| CN114721229B (zh) * | 2022-03-18 | 2023-07-28 | 浙江鑫柔科技有限公司 | 一种新型非对称性紫外曝光方法 |
| CN117255495A (zh) * | 2022-06-09 | 2023-12-19 | 庆鼎精密电子（淮安）有限公司 | 降低防焊层表面离子含量的方法、背光模组及其制造方法 |
| CN116535636B (zh) | 2023-05-17 | 2024-04-16 | 浙江皇马科技股份有限公司 | 一种低粘度密封胶用硅烷封端树脂及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849320A (en) * | 1986-05-10 | 1989-07-18 | Ciba-Geigy Corporation | Method of forming images |
| GB8715435D0 (en) * | 1987-07-01 | 1987-08-05 | Ciba Geigy Ag | Forming images |
-
1989
- 1989-03-16 MX MX015294A patent/MX169037B/es unknown
- 1989-03-21 PH PH38367A patent/PH26033A/en unknown
- 1989-03-21 NO NO89891226A patent/NO891226L/no unknown
- 1989-03-24 MY MYPI89000370A patent/MY103987A/en unknown
- 1989-03-27 BR BR898901395A patent/BR8901395A/pt not_active Application Discontinuation
- 1989-03-28 DK DK149489A patent/DK149489A/da not_active Application Discontinuation
- 1989-03-28 IL IL89775A patent/IL89775A0/xx unknown
- 1989-03-28 ZA ZA892266A patent/ZA892266B/xx unknown
- 1989-03-28 AU AU31748/89A patent/AU607318B2/en not_active Ceased
- 1989-03-28 FI FI891480A patent/FI891480A7/fi not_active Application Discontinuation
- 1989-03-28 EP EP19890302993 patent/EP0335629A3/en not_active Withdrawn
- 1989-03-29 JP JP1075241A patent/JPH029480A/ja active Pending
- 1989-03-29 KR KR1019890004015A patent/KR890014180A/ko not_active Withdrawn
- 1989-03-29 CN CN89101874A patent/CN1037041A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU607318B2 (en) | 1991-02-28 |
| EP0335629A3 (en) | 1991-10-09 |
| EP0335629A2 (en) | 1989-10-04 |
| FI891480L (fi) | 1989-09-30 |
| CN1037041A (zh) | 1989-11-08 |
| NO891226L (no) | 1989-10-02 |
| AU3174889A (en) | 1989-10-05 |
| NO891226D0 (no) | 1989-03-21 |
| BR8901395A (pt) | 1989-11-07 |
| FI891480A7 (fi) | 1989-09-30 |
| DK149489D0 (da) | 1989-03-28 |
| ZA892266B (en) | 1989-11-29 |
| MY103987A (en) | 1993-10-30 |
| MX169037B (es) | 1993-06-17 |
| FI891480A0 (fi) | 1989-03-28 |
| JPH029480A (ja) | 1990-01-12 |
| PH26033A (en) | 1992-01-29 |
| KR890014180A (ko) | 1989-10-23 |
| IL89775A0 (en) | 1989-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AHB | Application shelved due to non-payment |