DK1433204T3 - Indretning med effekthalvlederkomponenter til kapacitetsstyring af höje strömme og anvendelse af indretningen - Google Patents

Indretning med effekthalvlederkomponenter til kapacitetsstyring af höje strömme og anvendelse af indretningen

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Publication number
DK1433204T3
DK1433204T3 DK02769935T DK02769935T DK1433204T3 DK 1433204 T3 DK1433204 T3 DK 1433204T3 DK 02769935 T DK02769935 T DK 02769935T DK 02769935 T DK02769935 T DK 02769935T DK 1433204 T3 DK1433204 T3 DK 1433204T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
conductor
semiconductor components
contact surface
high current
Prior art date
Application number
DK02769935T
Other languages
English (en)
Inventor
Herbert Schwarzbauer
Norbert Seliger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK1433204T3 publication Critical patent/DK1433204T3/da

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)
  • Bipolar Transistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Die Bonding (AREA)
DK02769935T 2001-09-28 2002-09-10 Indretning med effekthalvlederkomponenter til kapacitetsstyring af höje strömme og anvendelse af indretningen DK1433204T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10147917 2001-09-28
DE10211058 2002-03-13

Publications (1)

Publication Number Publication Date
DK1433204T3 true DK1433204T3 (da) 2006-04-03

Family

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DK02769935T DK1433204T3 (da) 2001-09-28 2002-09-10 Indretning med effekthalvlederkomponenter til kapacitetsstyring af höje strömme og anvendelse af indretningen

Country Status (9)

Country Link
US (1) US7057275B2 (da)
EP (1) EP1433204B1 (da)
JP (1) JP4423031B2 (da)
CN (1) CN100477209C (da)
AT (1) ATE311017T1 (da)
DE (2) DE10294631D2 (da)
DK (1) DK1433204T3 (da)
ES (1) ES2248609T3 (da)
WO (1) WO2003032390A2 (da)

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JP4106061B2 (ja) * 2005-04-22 2008-06-25 三菱電機株式会社 パワーユニット装置及び電力変換装置
DE102005039165B4 (de) * 2005-08-17 2010-12-02 Infineon Technologies Ag Draht- und streifengebondetes Halbleiterleistungsbauteil und Verfahren zu dessen Herstellung
DE102007036048A1 (de) 2007-08-01 2009-02-05 Siemens Ag Anordnung mit zumindest einem Halbleiterbauelement, insbesondere einem Leistungshalbleiterbauelement zur Leistungssteuerung hoher Ströme
CN104682673B (zh) * 2013-11-29 2018-06-01 中车大连电力牵引研发中心有限公司 轻轨车辆牵引变流器模块及轻轨车辆牵引变流器
EP2996144B1 (en) * 2013-12-19 2017-09-06 Fuji Electric Co., Ltd. Semiconductor module and electrically driven vehicle
DE102014107271B4 (de) * 2014-05-23 2019-11-07 Infineon Technologies Ag Halbleitermodul
US9842718B1 (en) 2016-06-10 2017-12-12 Sumitomo Wiring Systems, Ltd. Fuse array for vehicle electrical system having multiple discrete circuits
FR3091141B1 (fr) * 2018-12-21 2021-06-25 Valeo Siemens Eautomotive France Sas Ensemble électrique d’une barre de connexion électrique et d’un module de refroidissement
US11682606B2 (en) * 2019-02-07 2023-06-20 Ford Global Technologies, Llc Semiconductor with integrated electrically conductive cooling channels
RU197562U1 (ru) * 2019-12-11 2020-05-13 Валерий Валерьевич Камаев Система электротехнических шин и неподвижных контактов с универсальным держателем
FR3105716B1 (fr) * 2019-12-18 2022-07-01 Valeo Siemens Eautomotive France Sas Équipement électrique comprenant une barre de connexion électrique refroidie par deux faces d’un dissipateur thermique

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JP2725954B2 (ja) 1992-07-21 1998-03-11 三菱電機株式会社 半導体装置およびその製造方法
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WO2003032390A2 (de) 2003-04-17
CN100477209C (zh) 2009-04-08
JP2005505937A (ja) 2005-02-24
EP1433204B1 (de) 2005-11-23
US7057275B2 (en) 2006-06-06
ES2248609T3 (es) 2006-03-16
DE50205066D1 (de) 2005-12-29
US20040256710A1 (en) 2004-12-23
DE10294631D2 (de) 2004-10-07
ATE311017T1 (de) 2005-12-15
EP1433204A2 (de) 2004-06-30
WO2003032390A3 (de) 2004-01-29
JP4423031B2 (ja) 2010-03-03
CN1559087A (zh) 2004-12-29

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