DK0996930T3 - Bærer til et elektronisk kredslöb omfattende afrivningsbestandige midler - Google Patents

Bærer til et elektronisk kredslöb omfattende afrivningsbestandige midler

Info

Publication number
DK0996930T3
DK0996930T3 DK99919315T DK99919315T DK0996930T3 DK 0996930 T3 DK0996930 T3 DK 0996930T3 DK 99919315 T DK99919315 T DK 99919315T DK 99919315 T DK99919315 T DK 99919315T DK 0996930 T3 DK0996930 T3 DK 0996930T3
Authority
DK
Denmark
Prior art keywords
carries
electronic circuit
circuit including
resistant agents
including tear
Prior art date
Application number
DK99919315T
Other languages
English (en)
Inventor
Loc H Alain Le
Original Assignee
Cp8 Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cp8 Technologies filed Critical Cp8 Technologies
Application granted granted Critical
Publication of DK0996930T3 publication Critical patent/DK0996930T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Eyeglasses (AREA)
DK99919315T 1998-05-20 1999-05-10 Bærer til et elektronisk kredslöb omfattende afrivningsbestandige midler DK0996930T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9806361A FR2778997B1 (fr) 1998-05-20 1998-05-20 Support pour un circuit electronique, comprenant des moyens anti-arrachement
PCT/FR1999/001106 WO1999060518A1 (fr) 1998-05-20 1999-05-10 Support pour un circuit electronique, comprenant des moyens anti-arrachement

Publications (1)

Publication Number Publication Date
DK0996930T3 true DK0996930T3 (da) 2007-03-12

Family

ID=9526545

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99919315T DK0996930T3 (da) 1998-05-20 1999-05-10 Bærer til et elektronisk kredslöb omfattende afrivningsbestandige midler

Country Status (9)

Country Link
US (1) US6472733B1 (da)
EP (1) EP0996930B1 (da)
JP (1) JP2002516441A (da)
KR (1) KR100702108B1 (da)
BR (1) BR9906465A (da)
DE (1) DE69933837T2 (da)
DK (1) DK0996930T3 (da)
FR (1) FR2778997B1 (da)
WO (1) WO1999060518A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19957119A1 (de) * 1999-11-26 2001-05-31 Infineon Technologies Ag Chipkarte
DE10328133A1 (de) * 2003-06-23 2005-01-13 Giesecke & Devrient Gmbh Datenträger
CN100382104C (zh) 2003-07-07 2008-04-16 艾利丹尼森公司 具有可改变特性的射频识别装置
US7847380B2 (en) * 2007-09-20 2010-12-07 Samsung Electronics Co., Ltd. Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card
KR100910390B1 (ko) 2007-09-21 2009-08-04 사이버넷 주식회사 인쇄회로기판의 접촉 감지용 패턴.
EP2420960A1 (fr) * 2010-08-17 2012-02-22 Gemalto SA Procédé de fabrication d'un dispositif électronique comportant un module indémontable et dispositif obtenu
US12124905B1 (en) * 2021-12-17 2024-10-22 Wells Fargo Bank, N.A. Transaction instrument with features for destruction and disposal

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
FR2721732B1 (fr) * 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.
FR2724750B1 (fr) * 1994-09-16 1996-12-06 Thomson Csf Carte electronique avec voyant de bon fonctionnement
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
FR2738077B1 (fr) * 1995-08-23 1997-09-19 Schlumberger Ind Sa Micro-boitier electronique pour carte a memoire electronique et procede de realisation
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture

Also Published As

Publication number Publication date
WO1999060518A1 (fr) 1999-11-25
BR9906465A (pt) 2000-09-26
EP0996930A1 (fr) 2000-05-03
FR2778997A1 (fr) 1999-11-26
US6472733B1 (en) 2002-10-29
DE69933837D1 (de) 2006-12-14
FR2778997B1 (fr) 2000-06-23
EP0996930B1 (fr) 2006-11-02
DE69933837T2 (de) 2007-07-05
JP2002516441A (ja) 2002-06-04
KR100702108B1 (ko) 2007-04-02
KR20010021985A (ko) 2001-03-15

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