DK0772048T3 - Anordning til prøvning af printplader og/eller flade moduler - Google Patents

Anordning til prøvning af printplader og/eller flade moduler

Info

Publication number
DK0772048T3
DK0772048T3 DK95117123T DK95117123T DK0772048T3 DK 0772048 T3 DK0772048 T3 DK 0772048T3 DK 95117123 T DK95117123 T DK 95117123T DK 95117123 T DK95117123 T DK 95117123T DK 0772048 T3 DK0772048 T3 DK 0772048T3
Authority
DK
Denmark
Prior art keywords
circuit boards
testing circuit
flat modules
modules
flat
Prior art date
Application number
DK95117123T
Other languages
English (en)
Inventor
Andreas Keune
Uwe Kellermann
Original Assignee
Cit Alcatel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cit Alcatel filed Critical Cit Alcatel
Application granted granted Critical
Publication of DK0772048T3 publication Critical patent/DK0772048T3/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
DK95117123T 1994-08-13 1995-10-31 Anordning til prøvning af printplader og/eller flade moduler DK0772048T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4428797A DE4428797C2 (de) 1994-08-13 1994-08-13 Vorrichtung zum Prüfen von Leiterkarten und/oder Flachbaugruppen
EP95117123A EP0772048B1 (de) 1994-08-13 1995-10-31 Vorrichtung zum Prüfen von Leiterkarten und/oder Flachbaugruppen
JP7298573A JPH09145781A (ja) 1994-08-13 1995-11-16 プリント回路カードおよびまたはフラットモジュールの検査装置
US08/587,921 US5801543A (en) 1994-08-13 1996-01-17 Device for testing printed circuit boards and/or flat modules

Publications (1)

Publication Number Publication Date
DK0772048T3 true DK0772048T3 (da) 2000-06-13

Family

ID=27436031

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95117123T DK0772048T3 (da) 1994-08-13 1995-10-31 Anordning til prøvning af printplader og/eller flade moduler

Country Status (5)

Country Link
US (1) US5801543A (da)
EP (1) EP0772048B1 (da)
JP (1) JPH09145781A (da)
DE (2) DE4428797C2 (da)
DK (1) DK0772048T3 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19802003C1 (de) * 1998-01-20 1999-10-21 Siemens Nixdorf Inf Syst Prüfvorrichtung zum Prüfen der Funktionen von baugruppentypspezifischen Flachbaugruppen und Fertigungseinrichtung mit solchen Prüfvorrichtungen
JP4921348B2 (ja) * 2007-12-28 2012-04-25 矢崎総業株式会社 導通検査具の導通ピン保護構造
DE102009012021B4 (de) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur
IT1395561B1 (it) * 2009-09-03 2012-09-28 Applied Materials Inc Apparato di collaudo e relativo procedimento
CN105572570B (zh) * 2016-03-08 2018-04-13 中通维易科技服务有限公司 一种印制电路板上元件的检测装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3529207C1 (en) * 1985-08-14 1987-03-26 Genrad Gmbh Test device for electrical circuit boards
US4636723A (en) * 1986-03-21 1987-01-13 Coffin Harry S Testing device for printed circuit boards
DE3637406C1 (en) * 1986-11-03 1988-05-05 Genrad Gmbh Test device for circuit boards
US5247249A (en) * 1992-02-13 1993-09-21 Tti Testron, Inc. Bi-level test fixture

Also Published As

Publication number Publication date
DE4428797A1 (de) 1996-02-15
US5801543A (en) 1998-09-01
EP0772048B1 (de) 1999-12-22
JPH09145781A (ja) 1997-06-06
EP0772048A1 (de) 1997-05-07
DE59507487D1 (de) 2000-01-27
DE4428797C2 (de) 1997-04-17

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