DK0502120T3 - Fremgangsmåde til direkte elektroplettering af et dielektrisk substrat - Google Patents

Fremgangsmåde til direkte elektroplettering af et dielektrisk substrat

Info

Publication number
DK0502120T3
DK0502120T3 DK91901113.0T DK91901113T DK0502120T3 DK 0502120 T3 DK0502120 T3 DK 0502120T3 DK 91901113 T DK91901113 T DK 91901113T DK 0502120 T3 DK0502120 T3 DK 0502120T3
Authority
DK
Denmark
Prior art keywords
micro
conducting
dielectric substrate
substrate
conducting layer
Prior art date
Application number
DK91901113.0T
Other languages
Danish (da)
English (en)
Inventor
Kiyoshi Okabayashi
Original Assignee
Harnden Eric F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harnden Eric F filed Critical Harnden Eric F
Application granted granted Critical
Publication of DK0502120T3 publication Critical patent/DK0502120T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK91901113.0T 1989-11-21 1990-11-07 Fremgangsmåde til direkte elektroplettering af et dielektrisk substrat DK0502120T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/440,661 US5071517A (en) 1989-11-21 1989-11-21 Method for directly electroplating a dielectric substrate and plated substrate so produced

Publications (1)

Publication Number Publication Date
DK0502120T3 true DK0502120T3 (da) 1996-08-05

Family

ID=23749664

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91901113.0T DK0502120T3 (da) 1989-11-21 1990-11-07 Fremgangsmåde til direkte elektroplettering af et dielektrisk substrat

Country Status (10)

Country Link
US (1) US5071517A (fr)
EP (1) EP0502120B1 (fr)
JP (1) JP3136539B2 (fr)
KR (1) KR100188481B1 (fr)
AT (1) ATE138116T1 (fr)
DE (1) DE69027040T2 (fr)
DK (1) DK0502120T3 (fr)
ES (1) ES2090300T3 (fr)
GR (1) GR3020348T3 (fr)
WO (1) WO1991007526A1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342501A (en) * 1989-11-21 1994-08-30 Eric F. Harnden Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
WO1993000456A1 (fr) * 1991-06-20 1993-01-07 Harnden, Eric, F. Solutions d'acceleration legerement basiques pour galvanoplastie directe
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
US5681441A (en) * 1992-12-22 1997-10-28 Elf Technologies, Inc. Method for electroplating a substrate containing an electroplateable pattern
CA2119050C (fr) * 1993-03-18 1999-11-23 Nayan H. Joshi Methode d'enduction par immersion non-fermaldehyde auto-accelerante et reconstituante
US5387332A (en) * 1993-07-14 1995-02-07 Straus; Martin Cleaner/conditioner for the direct metallization of non-conductors and printed circuit boards
US5374346A (en) * 1993-08-09 1994-12-20 Rohm And Haas Company Electroplating process and composition
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
DE4412463C3 (de) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung
US6210537B1 (en) 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
US5855755A (en) * 1995-06-19 1999-01-05 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
US5908543A (en) * 1997-02-03 1999-06-01 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive materials
US6598291B2 (en) * 1998-03-20 2003-07-29 Viasystems, Inc. Via connector and method of making same
AU3210999A (en) * 1999-03-29 2000-10-16 Viasystems, Inc. A via connector and method of making same
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
US6334965B1 (en) 1999-09-07 2002-01-01 Lynntech, Inc. Electronically conductive polymers
WO2004095614A2 (fr) * 2003-04-18 2004-11-04 Ube Industries, Ltd. Couche de carbone poreuse sur support metallique, electrode de pile a combustible et pile a combustible comprenant cette electrode
US7585549B2 (en) * 2003-07-09 2009-09-08 Fry's Metals, Inc. Method of applying a pattern of particles to a substrate
JP2005223063A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 配線基板の製造方法及び電子デバイスの製造方法
JP2006070319A (ja) * 2004-09-01 2006-03-16 Toyota Motor Corp 樹脂めっき方法
US7368045B2 (en) * 2005-01-27 2008-05-06 International Business Machines Corporation Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
US8840960B2 (en) * 2006-11-01 2014-09-23 United Technologies Corporation Method of cleaning carbon composite prior to application of thermal coating
US8497359B2 (en) * 2010-02-26 2013-07-30 Ppg Industries Ohio, Inc. Cationic electrodepositable coating composition comprising lignin
KR102307816B1 (ko) * 2019-12-26 2021-10-05 한국과학기술원 도전성 여과막 제조 장치 및 이를 이용한 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US4061588A (en) * 1975-09-30 1977-12-06 Shipley Company Inc. Catalyst composition and method of preparation
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
US4481236A (en) * 1983-05-02 1984-11-06 General Motors Corporation Life extension of catalyst predip baths
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
US4891069A (en) * 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
JP2586466B2 (ja) * 1986-12-08 1997-02-26 日本エクスラン工業株式会社 金属被覆炭素材料の製造法
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
JPH0686666B2 (ja) * 1988-01-12 1994-11-02 清 岡林 化学メッキ用増感活性剤

Also Published As

Publication number Publication date
EP0502120B1 (fr) 1996-05-15
WO1991007526A1 (fr) 1991-05-30
JP3136539B2 (ja) 2001-02-19
ATE138116T1 (de) 1996-06-15
US5071517A (en) 1991-12-10
EP0502120A1 (fr) 1992-09-09
GR3020348T3 (en) 1996-09-30
EP0502120A4 (en) 1993-03-24
DE69027040D1 (de) 1996-06-20
KR927003884A (ko) 1992-12-18
DE69027040T2 (de) 1996-10-31
JPH05504167A (ja) 1993-07-01
ES2090300T3 (es) 1996-10-16
KR100188481B1 (ko) 1999-06-15

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