DK0435648T3 - Harpiksmateriale til indsættelse deri af en lederamme, og en deraf formstøbt komponent - Google Patents

Harpiksmateriale til indsættelse deri af en lederamme, og en deraf formstøbt komponent

Info

Publication number
DK0435648T3
DK0435648T3 DK90314248.7T DK90314248T DK0435648T3 DK 0435648 T3 DK0435648 T3 DK 0435648T3 DK 90314248 T DK90314248 T DK 90314248T DK 0435648 T3 DK0435648 T3 DK 0435648T3
Authority
DK
Denmark
Prior art keywords
resin material
weight
parts
guide frame
molded component
Prior art date
Application number
DK90314248.7T
Other languages
Danish (da)
English (en)
Inventor
Mikio Nakai
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Application granted granted Critical
Publication of DK0435648T3 publication Critical patent/DK0435648T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Road Signs Or Road Markings (AREA)
  • Sawing (AREA)
DK90314248.7T 1989-12-27 1990-12-24 Harpiksmateriale til indsættelse deri af en lederamme, og en deraf formstøbt komponent DK0435648T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34468689 1989-12-27

Publications (1)

Publication Number Publication Date
DK0435648T3 true DK0435648T3 (da) 1996-06-10

Family

ID=18371196

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90314248.7T DK0435648T3 (da) 1989-12-27 1990-12-24 Harpiksmateriale til indsættelse deri af en lederamme, og en deraf formstøbt komponent

Country Status (10)

Country Link
US (1) US5160786A (es)
EP (1) EP0435648B1 (es)
JP (1) JPH0828444B2 (es)
KR (1) KR940003263B1 (es)
AT (1) ATE134071T1 (es)
CA (1) CA2032962A1 (es)
DE (1) DE69025303T2 (es)
DK (1) DK0435648T3 (es)
ES (1) ES2083440T3 (es)
GR (1) GR3019723T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9200440A (nl) * 1992-03-10 1993-10-01 Gen Electric Polymeermengsel met polyaryleensulfide, elastomeer polymeer en metaalzout.
US5990225A (en) * 1995-05-17 1999-11-23 Mitsubishi Chemical Corporation Resin of polyphenylene sulfide, polyethylene graft and TFE for sliding member
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
JP2002301737A (ja) * 2001-04-06 2002-10-15 Idemitsu Petrochem Co Ltd 金属インサート樹脂成形体の製造方法及び半導体装置
JP6132669B2 (ja) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 金属樹脂複合成形体及びその製造方法
JPWO2020175390A1 (es) * 2019-02-25 2020-09-03
US20220177700A1 (en) * 2019-02-25 2022-06-09 Kuraray Co., Ltd. Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4482665A (en) * 1982-09-14 1984-11-13 Phillips Petroleum Company Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
JPS59207921A (ja) * 1983-05-13 1984-11-26 Dainippon Ink & Chem Inc 熱可塑性樹脂組成物
US4748169A (en) * 1985-01-16 1988-05-31 Dainippon Ink And Chemicals, Inc. Polyarylene sulfide resin composition
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JP2615550B2 (ja) * 1985-09-17 1997-05-28 大日本インキ化学工業株式会社 樹脂封止電子部品
JPH0739546B2 (ja) * 1986-04-14 1995-05-01 大日本インキ化学工業株式会社 成形用ポリフエニレンスルフイド樹脂組成物
JPS62253656A (ja) * 1986-04-28 1987-11-05 Kureha Chem Ind Co Ltd ポリアリ−レンチオエ−テル成形物

Also Published As

Publication number Publication date
ATE134071T1 (de) 1996-02-15
JPH0828444B2 (ja) 1996-03-21
EP0435648A3 (en) 1991-09-11
US5160786A (en) 1992-11-03
ES2083440T3 (es) 1996-04-16
DE69025303D1 (de) 1996-03-21
JPH04123461A (ja) 1992-04-23
GR3019723T3 (en) 1996-07-31
CA2032962A1 (en) 1991-06-28
EP0435648A2 (en) 1991-07-03
DE69025303T2 (de) 1996-07-11
EP0435648B1 (en) 1996-02-07
KR940003263B1 (ko) 1994-04-16
KR910012086A (ko) 1991-08-07

Similar Documents

Publication Publication Date Title
DE3887450D1 (de) Glasfaserverstärkte thermoplastische Harzzusammensetzungen.
DK0435648T3 (da) Harpiksmateriale til indsættelse deri af en lederamme, og en deraf formstøbt komponent
ATE87949T1 (de) Verfahren zur herstellung von copoly(arylensulfiden) mit endstaendigen gruppen.
DE68924542D1 (de) Klebstoffmasse.
ATE20673T1 (de) Schlagfeste harzmatrizen fuer verbundstoffe.
KR900006440A (ko) 폴리아릴렌 설파이드 수지 조성물 및 금속과 결합된 이의 성형품
ES2017615B3 (es) Composicion de foto-resistencia y circuito impreso.
NO911392L (no) Polyketonpolymermateriale
DE69008656D1 (de) Wetterbeständige Polyacetalharz-Zusammensetzung.
DE69123136T2 (de) Polyethylenharzzusammensetzung
KR920002703A (ko) 폴리(아릴렌 설피드)성형 조성물
DK0469153T3 (da) Fremgangsmåde til fremstilling af termoplastisk elastomer
ATE162541T1 (de) Polyarylensulfidsulfon-harzzusammensetzung und verfahren zu ihrer herstellung
ATE143038T1 (de) Glasgefüllte polyarylensulfidmischungen
KR920004511A (ko) 폴리(아릴렌 설피드)수지 조성물의 제조방법
JPS6451458A (en) Polyamide resin composition
JPS52150493A (en) Ultraviolet light curing resin compositions
JPS5414499A (en) Heat resistant resin composition
ES2104728T3 (es) Composicion a base de resina de sulfuro de poliarileno y produccion de esta composicion.
JPS5767645A (en) Thermoplastic resin composition
ATE120220T1 (de) Polyolefin harzzusammensetzung, vernetzte formkörper und verfahren zur deren herstellung.
JPS6462354A (en) Plastic molding material
JPS5243857A (en) Grafted copolymer compositions reinforced with glass fibers
KR900001793A (ko) 폴리아릴렌 술피드 수지조성물 및 그의 성형품
JPS537757A (en) Tehrmoplastic resin composition