DE9409045U1 - Heatsinks for microprocessors - Google Patents
Heatsinks for microprocessorsInfo
- Publication number
- DE9409045U1 DE9409045U1 DE9409045U DE9409045U DE9409045U1 DE 9409045 U1 DE9409045 U1 DE 9409045U1 DE 9409045 U DE9409045 U DE 9409045U DE 9409045 U DE9409045 U DE 9409045U DE 9409045 U1 DE9409045 U1 DE 9409045U1
- Authority
- DE
- Germany
- Prior art keywords
- webs
- body according
- fan motor
- cooling fins
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 18
- 230000006978 adaptation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Dr. Werner HaßlerDr. Werner Hassler
PatentanwaltPatent Attorney
Äsenberg 62 1. Juni 1994Äsenberg 62 1 June 1994
58507 Lüdenscheid A 94 07058507 Lüdenscheid A 94 070
Anmelder: Fischer Elektronik GmbH & Co. KG Nottebohmstraße 28 58511 LüdenscheidApplicant: Fischer Elektronik GmbH & Co. KG Nottebohmstraße 28 58511 Lüdenscheid
Kühlkörper für MikroprozessorenHeatsinks for microprocessors BeschreibungDescription
Das Gebrauchsmuster betrifft einen Kühlkörper für Mikroprozessoren mit einer Kühlrippen tragenden Auflageplatte für den Mikroprozessor und mit Halterungen für einen Lüftermotor.The utility model relates to a heat sink for microprocessors with a support plate for the microprocessor carrying cooling fins and with holders for a fan motor.
Bekannte Kühlkörper für Mikroprozessoren und andere Hochleistungshalbleiter weisen zusätzlich Rahmen, Haken, Klammern und/oder Verschraubungen für die Befestigung des Mikroprozessors und eines Lüftermotors auf. Infolgedessen ist der Aufwand an Bauteilen und der Montageaufwand erheblich.Known heat sinks for microprocessors and other high-performance semiconductors also have frames, hooks, clamps and/or screw connections for attaching the microprocessor and a fan motor. As a result, the number of components and the assembly effort are considerable.
Aufgabe des Gebrauchsmusters ist eine solche Ausbildung des Kühlkörpers, daß eine schnelle und feste Montage und eine sichere Halterung des Mikroprozessors und des Lüftermotors sichergestellt ist.The purpose of the utility model is to design the heat sink in such a way that quick and firm assembly and secure mounting of the microprocessor and the fan motor is ensured.
Diese Aufgabe wird nach dem Gebrauchsmuster dadurch gelöst, daß an den äußeren Kühlrippen zwei leicht gegeneinander geneigte Stege überstehen, die das Einschieben des Lüftermotors erlauben.This task is solved according to the utility model in that two slightly inclined webs protrude from the outer cooling fins, which allow the fan motor to be inserted.
Das Gebrauchsmuster unterscheidet sich insofern vom Stand der Technik, als die Gestaltung der Stege eine nachgiebig klemmende und formschlüssige Halterung der Bauteile gewährleistet. Die Bauteile lassen sich schnell einschieben. Maßtoleranzen gleichen sich hierbei aus.The utility model differs from the state of the art in that the design of the webs ensures a flexible, clamping and positive-locking mounting of the components. The components can be inserted quickly. Dimensional tolerances are compensated for in this way.
Der Mikroprozessor wird dadurch sicher aufgenommen, daß von gegenüberliegenden Rändern der Aufnahmeplatte zwei Stege mit Klemmkanten überstehen. Dadurch erreicht man eine nachgiebig klemmende Aufnahme, so daß Maßtoleranzen elastisch aufgenommen werden.The microprocessor is securely held in place by two webs with clamping edges protruding from opposite edges of the mounting plate. This creates a flexible clamping mount so that dimensional tolerances are elastically accommodated.
Eine funktionsgerechte Gestaltung ergibt sich dadurch, daß jeweils zwei der genannten Stege an den äußeren Kühlrippen in entgegengesetzten Richtungen angesetzt sind.A functional design is achieved by attaching two of the aforementioned webs to the outer cooling fins in opposite directions.
Eine weitere Anpassung an Bauverhältnisse ist dadurch möglich, daß an den Kühlrippen Schenkel sitzen, die die Stege tragen.A further adaptation to construction conditions is possible by adding legs to the cooling fins that support the webs.
Die elastische Klemmung wird dadurch verbessert, daß die Klemmkanten gegeneinander gerichtete geneigte Flächen aufweisen.The elastic clamping is improved by the fact that the clamping edges have inclined surfaces facing each other.
Eine erschütterungsfreie Halterung des Lüftermotors wird dadurch erzielt, daß die Stege zur Aufnahme des Lüftermotors in den Klemm flächen jeweils mindestens eine Rippe aufweisen.A vibration-free mounting of the fan motor is achieved by ensuring that the webs for holding the fan motor in the clamping surfaces each have at least one rib.
Ein Ausführungsbeispiel des Gebrauchsmusters wird anhand der Zeichnung erläutert, in der darstellen:An embodiment of the utility model is explained using the drawing, which shows:
Fig. 1 eine Seitenansicht des Kühlkörpers undFig. 1 a side view of the heat sink and Fig. 2 eine Unteransicht desselben.Fig. 2 a bottom view of the same.
Der Kühlkörper 1 ist aus einem Aluminiumstrangpreßprofil ausgebildet. An einer ebenen Aufnahmeplatte 2 sitzen Kühlrippen 3. Jeweils an den äußeren, randständigen Kühlrippen 4 sind an rechtwinklig abstehenden Schenkeln 12 Stege 5 in Richtung der Kühlrippen und ferner unter U-förmiger Umbiegung gegenüber den Kühlrippen Stege 6 angeformt. Die Stege 5 sind leicht gegeneinander geneigt und weisen an den gegeneinander gerichteten Flächen jeweils mindestens eine Rippe 7 auf. Die Stege 6 enden in geneigt gegeneinander gerichtete Klemmkanten 8.The heat sink 1 is made of an extruded aluminum profile. Cooling fins 3 are located on a flat mounting plate 2. On each of the outer, edge cooling fins 4, webs 5 are formed on legs 12 that protrude at right angles in the direction of the cooling fins and, furthermore, webs 6 are formed with a U-shaped bend opposite the cooling fins. The webs 5 are slightly inclined towards each other and each have at least one rib 7 on the surfaces facing each other. The webs 6 end in clamping edges 8 that are inclined towards each other.
Unter die Klemmkanten 8 wird unter Zwischenlage einer Wärmeleitfolie 9 ein Mikroprozessor 10 eingeschoben. Die Klemmkanten 8 halten den Mikroprozessoer 10 nachgiebig federnd fest. Zwischen die Stege 5 wird ein Lüftermotor 11 eingeschoeben, der durch die Rippen 7 festgehalten wird.A microprocessor 10 is inserted under the clamping edges 8 with a heat-conducting foil 9 in between. The clamping edges 8 hold the microprocessor 10 in place with a flexible spring. A fan motor 11 is inserted between the webs 5 and is held in place by the ribs 7.
Diese Ausbildung des Kühlkörpers 1 erfordert keine zusätzlichen Bauteile zur Halterung des Mikroprozessors und des Lüftermotors. Der Einbau dieser Teile ist sehr einfach ohne Hilfsmittel möglich. Es ergibt sich eine sichere Halterung.This design of the heat sink 1 does not require any additional components to hold the microprocessor and the fan motor. These parts can be installed very easily without any tools. The result is a secure mount.
Claims (6)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9409045U DE9409045U1 (en) | 1994-06-03 | 1994-06-03 | Heatsinks for microprocessors |
DE9417497U DE9417497U1 (en) | 1994-06-03 | 1994-11-07 | Heatsinks for microprocessors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9409045U DE9409045U1 (en) | 1994-06-03 | 1994-06-03 | Heatsinks for microprocessors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9409045U1 true DE9409045U1 (en) | 1994-09-01 |
Family
ID=6909415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9409045U Expired - Lifetime DE9409045U1 (en) | 1994-06-03 | 1994-06-03 | Heatsinks for microprocessors |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9409045U1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0777270A1 (en) * | 1995-11-30 | 1997-06-04 | STMicroelectronics S.r.l. | Heat dissipator for electronic devices |
DE19640381A1 (en) * | 1996-09-30 | 1998-06-10 | Siemens Ag | Heatsink for Pentium (RTM) processor chip |
DE102018115577A1 (en) * | 2018-06-28 | 2020-01-02 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Cooling device in a modular design |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222090A (en) * | 1977-11-25 | 1980-09-09 | Jaffe Richard A | Micromodular electronic package |
DE9302754U1 (en) * | 1993-02-25 | 1993-04-15 | Hwang Piin Co. Ltd., Lu Jou Hsiang, Taipeh | Cooling fin arrangement for an integrated circuit |
DE9319941U1 (en) * | 1993-12-24 | 1994-02-10 | Global Win Technology Co., Ltd., Shih Lin, Taipeh | Rib body assembly for an integrated circuit |
DE9317507U1 (en) * | 1993-11-16 | 1994-03-03 | Global Win Technology Co., Ltd., Shih Lin, Taipeh | Cooling device for an integrated circuit |
US5295043A (en) * | 1992-02-03 | 1994-03-15 | Tandon Corporation | Clip-on heat sink and method of cooling a computer chip package |
DE9404388U1 (en) * | 1994-03-16 | 1994-05-19 | Chiou, Ming Der, Chung Ho, Taipeh | Cooling device for a CPU |
-
1994
- 1994-06-03 DE DE9409045U patent/DE9409045U1/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222090A (en) * | 1977-11-25 | 1980-09-09 | Jaffe Richard A | Micromodular electronic package |
US5295043A (en) * | 1992-02-03 | 1994-03-15 | Tandon Corporation | Clip-on heat sink and method of cooling a computer chip package |
DE9302754U1 (en) * | 1993-02-25 | 1993-04-15 | Hwang Piin Co. Ltd., Lu Jou Hsiang, Taipeh | Cooling fin arrangement for an integrated circuit |
DE9317507U1 (en) * | 1993-11-16 | 1994-03-03 | Global Win Technology Co., Ltd., Shih Lin, Taipeh | Cooling device for an integrated circuit |
DE9319941U1 (en) * | 1993-12-24 | 1994-02-10 | Global Win Technology Co., Ltd., Shih Lin, Taipeh | Rib body assembly for an integrated circuit |
DE9404388U1 (en) * | 1994-03-16 | 1994-05-19 | Chiou, Ming Der, Chung Ho, Taipeh | Cooling device for a CPU |
Non-Patent Citations (1)
Title |
---|
UNGERER,Bert: Kalte Hüte. In. c`t 1992, H.8, S.140-144 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0777270A1 (en) * | 1995-11-30 | 1997-06-04 | STMicroelectronics S.r.l. | Heat dissipator for electronic devices |
DE19640381A1 (en) * | 1996-09-30 | 1998-06-10 | Siemens Ag | Heatsink for Pentium (RTM) processor chip |
DE19640381C2 (en) * | 1996-09-30 | 1999-08-26 | Siemens Ag | Heat sink for electronic components with a fan and method for mounting the heat sink |
DE102018115577A1 (en) * | 2018-06-28 | 2020-01-02 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Cooling device in a modular design |
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