DE9319941U1 - Rib body assembly for an integrated circuit - Google Patents

Rib body assembly for an integrated circuit

Info

Publication number
DE9319941U1
DE9319941U1 DE9319941U DE9319941U DE9319941U1 DE 9319941 U1 DE9319941 U1 DE 9319941U1 DE 9319941 U DE9319941 U DE 9319941U DE 9319941 U DE9319941 U DE 9319941U DE 9319941 U1 DE9319941 U1 DE 9319941U1
Authority
DE
Germany
Prior art keywords
integrated circuit
body assembly
rib body
rib
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9319941U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huei Bin Enterprise Corp
Global Win Technology Co Ltd
Original Assignee
Huei Bin Enterprise Corp
Global Win Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huei Bin Enterprise Corp, Global Win Technology Co Ltd filed Critical Huei Bin Enterprise Corp
Priority to DE9319941U priority Critical patent/DE9319941U1/en
Publication of DE9319941U1 publication Critical patent/DE9319941U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE9319941U 1993-12-24 1993-12-24 Rib body assembly for an integrated circuit Expired - Lifetime DE9319941U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9319941U DE9319941U1 (en) 1993-12-24 1993-12-24 Rib body assembly for an integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9319941U DE9319941U1 (en) 1993-12-24 1993-12-24 Rib body assembly for an integrated circuit

Publications (1)

Publication Number Publication Date
DE9319941U1 true DE9319941U1 (en) 1994-02-10

Family

ID=6902534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9319941U Expired - Lifetime DE9319941U1 (en) 1993-12-24 1993-12-24 Rib body assembly for an integrated circuit

Country Status (1)

Country Link
DE (1) DE9319941U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9409045U1 (en) * 1994-06-03 1994-09-01 Fischer Elektronik Gmbh & Co K Heatsinks for microprocessors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9409045U1 (en) * 1994-06-03 1994-09-01 Fischer Elektronik Gmbh & Co K Heatsinks for microprocessors

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DE9319941U1 (en) Rib body assembly for an integrated circuit