DE9302754U1 - - Google Patents

Info

Publication number
DE9302754U1
DE9302754U1 DE19939302754 DE9302754U DE9302754U1 DE 9302754 U1 DE9302754 U1 DE 9302754U1 DE 19939302754 DE19939302754 DE 19939302754 DE 9302754 U DE9302754 U DE 9302754U DE 9302754 U1 DE9302754 U1 DE 9302754U1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19939302754
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HWANG PIIN CO Ltd LU JOU HSIANG TAIPEH TW
Original Assignee
HWANG PIIN CO Ltd LU JOU HSIANG TAIPEH TW
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE19939302754 1993-02-25 1993-02-25 Expired - Lifetime DE9302754U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19939302754 DE9302754U1 (en) 1993-02-25 1993-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19939302754 DE9302754U1 (en) 1993-02-25 1993-02-25

Publications (1)

Publication Number Publication Date
DE9302754U1 true DE9302754U1 (en) 1993-04-15

Family

ID=6889868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19939302754 Expired - Lifetime DE9302754U1 (en) 1993-02-25 1993-02-25

Country Status (1)

Country Link
DE (1) DE9302754U1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
DE9409045U1 (en) * 1994-06-03 1994-09-01 Fischer Elektronik Gmbh & Co K Heat sinks for microprocessors
DE4307000A1 (en) * 1993-03-05 1994-09-08 Siemens Ag Vacuum cleaner with a suction fan
DE4427426A1 (en) * 1993-11-05 1995-05-11 Horng Ching Shen Motor having an arrangement for heat dissipation
DE9412460U1 (en) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltech A cooling device for electrical or electronic components comprising a base plate with cooling elements and
DE19509904A1 (en) * 1995-03-03 1996-09-19 Hong Chen Fu In Fan for dissipating heat from electronic component
DE19640381A1 (en) * 1996-09-30 1998-06-10 Siemens Ag Heatsink for Pentium (RTM) processor chip
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DE102005001748A1 (en) * 2005-01-14 2006-07-27 Marquardt Gmbh Controller e.g. electric switch for electric hand tool has stop element which has contour and heat sink with corresponding counter-contour which act together in such a way that heat sink rests on casing in tangential manner
US7101149B2 (en) 2003-05-22 2006-09-05 Arctic-Cooling Switzerland Ag Axial fan for computer

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504650A (en) * 1992-05-28 1996-04-02 Fujitsu Limited Heat sink for cooling a heat producing element and application
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
US5650912A (en) * 1992-05-28 1997-07-22 Fujitu Limited Heat sink for cooling a heat producing element and application
EP0572326A3 (en) * 1992-05-28 1995-09-06 Fujitsu Ltd Heat sink for cooling a heat producing element and application
US5940267A (en) * 1992-05-28 1999-08-17 Fujitsu Limited Heat sink for cooling a heat producing element and application
DE4307000A1 (en) * 1993-03-05 1994-09-08 Siemens Ag Vacuum cleaner with a suction fan
DE4427426A1 (en) * 1993-11-05 1995-05-11 Horng Ching Shen Motor having an arrangement for heat dissipation
DE9409045U1 (en) * 1994-06-03 1994-09-01 Fischer Elektronik Gmbh & Co K Heat sinks for microprocessors
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DE9412460U1 (en) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltech A cooling device for electrical or electronic components comprising a base plate with cooling elements and
EP0696160A2 (en) 1994-08-02 1996-02-07 Hoogovens Aluminium Profiltechnik GmbH Cooling device for electrical or electronic components having a main board and cooling elements, and method for making the same
DE19509904A1 (en) * 1995-03-03 1996-09-19 Hong Chen Fu In Fan for dissipating heat from electronic component
DE19509904C2 (en) * 1995-03-03 1999-02-25 Hong Chen Fu In Cooling means for dissipating heat from elekronischen components by means of a fan
DE19640381A1 (en) * 1996-09-30 1998-06-10 Siemens Ag Heatsink for Pentium (RTM) processor chip
DE19640381C2 (en) * 1996-09-30 1999-08-26 Siemens Ag Heat sink for electronic components with a fan and method of assembling the heatsink
US7101149B2 (en) 2003-05-22 2006-09-05 Arctic-Cooling Switzerland Ag Axial fan for computer
DE102005001748A1 (en) * 2005-01-14 2006-07-27 Marquardt Gmbh Controller e.g. electric switch for electric hand tool has stop element which has contour and heat sink with corresponding counter-contour which act together in such a way that heat sink rests on casing in tangential manner

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