DE8716103U1 - Meßwiderstand für Temperaturmessungen - Google Patents

Meßwiderstand für Temperaturmessungen

Info

Publication number
DE8716103U1
DE8716103U1 DE8716103U DE8716103U DE8716103U1 DE 8716103 U1 DE8716103 U1 DE 8716103U1 DE 8716103 U DE8716103 U DE 8716103U DE 8716103 U DE8716103 U DE 8716103U DE 8716103 U1 DE8716103 U1 DE 8716103U1
Authority
DE
Germany
Prior art keywords
measuring resistor
temperature measurements
contact surfaces
resistance layer
conductor tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8716103U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Priority to DE8716103U priority Critical patent/DE8716103U1/de
Publication of DE8716103U1 publication Critical patent/DE8716103U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE8716103U 1987-12-05 1987-12-05 Meßwiderstand für Temperaturmessungen Expired DE8716103U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8716103U DE8716103U1 (de) 1987-12-05 1987-12-05 Meßwiderstand für Temperaturmessungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8716103U DE8716103U1 (de) 1987-12-05 1987-12-05 Meßwiderstand für Temperaturmessungen

Publications (1)

Publication Number Publication Date
DE8716103U1 true DE8716103U1 (de) 1988-01-21

Family

ID=6814799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8716103U Expired DE8716103U1 (de) 1987-12-05 1987-12-05 Meßwiderstand für Temperaturmessungen

Country Status (1)

Country Link
DE (1) DE8716103U1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3939165C1 (en) * 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
WO1995008176A1 (fr) * 1993-09-15 1995-03-23 Raychem Corporation Ensemble electrique comprenant un element resistif presentant un coefficient de temperature positif (ctp)
WO1995031816A1 (fr) * 1994-05-16 1995-11-23 Raychem Corporation Dispositifs electriques comprenant un element resistant ctp
EP0809094A1 (fr) * 1996-05-24 1997-11-26 Heraeus Sensor-Nite GmbH Méthode de fabrication d'un élément capteur pour la mesure de température
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
DE19640058C2 (de) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Leiterplatte mit Zugentlastung für Anschluß-Kabel, Verfahren zu deren Herstellung und Verbindung sowie deren Verwendung
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
WO2008065093A2 (fr) * 2006-11-27 2008-06-05 Endress+Hauser Wetzer Gmbh+Co. Kg Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact
DE102011103828A1 (de) 2011-06-01 2012-12-06 Heraeus Sensor Technology Gmbh Massenproduktion kleiner Temepratursensoren mit Flip-Chips
DE102011103827B4 (de) * 2011-06-01 2014-12-24 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Temperatursensors

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3939165C1 (en) * 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US7355504B2 (en) 1992-07-09 2008-04-08 Tyco Electronics Corporation Electrical devices
US6651315B1 (en) 1992-07-09 2003-11-25 Tyco Electronics Corporation Electrical devices
WO1995008176A1 (fr) * 1993-09-15 1995-03-23 Raychem Corporation Ensemble electrique comprenant un element resistif presentant un coefficient de temperature positif (ctp)
EP1235233A3 (fr) * 1993-09-15 2004-01-14 Tyco Electronics Corporation Ensemble électrique
EP1235233A2 (fr) * 1993-09-15 2002-08-28 Tyco Electronics Corporation Ensemble électrique comprenant un élément résistif présentant un coéfficient de température positif (CTP)
EP0853323A3 (fr) * 1994-05-16 1998-09-02 Raychem Corporation Dispositif électrique comprenant une résistance à coefficient de température positif
EP0853323A2 (fr) * 1994-05-16 1998-07-15 Raychem Corporation Dispositif électrique comprenant une résistance à coefficient de température positif
WO1995031816A1 (fr) * 1994-05-16 1995-11-23 Raychem Corporation Dispositifs electriques comprenant un element resistant ctp
US5831510A (en) * 1994-05-16 1998-11-03 Zhang; Michael PTC electrical devices for installation on printed circuit boards
US6292088B1 (en) 1994-05-16 2001-09-18 Tyco Electronics Corporation PTC electrical devices for installation on printed circuit boards
EP0809094A1 (fr) * 1996-05-24 1997-11-26 Heraeus Sensor-Nite GmbH Méthode de fabrication d'un élément capteur pour la mesure de température
US6082609A (en) * 1996-05-24 2000-07-04 Heraeus Electro-Nite International N.V. Process for producing a sensor arrangement for measuring temperature
DE19640058C2 (de) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Leiterplatte mit Zugentlastung für Anschluß-Kabel, Verfahren zu deren Herstellung und Verbindung sowie deren Verwendung
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
WO2008065093A2 (fr) * 2006-11-27 2008-06-05 Endress+Hauser Wetzer Gmbh+Co. Kg Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact
WO2008065093A3 (fr) * 2006-11-27 2009-01-22 Endress & Hauser Wetzer Gmbh Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact
DE102011103828A1 (de) 2011-06-01 2012-12-06 Heraeus Sensor Technology Gmbh Massenproduktion kleiner Temepratursensoren mit Flip-Chips
DE102011103827B4 (de) * 2011-06-01 2014-12-24 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Temperatursensors
DE102011103828B4 (de) * 2011-06-01 2017-04-06 Heraeus Sensor Technology Gmbh Massenproduktion kleiner Temepratursensoren mit Flip-Chips

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