WO2008065093A3 - Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact - Google Patents
Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact Download PDFInfo
- Publication number
- WO2008065093A3 WO2008065093A3 PCT/EP2007/062842 EP2007062842W WO2008065093A3 WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3 EP 2007062842 W EP2007062842 W EP 2007062842W WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contacting
- monitoring
- conductor structure
- sensor unit
- determining
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
L'invention concerne un dispositif de détermination et/ou de contrôle d'au moins une grandeur de processus. Selon l'invention, on prévoit au moins une unité de détection (1); l'unité de détection (1) est disposée avec un côté inférieur sur un côté supérieur d'un substrat (2); l'unité de détection (1) est connectée à au moins une pastille de contact (3) pour la mise en contact électrique; on prévoit au moins une platine de contact (5); la platine de contact (5) est pourvue d'une structure conductrice (6) sur un côté inférieur, la structure conductrice étant conçue en correspondance avec la disposition de la pastille de contact (3); la structure conductrice (6) et la pastille de contact (3) sont mises en contact électrique l'une avec l'autre; et la platine de contact (5) présente au moins une unité de mise en contact (7) sur le côté supérieur, l'unité de mise en contact (7) et la structure conductrice (6) étant mises en contact électrique l'une avec l'autre. L'invention concerne également un procédé de mise en contact d'une unité de détection.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006056171.6 | 2006-11-27 | ||
DE102006056171A DE102006056171A1 (de) | 2006-11-27 | 2006-11-27 | Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008065093A2 WO2008065093A2 (fr) | 2008-06-05 |
WO2008065093A3 true WO2008065093A3 (fr) | 2009-01-22 |
Family
ID=39326434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/062842 WO2008065093A2 (fr) | 2006-11-27 | 2007-11-27 | Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102006056171A1 (fr) |
WO (1) | WO2008065093A2 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4677850A (en) * | 1983-02-11 | 1987-07-07 | Nippon Soken, Inc. | Semiconductor-type flow rate detecting apparatus |
DE8716103U1 (de) * | 1987-12-05 | 1988-01-21 | Degussa Ag, 6000 Frankfurt | Meßwiderstand für Temperaturmessungen |
DE19750123A1 (de) * | 1997-11-13 | 1999-06-10 | Heraeus Sensor Nite Gmbh | Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung |
US20060185429A1 (en) * | 2005-02-21 | 2006-08-24 | Finemems Inc. | An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4285002A (en) * | 1978-01-19 | 1981-08-18 | International Computers Limited | Integrated circuit package |
JPS5974653A (ja) * | 1982-10-22 | 1984-04-27 | Hitachi Ltd | 半導体装置 |
US5856914A (en) * | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
DE19812690C1 (de) * | 1998-03-23 | 1999-11-18 | Siemens Ag | Träger für einen temperaturabhängigen Widerstand |
JP4486289B2 (ja) * | 2001-03-30 | 2010-06-23 | 株式会社デンソー | フローセンサ及びその製造方法 |
JP2006010547A (ja) * | 2004-06-28 | 2006-01-12 | Denso Corp | 湿度センサモジュールおよび湿度センサの実装構造 |
DE102005051672A1 (de) * | 2005-10-28 | 2007-05-03 | Hydac Electronic Gmbh | Mehrdimensionaler Fluidströmungssensor |
-
2006
- 2006-11-27 DE DE102006056171A patent/DE102006056171A1/de not_active Withdrawn
-
2007
- 2007-11-27 WO PCT/EP2007/062842 patent/WO2008065093A2/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4677850A (en) * | 1983-02-11 | 1987-07-07 | Nippon Soken, Inc. | Semiconductor-type flow rate detecting apparatus |
DE8716103U1 (de) * | 1987-12-05 | 1988-01-21 | Degussa Ag, 6000 Frankfurt | Meßwiderstand für Temperaturmessungen |
DE19750123A1 (de) * | 1997-11-13 | 1999-06-10 | Heraeus Sensor Nite Gmbh | Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung |
US20060185429A1 (en) * | 2005-02-21 | 2006-08-24 | Finemems Inc. | An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS) |
Also Published As
Publication number | Publication date |
---|---|
WO2008065093A2 (fr) | 2008-06-05 |
DE102006056171A1 (de) | 2008-05-29 |
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