DE102006056171A1 - Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung - Google Patents

Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung Download PDF

Info

Publication number
DE102006056171A1
DE102006056171A1 DE102006056171A DE102006056171A DE102006056171A1 DE 102006056171 A1 DE102006056171 A1 DE 102006056171A1 DE 102006056171 A DE102006056171 A DE 102006056171A DE 102006056171 A DE102006056171 A DE 102006056171A DE 102006056171 A1 DE102006056171 A1 DE 102006056171A1
Authority
DE
Germany
Prior art keywords
sensor unit
contact
contacting
board
contact pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006056171A
Other languages
German (de)
English (en)
Inventor
Alfred Umkehrer
Stephan Konrad
Dirk Dr. Boguhn
Gundolf Lippold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Wetzer GmbH and Co KG
Original Assignee
Endress and Hauser Wetzer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Wetzer GmbH and Co KG filed Critical Endress and Hauser Wetzer GmbH and Co KG
Priority to DE102006056171A priority Critical patent/DE102006056171A1/de
Priority to PCT/EP2007/062842 priority patent/WO2008065093A2/fr
Publication of DE102006056171A1 publication Critical patent/DE102006056171A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE102006056171A 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung Withdrawn DE102006056171A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102006056171A DE102006056171A1 (de) 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung
PCT/EP2007/062842 WO2008065093A2 (fr) 2006-11-27 2007-11-27 Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006056171A DE102006056171A1 (de) 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung

Publications (1)

Publication Number Publication Date
DE102006056171A1 true DE102006056171A1 (de) 2008-05-29

Family

ID=39326434

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006056171A Withdrawn DE102006056171A1 (de) 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung

Country Status (2)

Country Link
DE (1) DE102006056171A1 (fr)
WO (1) WO2008065093A2 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS5974653A (ja) * 1982-10-22 1984-04-27 Hitachi Ltd 半導体装置
DE19730914A1 (de) * 1996-07-29 1998-02-05 Nat Semiconductor Corp Mikroelektronik-Baugruppe
DE19812690C1 (de) * 1998-03-23 1999-11-18 Siemens Ag Träger für einen temperaturabhängigen Widerstand
DE10213827A1 (de) * 2001-03-30 2002-11-07 Denso Corp Fluidströmungssensor und Verfahren zum Herstellen desselben
JP2006010547A (ja) * 2004-06-28 2006-01-12 Denso Corp 湿度センサモジュールおよび湿度センサの実装構造
DE102005051672A1 (de) * 2005-10-28 2007-05-03 Hydac Electronic Gmbh Mehrdimensionaler Fluidströmungssensor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (de) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS5974653A (ja) * 1982-10-22 1984-04-27 Hitachi Ltd 半導体装置
DE19730914A1 (de) * 1996-07-29 1998-02-05 Nat Semiconductor Corp Mikroelektronik-Baugruppe
DE19812690C1 (de) * 1998-03-23 1999-11-18 Siemens Ag Träger für einen temperaturabhängigen Widerstand
DE10213827A1 (de) * 2001-03-30 2002-11-07 Denso Corp Fluidströmungssensor und Verfahren zum Herstellen desselben
JP2006010547A (ja) * 2004-06-28 2006-01-12 Denso Corp 湿度センサモジュールおよび湿度センサの実装構造
DE102005051672A1 (de) * 2005-10-28 2007-05-03 Hydac Electronic Gmbh Mehrdimensionaler Fluidströmungssensor

Also Published As

Publication number Publication date
WO2008065093A2 (fr) 2008-06-05
WO2008065093A3 (fr) 2009-01-22

Similar Documents

Publication Publication Date Title
EP1046030B1 (fr) Systeme de mesure de l'humidite
DE19717611B4 (de) Struktur zum Anbringen von elektronischen Komponenten
DE69414753T2 (de) Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen
EP1756537B1 (fr) Capteur de temperature et son procede de production
DE19940633A1 (de) IC-Gehäuse
EP3615903B1 (fr) Capteur de détection d'un profil de température spatial et procédé de fabrication d'une unité de détection
DE112006001036T5 (de) Elektronisches Bauelement und elektronische Anordnung
DE69030223T2 (de) Gestapeltes Mehrschichtsubstrat zum Montieren integrierter Schaltungen
DE102011056515A1 (de) Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements
WO2010136351A2 (fr) Élément capteur
EP0809094A1 (fr) Méthode de fabrication d'un élément capteur pour la mesure de température
EP2954763B1 (fr) Procédé de brasage d'un élément de connexion
DE19822794C1 (de) Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente
DE19633486C1 (de) Verfahren zur Herstellung einer Leiterplatte mit dünnen Leiterbahnen und Anschluß-Kontaktierungsbereichen sowie deren Verwendung
DE19843471A1 (de) Druckerkennungsvorrichtung
DE102006033856B3 (de) Temperaturmesssensor und Verfahren zu dessen Herstellung
DE102006056171A1 (de) Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung
EP1204301B1 (fr) Agencement pour constituer un circuit d'entrée pour l'enregistrement et le traitement d'un signal électrique
DE3818191C2 (fr)
DE69410168T2 (de) Elektronische Schaltungsanordnung
DE102019129971A1 (de) Verfahren zum Auflöten eines Bauelements auf eine Leiterplatte, Elektronikeinheit und Feldgerät der Automatisierungstechnik
DE10358282A1 (de) Bauelement und Verfahren zu dessen Herstellung
DE102006060978B4 (de) SMD-Temperaturmesselement und Vorrichtung
DE102015120647B4 (de) Elektrisches Bauelement mit dünner Lot-Stopp-Schicht und Verfahren zur Herstellung
DE19958776A1 (de) Unlösbare elektrische und mechanische Verbindung, Kontaktteil für eine unlösbare elektrische und mechanische Verbindung und Verfahren zur Herstellung einer unlösbaren elektrischen und mechanischen Verbindung

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8139 Disposal/non-payment of the annual fee