DE69939298D1 - Flipchip-Verbindung von Halbleiterchips - Google Patents

Flipchip-Verbindung von Halbleiterchips

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Publication number
DE69939298D1
DE69939298D1 DE69939298T DE69939298T DE69939298D1 DE 69939298 D1 DE69939298 D1 DE 69939298D1 DE 69939298 T DE69939298 T DE 69939298T DE 69939298 T DE69939298 T DE 69939298T DE 69939298 D1 DE69939298 D1 DE 69939298D1
Authority
DE
Germany
Prior art keywords
flip
semiconductor chips
chip connection
chip
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939298T
Other languages
English (en)
Inventor
Sunil Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
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Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69939298D1 publication Critical patent/DE69939298D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE69939298T 1998-05-06 1999-05-01 Flipchip-Verbindung von Halbleiterchips Expired - Lifetime DE69939298D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8444098P 1998-05-06 1998-05-06

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TW415048B (en) 2000-12-11
EP0977253A3 (de) 2001-01-17
KR100643105B1 (ko) 2006-11-13
EP0977253B1 (de) 2008-08-13
KR19990087907A (ko) 1999-12-27
JPH11345836A (ja) 1999-12-14
EP0977253A2 (de) 2000-02-02

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