DE69938235D1 - Sofortige zentrierbestimmung während der substratbehandlung in einem fertigungs-system - Google Patents

Sofortige zentrierbestimmung während der substratbehandlung in einem fertigungs-system

Info

Publication number
DE69938235D1
DE69938235D1 DE69938235T DE69938235T DE69938235D1 DE 69938235 D1 DE69938235 D1 DE 69938235D1 DE 69938235 T DE69938235 T DE 69938235T DE 69938235 T DE69938235 T DE 69938235T DE 69938235 D1 DE69938235 D1 DE 69938235D1
Authority
DE
Germany
Prior art keywords
manufacturing system
substrate treatment
during substrate
determination during
center determination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69938235T
Other languages
English (en)
Inventor
Satish Sundar
Peter F Ebbing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69938235D1 publication Critical patent/DE69938235D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36405—Adjust path by detecting path, line with a photosensor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37283—Photoelectric sensor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49299—Identify workpiece and align, center workpiece at the same time
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50151—Orient, translate, align workpiece to fit position assumed in program

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
DE69938235T 1998-03-04 1999-03-01 Sofortige zentrierbestimmung während der substratbehandlung in einem fertigungs-system Expired - Lifetime DE69938235D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/034,808 US6198976B1 (en) 1998-03-04 1998-03-04 On the fly center-finding during substrate handling in a processing system
PCT/US1999/004402 WO1999045579A1 (en) 1998-03-04 1999-03-01 On the fly center-finding during substrate handling in a processing system

Publications (1)

Publication Number Publication Date
DE69938235D1 true DE69938235D1 (de) 2008-04-10

Family

ID=21878744

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69938235T Expired - Lifetime DE69938235D1 (de) 1998-03-04 1999-03-01 Sofortige zentrierbestimmung während der substratbehandlung in einem fertigungs-system

Country Status (5)

Country Link
US (1) US6198976B1 (de)
EP (1) EP1062687B1 (de)
DE (1) DE69938235D1 (de)
TW (1) TW409273B (de)
WO (1) WO1999045579A1 (de)

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US6629053B1 (en) * 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
US6631935B1 (en) 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US6859555B1 (en) * 2000-09-19 2005-02-22 Siemens Corporate Research, Inc. Fast dominant circle detection through horizontal and vertical scanning
US7008802B2 (en) * 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
US6556887B2 (en) * 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US6935830B2 (en) * 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6615113B2 (en) 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6669829B2 (en) 2002-02-20 2003-12-30 Applied Materials, Inc. Shutter disk and blade alignment sensor
US7008517B2 (en) * 2002-02-20 2006-03-07 Applied Materials, Inc. Shutter disk and blade for physical vapor deposition chamber
JP2003264214A (ja) * 2002-03-07 2003-09-19 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
JP4260423B2 (ja) * 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
US6900877B2 (en) 2002-06-12 2005-05-31 Asm American, Inc. Semiconductor wafer position shift measurement and correction
AU2003301074A1 (en) * 2002-12-20 2004-07-22 Brooks Automation, Inc. System and method for on-the-fly eccentricity recognition
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
US7871810B2 (en) * 2004-11-03 2011-01-18 Life Technologies Corporation Multiaxis focusing mechanism for microarray analysis
US7925378B2 (en) * 2005-07-11 2011-04-12 Brooks Automation, Inc. Process apparatus with on-the-fly workpiece centering
US9104650B2 (en) 2005-07-11 2015-08-11 Brooks Automation, Inc. Intelligent condition monitoring and fault diagnostic system for preventative maintenance
CN101263499B (zh) * 2005-07-11 2013-03-27 布鲁克斯自动化公司 智能状态监测和故障诊断系统
US7522267B2 (en) * 2005-07-11 2009-04-21 Brooks Automation, Inc. Substrate transport apparatus with automated alignment
US7430456B2 (en) * 2006-02-08 2008-09-30 Seagate Technology Llc Reference point teaching using an end effector to form a witness mark
US7880155B2 (en) * 2006-06-15 2011-02-01 Brooks Automation, Inc. Substrate alignment apparatus comprising a controller to measure alignment during transport
US20080101912A1 (en) * 2006-10-26 2008-05-01 Martin Todd W Deposition analysis for robot motion correction
US7390681B1 (en) * 2007-01-12 2008-06-24 Advanced Micro Devices, Inc. Derived metric for monitoring die placement
US8260461B2 (en) * 2007-08-30 2012-09-04 Applied Materials, Inc. Method and system for robot calibrations with a camera
US8224607B2 (en) * 2007-08-30 2012-07-17 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
US8041450B2 (en) * 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
US8060252B2 (en) 2007-11-30 2011-11-15 Novellus Systems, Inc. High throughput method of in transit wafer position correction in system using multiple robots
US9002514B2 (en) 2007-11-30 2015-04-07 Novellus Systems, Inc. Wafer position correction with a dual, side-by-side wafer transfer robot
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8064070B2 (en) * 2008-01-25 2011-11-22 Applied Materials, Inc. Methods and apparatus for an integral local substrate center finder for I/O and chamber slit valves
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US7963736B2 (en) * 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
DE102010017082A1 (de) 2010-05-26 2011-12-01 Aixtron Ag Vorrichtung und Verfahren zum Be- und Entladen, insbesondere einer Beschichtungseinrichtung
KR101711193B1 (ko) * 2010-06-04 2017-02-28 삼성전자 주식회사 웨이퍼 검사 방법 및 웨이퍼 검사 시스템
KR101829397B1 (ko) 2011-09-16 2018-02-19 퍼시몬 테크놀로지스 코포레이션 낮은 가변성을 가진 로봇
JP5921901B2 (ja) * 2012-02-09 2016-05-24 株式会社ダイヘン ロボット制御装置
US9196518B1 (en) 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
SG2013025770A (en) * 2013-04-05 2014-11-27 Sigenic Pte Ltd Apparatus and method for detecting position drift in a machine operation using a robot arm
US9330951B2 (en) 2013-06-05 2016-05-03 Persimmon Technologies, Corp. Robot and adaptive placement system and method
KR102432133B1 (ko) 2014-01-21 2022-08-12 퍼시몬 테크놀로지스 코포레이션 기판 이송 진공 플랫폼
US10836038B2 (en) 2014-05-21 2020-11-17 Fanuc America Corporation Learning path control
DE102014013188B3 (de) * 2014-09-05 2015-09-10 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Waferausrichtvorrichtung sowie Verfahren zum Ausrichten eines Wafers auf eine vorbestimmte Drehwinkellage
KR20230048568A (ko) 2014-11-10 2023-04-11 브룩스 오토메이션 인코퍼레이티드 툴 자동-교시 방법 및 장치
JP6754771B2 (ja) 2014-11-18 2020-09-16 パーシモン テクノロジーズ コーポレイションＰｅｒｓｉｍｍｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｃｏｒｐ． エンドエフェクタ位置推定を実行するロボット適応型配置システム
JP6316742B2 (ja) * 2014-12-24 2018-04-25 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
KR101757815B1 (ko) * 2015-09-25 2017-07-14 세메스 주식회사 기판 중심 검출 방법, 기판 반송 방법, 반송 유닛 및 이를 포함하는 기판 처리 장치.
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10796940B2 (en) 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same
KR20210125067A (ko) 2019-02-08 2021-10-15 야스카와 아메리카 인코포레이티드 관통 빔 자동 티칭
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN112729115B (zh) * 2020-12-30 2023-06-02 芯钛科半导体设备(上海)有限公司 一种快速定位晶圆中心的装置
US11942345B2 (en) * 2022-07-15 2024-03-26 Applied Materials, Inc. Automated substrate placement to chamber center

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Also Published As

Publication number Publication date
US6198976B1 (en) 2001-03-06
EP1062687B1 (de) 2008-02-27
EP1062687A1 (de) 2000-12-27
TW409273B (en) 2000-10-21
WO1999045579A1 (en) 1999-09-10

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Legal Events

Date Code Title Description
8332 No legal effect for de