DE69934243D1 - Gerät und methode zur auswertung eines lothöckerzusammenmbaus, und dazu gehörende halbleiterherstellungsvorrichtung und verfahren - Google Patents

Gerät und methode zur auswertung eines lothöckerzusammenmbaus, und dazu gehörende halbleiterherstellungsvorrichtung und verfahren

Info

Publication number
DE69934243D1
DE69934243D1 DE69934243T DE69934243T DE69934243D1 DE 69934243 D1 DE69934243 D1 DE 69934243D1 DE 69934243 T DE69934243 T DE 69934243T DE 69934243 T DE69934243 T DE 69934243T DE 69934243 D1 DE69934243 D1 DE 69934243D1
Authority
DE
Germany
Prior art keywords
lothocuser
evaluating
composition
manufacturing apparatus
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934243T
Other languages
English (en)
Other versions
DE69934243T2 (de
Inventor
Shozo Minamitani
Kazushi Higashi
Kenji Takahashi
Shinji Kanayama
Hiroshi Wada
Takafumi Tsujisawa
Makoto Akita
Kenji Okamoto
Shinzo Eguchi
Yasuhiro Kametani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69934243D1 publication Critical patent/DE69934243D1/de
Publication of DE69934243T2 publication Critical patent/DE69934243T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69934243T 1998-09-01 1999-08-27 Gerät und methode zur auswertung eines lothöckerzusammenmbaus, und dazu gehörende halbleiterherstellungsvorrichtung und verfahren Expired - Lifetime DE69934243T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP24732598 1998-09-01
JP24732598 1998-09-01
JP24842998 1998-09-02
JP24842998 1998-09-02
PCT/JP1999/004620 WO2000013229A1 (fr) 1998-09-01 1999-08-27 Dispositif pour evaluer un assemblage par bosses et procede y relatif, et dispositif de production d'un composant a semiconducteur et procede y relatif

Publications (2)

Publication Number Publication Date
DE69934243D1 true DE69934243D1 (de) 2007-01-11
DE69934243T2 DE69934243T2 (de) 2007-06-28

Family

ID=26538212

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934243T Expired - Lifetime DE69934243T2 (de) 1998-09-01 1999-08-27 Gerät und methode zur auswertung eines lothöckerzusammenmbaus, und dazu gehörende halbleiterherstellungsvorrichtung und verfahren

Country Status (7)

Country Link
US (1) US6439447B1 (de)
EP (2) EP1120827B1 (de)
JP (2) JP4469503B2 (de)
CN (1) CN1144278C (de)
DE (1) DE69934243T2 (de)
TW (1) TW436941B (de)
WO (1) WO2000013229A1 (de)

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DE69936057T2 (de) * 1998-06-19 2008-01-10 Matsushita Electric Industrial Co., Ltd., Kadoma Verfahren und anordnung zur herstellung von höckern
US6439447B1 (en) * 1998-09-01 2002-08-27 Matsushita Electric Industrial Co., Ltd. Bump joining judging device and method, and semiconductor component production device and method
JP4459258B2 (ja) * 1999-01-29 2010-04-28 パナソニック株式会社 電子部品の実装方法
EP1156520A4 (de) 1999-01-29 2004-08-25 Matsushita Electric Ind Co Ltd Bestückungsverfahren für elektronische bauteile und dessen vorrichtung
JP4588245B2 (ja) * 2001-04-18 2010-11-24 パナソニック株式会社 半導体チップ装着方法
EP1343201A1 (de) * 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
TW510507U (en) * 2002-04-22 2002-11-11 Ind Tech Res Inst Chip accessing device with position, speed and force controls
JP4470655B2 (ja) * 2004-09-01 2010-06-02 Ｊｆｅスチール株式会社 超音波によるスポット溶接部の評価方法及び装置
US7913380B2 (en) 2005-01-25 2011-03-29 Asm Assembly Systems Gmbh & Co. Kg Wafer table preparing electrical components and device for equipping substrates with the components
US7591409B2 (en) * 2005-06-13 2009-09-22 Panasonic Corporation Semiconductor device bonding apparatus and method for bonding semiconductor device using the same
JP5020541B2 (ja) * 2006-05-17 2012-09-05 大崎エンジニアリング株式会社 圧着装置及び圧着方法
US7529154B2 (en) * 2007-09-28 2009-05-05 The United States Of America As Represented By The Secretary Of The Army Hybrid thin film heterostructure modular vibration control apparatus and methods for fabrication thereof
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
US8120376B2 (en) * 2007-12-12 2012-02-21 Novellus Systems, Inc. Fault detection apparatuses and methods for fault detection of semiconductor processing tools
CN101600336A (zh) * 2008-06-04 2009-12-09 鸿富锦精密工业（深圳）有限公司 散热器安装治具
JP5097038B2 (ja) * 2008-07-10 2012-12-12 株式会社日立製作所 はんだ付け方法及びはんだ付け装置
JP2010153672A (ja) * 2008-12-26 2010-07-08 Nec Corp 半導体装置の製造装置およびその製造方法
KR101109302B1 (ko) * 2009-12-02 2012-01-31 삼성전기주식회사 회로패턴의 결함 검사장치 및 그 검사방법
US8196798B2 (en) * 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
KR101398692B1 (ko) * 2012-09-11 2014-05-27 삼성디스플레이 주식회사 표시 장치의 수리 장치 및 그 방법
CN102945817A (zh) * 2012-11-21 2013-02-27 兰荣 一体式智能卡封装系统及封装方法
KR101714719B1 (ko) * 2015-05-28 2017-03-10 한국생산기술연구원 솔더범프 테스트 장치
US10105787B2 (en) * 2015-06-05 2018-10-23 GM Global Technology Operations LLC Systems and methods for ultrasonic welding
DE102016214227B3 (de) * 2016-08-02 2017-12-07 Schunk Sonosystems Gmbh Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung
CN109994400A (zh) * 2017-12-29 2019-07-09 江苏凯尔生物识别科技有限公司 用于芯片测试的收料装置
CN112046008A (zh) 2019-06-05 2020-12-08 三赢科技（深圳）有限公司 振动热压装置
TWI756811B (zh) * 2019-09-03 2022-03-01 日商新川股份有限公司 振動檢測系統
JP7462270B2 (ja) 2020-05-28 2024-04-05 パナソニックＩｐマネジメント株式会社 デバイス製造装置の検査方法及びデバイス製造装置
TW202215554A (zh) * 2020-05-28 2022-04-16 日商松下知識產權經營股份有限公司 元件的製造方法及元件製造裝置與安裝構造體

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Also Published As

Publication number Publication date
JP4546576B2 (ja) 2010-09-15
TW436941B (en) 2001-05-28
DE69934243T2 (de) 2007-06-28
JP2010067999A (ja) 2010-03-25
US6439447B1 (en) 2002-08-27
CN1144278C (zh) 2004-03-31
EP1755157A3 (de) 2008-09-03
EP1755157A2 (de) 2007-02-21
EP1120827B1 (de) 2006-11-29
CN1316100A (zh) 2001-10-03
WO2000013229A1 (fr) 2000-03-09
JP4469503B2 (ja) 2010-05-26
EP1120827A4 (de) 2003-04-16
EP1120827A1 (de) 2001-08-01

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