DE69929714D1 - Passiv aktiviertes ventil zum abführen eines trägergases - Google Patents

Passiv aktiviertes ventil zum abführen eines trägergases

Info

Publication number
DE69929714D1
DE69929714D1 DE69929714T DE69929714T DE69929714D1 DE 69929714 D1 DE69929714 D1 DE 69929714D1 DE 69929714 T DE69929714 T DE 69929714T DE 69929714 T DE69929714 T DE 69929714T DE 69929714 D1 DE69929714 D1 DE 69929714D1
Authority
DE
Germany
Prior art keywords
carrier gas
activated valve
passively activated
passively
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69929714T
Other languages
English (en)
Other versions
DE69929714T2 (de
Inventor
J Fosnight
W Shenk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASYST TECHNOLOGIES
Asyst Technologies Inc
Original Assignee
ASYST TECHNOLOGIES
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES, Asyst Technologies Inc filed Critical ASYST TECHNOLOGIES
Publication of DE69929714D1 publication Critical patent/DE69929714D1/de
Application granted granted Critical
Publication of DE69929714T2 publication Critical patent/DE69929714T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
DE69929714T 1998-12-01 1999-12-01 Passiv aktiviertes ventil zum abführen eines trägergases Expired - Fee Related DE69929714T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11063698P 1998-12-01 1998-12-01
US110636P 1998-12-01
US204320 1998-12-02
US09/204,320 US6056026A (en) 1998-12-01 1998-12-02 Passively activated valve for carrier purging
PCT/US1999/028505 WO2000032472A1 (en) 1998-12-01 1999-12-01 Passively activated valve for carrier purging

Publications (2)

Publication Number Publication Date
DE69929714D1 true DE69929714D1 (de) 2006-04-13
DE69929714T2 DE69929714T2 (de) 2006-08-03

Family

ID=26808254

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69929714T Expired - Fee Related DE69929714T2 (de) 1998-12-01 1999-12-01 Passiv aktiviertes ventil zum abführen eines trägergases

Country Status (10)

Country Link
US (1) US6056026A (de)
EP (1) EP1154929B1 (de)
JP (1) JP2002531934A (de)
KR (1) KR100575550B1 (de)
CN (1) CN1117010C (de)
AU (1) AU2475300A (de)
DE (1) DE69929714T2 (de)
HK (1) HK1040073B (de)
TW (1) TW449565B (de)
WO (1) WO2000032472A1 (de)

Families Citing this family (42)

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US6591162B1 (en) 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
US6823880B2 (en) * 2001-04-25 2004-11-30 Kabushiki Kaisha Kobe Seiko Sho High pressure processing apparatus and high pressure processing method
EP1555689B1 (de) 2002-10-25 2010-05-19 Shin-Etsu Polymer Co., Ltd. Substratspeicherbehälter
JP4027837B2 (ja) * 2003-04-28 2007-12-26 Ｔｄｋ株式会社 パージ装置およびパージ方法
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
US6913654B2 (en) * 2003-06-02 2005-07-05 Mykrolis Corporation Method for the removal of airborne molecular contaminants using water gas mixtures
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US7409263B2 (en) * 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
JP3983254B2 (ja) * 2005-06-24 2007-09-26 Ｔｄｋ株式会社 製品収容容器用パージシステム及び該パージシステムに供せられる台
JP2009503899A (ja) * 2005-08-03 2009-01-29 インテグリス・インコーポレーテッド 移送容器
US20070144118A1 (en) * 2005-12-22 2007-06-28 Alvarez Daniel Jr Purging of a wafer conveyance container
JP2007221042A (ja) 2006-02-20 2007-08-30 Tdk Corp インターフェースシール
KR101474572B1 (ko) * 2006-06-19 2014-12-18 엔테그리스, 아이엔씨. 레티클 스토리지 정화시스템
US20080254377A1 (en) * 2006-12-19 2008-10-16 Chen Chien-Ta Metal photomask pod and filter device thereof
KR101494024B1 (ko) * 2007-02-28 2015-02-16 엔테그리스, 아이엔씨. 기판 컨테이너를 위한 퍼지 시스템
US20100175781A1 (en) * 2007-07-09 2010-07-15 Kondoh Industries, Ltd. Apparatus for Charging Dry Air or Nitrogen Gas into a Container for Storing Semiconductor Wafers and an Apparatus for Thereby Removing Static Electricity from the Wafers
TWM330970U (en) * 2007-11-01 2008-04-21 Gudeng Prec Industral Co Ltd Semiconductor elements storage apparatus and reticle storage apparatus
TWM337832U (en) * 2007-11-15 2008-08-01 Gudeng Prec Industral Co Ltd Storage apparatus and filter apparatus therein
TWM331514U (en) * 2007-11-15 2008-05-01 Gudeng Prec Industral Co Ltd Storage apparatus for storing semiconductor element or reticle
TW200929357A (en) * 2007-12-20 2009-07-01 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWI379171B (en) * 2007-12-27 2012-12-11 Gudeng Prec Industral Co Ltd Gas filling apparatus
TWM336219U (en) * 2008-01-31 2008-07-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
TWI331123B (en) * 2008-03-06 2010-10-01 Gudeng Prec Ind Co Ltd Reticle pod and method for keeping reticle clean and dry
US8777182B2 (en) * 2008-05-20 2014-07-15 Grinon Industries Fluid transfer assembly and methods of fluid transfer
JP4692584B2 (ja) * 2008-07-03 2011-06-01 村田機械株式会社 パージ装置
US20100051501A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Ic waper carrier sealed from ambient atmosphere during transportation from one process to the next
JP5273245B2 (ja) * 2009-05-12 2013-08-28 村田機械株式会社 パージ装置およびパージ方法
US20120315113A1 (en) * 2010-02-05 2012-12-13 Tokyo Electron Limited Substrate holder, substrate transfer apparatus, and substrate processing apparatus
JP6131534B2 (ja) * 2012-06-11 2017-05-24 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート、載置台、ストッカー
US20140041755A1 (en) * 2012-08-09 2014-02-13 Santa Phoenix Technology Inc. Wafer pod gas charging apparatus
US9257320B2 (en) 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
JP5958446B2 (ja) * 2013-10-28 2016-08-02 Tdk株式会社 ロードポート装置
US9411332B2 (en) 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
WO2015129122A1 (ja) * 2014-02-27 2015-09-03 村田機械株式会社 パージ装置とパージ方法
WO2015141246A1 (ja) * 2014-03-17 2015-09-24 村田機械株式会社 パージ装置とパージ方法
KR101593386B1 (ko) * 2014-09-01 2016-02-15 로체 시스템즈(주) 퍼지 모듈 및 이를 포함하는 로드 포트
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
DE102019100448A1 (de) 2019-01-10 2020-07-16 Fabmatics Gmbh Schnittstellen-Vorrichtung für eine Spüleinheit zum Spülen eines Wafer-Behälters
JP6882698B2 (ja) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855320B2 (ja) * 1976-10-15 1983-12-09 古河鉱業株式会社 さく岩機等の制御弁装置
US4532970A (en) 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US4534389A (en) 1984-03-29 1985-08-13 Hewlett-Packard Company Interlocking door latch for dockable interface for integrated circuit processing
US4724874A (en) 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
JPS631881A (ja) * 1986-06-13 1988-01-06 Inax Corp フラツシユバルブ用操作弁
US4933098A (en) 1988-04-06 1990-06-12 Exxon Chemical Patents Inc. Lactone modified viscosity modifiers useful in oleaginous compositions
US5295522A (en) * 1992-09-24 1994-03-22 International Business Machines Corporation Gas purge system for isolation enclosure for contamination sensitive items
US5482161A (en) * 1994-05-24 1996-01-09 Fluoroware, Inc. Mechanical interface wafer container
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US5683118A (en) 1996-02-12 1997-11-04 Aesop, Inc. Kinematic coupling fluid couplings and method
US5810062A (en) * 1996-07-12 1998-09-22 Asyst Technologies, Inc. Two stage valve for charging and/or vacuum relief of pods
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JPH10144766A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 半導体製造装置
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system

Also Published As

Publication number Publication date
EP1154929A4 (de) 2004-07-28
KR100575550B1 (ko) 2006-05-03
CN1117010C (zh) 2003-08-06
HK1040073A1 (en) 2002-05-24
EP1154929A1 (de) 2001-11-21
AU2475300A (en) 2000-06-19
KR20010089539A (ko) 2001-10-06
TW449565B (en) 2001-08-11
WO2000032472A1 (en) 2000-06-08
JP2002531934A (ja) 2002-09-24
US6056026A (en) 2000-05-02
DE69929714T2 (de) 2006-08-03
HK1040073B (zh) 2006-07-14
EP1154929B1 (de) 2006-02-01
CN1332686A (zh) 2002-01-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee