DE69918205D1 - Ein Verfahren zur Herstellung von Durchgangslöchern mittels Laser, kupferkaschiertes Laminat geeignet zur Herstellung von Löchern, und Zusatzmaterial zur Herstellung von Löchern - Google Patents

Ein Verfahren zur Herstellung von Durchgangslöchern mittels Laser, kupferkaschiertes Laminat geeignet zur Herstellung von Löchern, und Zusatzmaterial zur Herstellung von Löchern

Info

Publication number
DE69918205D1
DE69918205D1 DE69918205T DE69918205T DE69918205D1 DE 69918205 D1 DE69918205 D1 DE 69918205D1 DE 69918205 T DE69918205 T DE 69918205T DE 69918205 T DE69918205 T DE 69918205T DE 69918205 D1 DE69918205 D1 DE 69918205D1
Authority
DE
Germany
Prior art keywords
holes
making
laser
copper
filler material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918205T
Other languages
English (en)
Other versions
DE69918205T2 (de
Inventor
Morio Gaku
Nobuyuki Ikeguchi
Yasuo Tanaka
Yoshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10068357A external-priority patent/JPH11266067A/ja
Priority claimed from JP10140472A external-priority patent/JPH11330310A/ja
Priority claimed from JP10145206A external-priority patent/JPH11330667A/ja
Priority claimed from JP10145205A external-priority patent/JPH11320174A/ja
Priority claimed from JP10166324A external-priority patent/JPH11342492A/ja
Priority claimed from JP10167760A external-priority patent/JPH11347767A/ja
Priority claimed from JP16775998A external-priority patent/JP4078713B2/ja
Priority claimed from JP10216411A external-priority patent/JP2000031622A/ja
Priority claimed from JP10250447A external-priority patent/JP2000061678A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE69918205D1 publication Critical patent/DE69918205D1/de
Publication of DE69918205T2 publication Critical patent/DE69918205T2/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69918205T 1998-03-18 1999-03-18 Ein Verfahren zur Herstellung von Durchgangslöchern mittels Laser, kupferkaschiertes Laminat geeignet zur Herstellung von Löchern, und Zusatzmaterial zur Herstellung von Löchern Expired - Lifetime DE69918205T2 (de)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
JP10068357A JPH11266067A (ja) 1998-03-18 1998-03-18 スルーホール用貫通孔の形成方法
JP6835798 1998-03-18
JP10140472A JPH11330310A (ja) 1998-05-07 1998-05-07 レーザー孔あけ用銅張積層板
JP14047298 1998-05-07
JP10145205A JPH11320174A (ja) 1998-05-12 1998-05-12 炭酸ガスレーザー孔あけ用補助材料
JP10145206A JPH11330667A (ja) 1998-05-12 1998-05-12 炭酸ガスレーザー孔あけ用補助材料
JP14520598 1998-05-12
JP14520698 1998-05-12
JP10166324A JPH11342492A (ja) 1998-05-29 1998-05-29 炭酸ガスレーザー孔あけ用補助シート
JP16632498 1998-05-29
JP16775998 1998-06-01
JP10167760A JPH11347767A (ja) 1998-06-01 1998-06-01 レーザーによる銅張板の貫通孔あけ方法
JP16776098 1998-06-01
JP16775998A JP4078713B2 (ja) 1998-06-01 1998-06-01 レーザーによる貫通孔あけ用バックアップシート
JP10216411A JP2000031622A (ja) 1998-07-15 1998-07-15 スルーホール用貫通孔の形成方法
JP21641198 1998-07-15
JP25044798 1998-08-20
JP10250447A JP2000061678A (ja) 1998-08-20 1998-08-20 レーザーによる貫通孔の形成方法

Publications (2)

Publication Number Publication Date
DE69918205D1 true DE69918205D1 (de) 2004-07-29
DE69918205T2 DE69918205T2 (de) 2005-06-30

Family

ID=27577136

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918205T Expired - Lifetime DE69918205T2 (de) 1998-03-18 1999-03-18 Ein Verfahren zur Herstellung von Durchgangslöchern mittels Laser, kupferkaschiertes Laminat geeignet zur Herstellung von Löchern, und Zusatzmaterial zur Herstellung von Löchern

Country Status (4)

Country Link
US (3) US6337463B1 (de)
EP (1) EP0943392B1 (de)
KR (3) KR100637904B1 (de)
DE (1) DE69918205T2 (de)

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US6736988B1 (en) * 1999-11-04 2004-05-18 Mitsubishi Gas Chemical Company, Inc. Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board
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IT1319838B1 (it) * 2000-02-15 2003-11-03 Elasis Sistema Ricerca Fiat Perfezionamenti di un'elettrovalvola per la regolazione dellapressione di alimentazione di combustibile ad un motore a combustione
US20020182432A1 (en) * 2000-04-05 2002-12-05 Masaru Sakamoto Laser hole drilling copper foil
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JP3261119B2 (ja) * 2000-05-16 2002-02-25 三井金属鉱業株式会社 プリント配線板の製造方法
JP4497262B2 (ja) * 2000-09-29 2010-07-07 日本ゼオン株式会社 回路基板の製造方法
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JP4034046B2 (ja) * 2001-06-07 2008-01-16 日本碍子株式会社 高精度な貫通孔を有する多層板、及び、回路基板
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JP2003158358A (ja) * 2001-11-26 2003-05-30 Hitachi Via Mechanics Ltd レーザー穴あけ加工方法及び装置
JP3971627B2 (ja) * 2002-02-26 2007-09-05 三菱電機株式会社 中間層回路の特性評価方法
JP2005342738A (ja) * 2004-06-01 2005-12-15 D D K Ltd レーザ加工方法及び該方法を用いたレーザ加工用素材
TW200615142A (en) * 2004-06-30 2006-05-16 Sumitomo Chemical Co Films
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JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
CN101374389B (zh) * 2007-08-24 2010-05-26 清华大学 电路板导孔的制作方法
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US8756803B2 (en) * 2010-09-22 2014-06-24 Ibiden Co., Ltd. Method for manufacturing printed wiring board
KR101218356B1 (ko) * 2010-11-11 2013-01-03 삼성테크윈 주식회사 다단 동박 적층판, 이의 제조방법 및 이를 이용한 인쇄회로기판의 제조방법
KR101662956B1 (ko) 2015-07-28 2016-10-05 한국항공대학교산학협력단 컨베이어 장치
US10381322B1 (en) 2018-04-23 2019-08-13 Sandisk Technologies Llc Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same
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CN109788650A (zh) * 2019-02-01 2019-05-21 奥士康精密电路（惠州）有限公司 一种超厚铜板pth插件孔毛刺的改善方法
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Also Published As

Publication number Publication date
US20020113044A1 (en) 2002-08-22
US6750422B2 (en) 2004-06-15
KR100637904B1 (ko) 2006-10-24
KR100630487B1 (ko) 2006-10-04
DE69918205T2 (de) 2005-06-30
KR19990078038A (ko) 1999-10-25
KR100630486B1 (ko) 2006-10-04
KR20060069798A (ko) 2006-06-22
KR20060073897A (ko) 2006-06-29
EP0943392A2 (de) 1999-09-22
US6337463B1 (en) 2002-01-08
EP0943392B1 (de) 2004-06-23
US20040182819A1 (en) 2004-09-23
EP0943392A3 (de) 2001-08-22

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