DE69917312D1 - Eine hohe leiterdichte aufweisende leiterplattenanordnung - Google Patents

Eine hohe leiterdichte aufweisende leiterplattenanordnung

Info

Publication number
DE69917312D1
DE69917312D1 DE69917312T DE69917312T DE69917312D1 DE 69917312 D1 DE69917312 D1 DE 69917312D1 DE 69917312 T DE69917312 T DE 69917312T DE 69917312 T DE69917312 T DE 69917312T DE 69917312 D1 DE69917312 D1 DE 69917312D1
Authority
DE
Germany
Prior art keywords
condensity
device arrangement
arrangement
high condensity
condensity device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69917312T
Other languages
English (en)
Other versions
DE69917312T2 (de
Inventor
Frank Parrish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Application granted granted Critical
Publication of DE69917312D1 publication Critical patent/DE69917312D1/de
Publication of DE69917312T2 publication Critical patent/DE69917312T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69917312T 1998-10-23 1999-10-19 Eine hohe leiterdichte aufweisende leiterplattenanordnung Expired - Lifetime DE69917312T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/178,247 US6215320B1 (en) 1998-10-23 1998-10-23 High density printed circuit board
US178247 1998-10-23
PCT/US1999/024342 WO2000025141A1 (en) 1998-10-23 1999-10-19 High density printed circuit board

Publications (2)

Publication Number Publication Date
DE69917312D1 true DE69917312D1 (de) 2004-06-17
DE69917312T2 DE69917312T2 (de) 2005-05-12

Family

ID=22651799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69917312T Expired - Lifetime DE69917312T2 (de) 1998-10-23 1999-10-19 Eine hohe leiterdichte aufweisende leiterplattenanordnung

Country Status (7)

Country Link
US (1) US6215320B1 (de)
EP (1) EP1123512B1 (de)
JP (1) JP3974752B2 (de)
KR (1) KR100703135B1 (de)
DE (1) DE69917312T2 (de)
TW (1) TW535478B (de)
WO (1) WO2000025141A1 (de)

Families Citing this family (60)

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US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6114763A (en) * 1997-05-30 2000-09-05 Tessera, Inc. Semiconductor package with translator for connection to an external substrate
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
JP2001053437A (ja) * 1999-08-06 2001-02-23 Shinko Electric Ind Co Ltd 多層回路基板
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
JP2001343433A (ja) * 2000-03-28 2001-12-14 Toshiba Corp 半導体テスト装置
US6724209B1 (en) * 2000-04-13 2004-04-20 Ralph G. Whitten Method for testing signal paths between an integrated circuit wafer and a wafer tester
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
WO2002009169A1 (fr) * 2000-07-25 2002-01-31 Ibiden Co., Ltd. Dispositif d'inspection et carte sonde
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
DE60207572T2 (de) * 2001-07-11 2006-08-10 Formfactor, Inc., Livermore Verfahren zum herstellen einer nadelkarte
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6570397B2 (en) 2001-08-07 2003-05-27 Agilent Technologies, Inc. Timing calibration and timing calibration verification of electronic circuit testers
WO2003018865A1 (en) * 2001-08-24 2003-03-06 Nanonexus, Inc. Method and apparatus for producing uniform isotropic stresses in a sputtered film
KR100702003B1 (ko) * 2003-01-18 2007-03-30 삼성전자주식회사 프로브 카드
US7259968B2 (en) * 2003-05-14 2007-08-21 Hewlett-Packard Development Company, L.P. Tailoring impedances of conductive traces in a circuit board
US7111198B2 (en) * 2003-06-12 2006-09-19 Inventec Corporation Multithread auto test method
TW200525675A (en) * 2004-01-20 2005-08-01 Tokyo Electron Ltd Probe guard
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7375542B2 (en) * 2004-06-30 2008-05-20 Teradyne, Inc. Automated test equipment with DIB mounted three dimensional tester electronics bricks
US7290326B2 (en) * 2005-07-22 2007-11-06 Dynaco Corp. Method and apparatus for forming multi-layered circuits using liquid crystalline polymers
US7649367B2 (en) * 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7956633B2 (en) * 2006-03-06 2011-06-07 Formfactor, Inc. Stacked guard structures
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8248091B2 (en) 2006-10-20 2012-08-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal array type probe card design for semiconductor device testing
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7759242B2 (en) 2007-08-22 2010-07-20 Qimonda Ag Method of fabricating an integrated circuit
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
JP5164543B2 (ja) * 2007-12-05 2013-03-21 東京エレクトロン株式会社 プローブカードの製造方法
KR20090082783A (ko) * 2008-01-28 2009-07-31 삼성전자주식회사 Ｅｄｓ 공정용 프로브 카드 어셈블리
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
US20100244871A1 (en) * 2009-02-24 2010-09-30 Qualcomm Incorporated Space transformer connector printed circuit board assembly
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
US8089331B2 (en) 2009-05-12 2012-01-03 Raytheon Company Planar magnetic structure
US9176186B2 (en) 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
US8362797B2 (en) * 2009-08-25 2013-01-29 Advanced Inquiry Systems, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween
KR20130138793A (ko) * 2010-09-28 2013-12-19 어드밴스드 인쿼리 시스템즈, 인크. 웨이퍼 테스팅 시스템들 및 사용 및 제조의 연관된 방법들
US8622752B2 (en) * 2011-04-13 2014-01-07 Teradyne, Inc. Probe-card interposer constructed using hexagonal modules
US9632109B2 (en) * 2011-06-30 2017-04-25 Advantest Corporation Methods, apparatus, and systems for contacting semiconductor dies that are electrically coupled to test access interface positioned in scribe lines of a wafer
US9759745B2 (en) * 2014-04-29 2017-09-12 Taiwan Semiconductor Manufacturing Company Ltd. Probe card
US10049810B2 (en) 2015-11-09 2018-08-14 Raytheon Company High voltage high frequency transformer
US10672553B2 (en) 2017-05-10 2020-06-02 Raytheon Company High voltage high frequency transformer
US11651910B2 (en) 2020-12-10 2023-05-16 Teradyne, Inc. Inductance control system
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer

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US3739469A (en) 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
JPS5824948B2 (ja) * 1977-08-08 1983-05-24 日本電信電話株式会社 交差配線構造の製造方法
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US4924589A (en) 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
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US5144228A (en) 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
US5225777A (en) 1992-02-04 1993-07-06 International Business Machines Corporation High density probe
US5336992A (en) 1992-06-03 1994-08-09 Trw Inc. On-wafer integrated circuit electrical testing
JP3237258B2 (ja) * 1993-01-22 2001-12-10 株式会社デンソー セラミック多層配線基板
JPH06302964A (ja) 1993-04-16 1994-10-28 Oki Electric Ind Co Ltd 高速信号伝送用回路基板
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JP3331083B2 (ja) * 1995-03-06 2002-10-07 株式会社住友金属エレクトロデバイス 低温焼成セラミック回路基板
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US5742174A (en) 1995-11-03 1998-04-21 Probe Technology Membrane for holding a probe tip in proper location
JPH10135283A (ja) * 1996-10-31 1998-05-22 Hitachi Chem Co Ltd 半導体装置の検査用治具
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JPH10247783A (ja) * 1997-03-04 1998-09-14 Ibiden Co Ltd 多層プリント配線板およびその製造方法

Also Published As

Publication number Publication date
EP1123512B1 (de) 2004-05-12
US6215320B1 (en) 2001-04-10
JP3974752B2 (ja) 2007-09-12
KR20010075660A (ko) 2001-08-09
JP2002528904A (ja) 2002-09-03
KR100703135B1 (ko) 2007-04-05
WO2000025141A1 (en) 2000-05-04
DE69917312T2 (de) 2005-05-12
EP1123512A1 (de) 2001-08-16
TW535478B (en) 2003-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition