DE69914222D1 - Verfahren zum metallisieren der oberfläche eines festen polymersubstrates und so erhaltenes produkt - Google Patents
Verfahren zum metallisieren der oberfläche eines festen polymersubstrates und so erhaltenes produktInfo
- Publication number
- DE69914222D1 DE69914222D1 DE69914222T DE69914222T DE69914222D1 DE 69914222 D1 DE69914222 D1 DE 69914222D1 DE 69914222 T DE69914222 T DE 69914222T DE 69914222 T DE69914222 T DE 69914222T DE 69914222 D1 DE69914222 D1 DE 69914222D1
- Authority
- DE
- Germany
- Prior art keywords
- vinyl
- metallization
- metallizing
- solid polymer
- polymer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/067—Metallic effect
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Polymerisation Methods In General (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK124798 | 1998-10-02 | ||
DKPA199801247 | 1998-10-02 | ||
PCT/DK1999/000523 WO2000020656A1 (en) | 1998-10-02 | 1999-10-04 | A method of metallizing the surface of a solid polymer substrate and the product obtained |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69914222D1 true DE69914222D1 (de) | 2004-02-19 |
DE69914222T2 DE69914222T2 (de) | 2004-11-18 |
Family
ID=8102675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999614222 Expired - Fee Related DE69914222T2 (de) | 1998-10-02 | 1999-10-04 | Verfahren zum Metallisieren der Oberfläche eines festen Polymersubstrats und auf diese Weise erhaltenes Produkt |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1141443B1 (de) |
JP (1) | JP2002526661A (de) |
CN (1) | CN1167829C (de) |
AT (1) | ATE257866T1 (de) |
AU (1) | AU767139C (de) |
DE (1) | DE69914222T2 (de) |
DK (1) | DK1141443T3 (de) |
WO (1) | WO2000020656A1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7238395B2 (en) | 2000-05-10 | 2007-07-03 | Nkt Research A/S | Method of coating the surface of an inorganic substrates with an organic material and the product obtained |
DE10043526C1 (de) * | 2000-09-05 | 2002-06-06 | Fraunhofer Ges Forschung | Verfahren zur haftfesten Metallbeschichtung und metallbeschichtetes Funktionselement |
US6569517B1 (en) | 2000-11-17 | 2003-05-27 | 3M Innovative Properties Company | Color tailorable pigmented optical bodies with surface metalization |
CN100383278C (zh) * | 2002-02-28 | 2008-04-23 | 日本瑞翁株式会社 | 部分镀敷方法、部分镀敷树脂基材以及多层电路基板的制造方法 |
DE10249005A1 (de) * | 2002-10-21 | 2004-05-06 | Siemens Ag | Verfahren zur Herstellung einer Schaltungsanordnung |
DE10304668B4 (de) * | 2003-02-05 | 2006-10-19 | König, Klaus-Peter | Verfahren zur haftfesten, eine metallische Schicht umfassenden Beschichtung eines Substrats und seine Verwendung |
US7442285B2 (en) * | 2004-06-17 | 2008-10-28 | Vapor Technologies, Inc. | Common rack for electroplating and PVD coating operations |
CN1966765B (zh) * | 2005-11-17 | 2012-07-18 | 中国科学院金属研究所 | 一种非金属材料化学镀的活化方法及其化学镀 |
CN101225534B (zh) * | 2007-09-30 | 2010-08-25 | 青岛大学 | 一种制备聚合物基金属梯度复合材料的方法 |
CN101240142B (zh) * | 2008-01-24 | 2010-12-08 | 东莞市诺奇纳米科技有限公司 | 一种镜面喷镀专用涂料及其制备方法和应用 |
FR2934609B1 (fr) | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
FR2934964B1 (fr) * | 2008-08-12 | 2010-10-22 | Jet Metal Technologies | Procede de traitement optophysique de surface de substrats polymere et dispositif pour la mise en oeuvre du procede |
IT1399202B1 (it) | 2010-03-30 | 2013-04-11 | Corbelli | Metodo per la produzione di manufatti elastomerici funzionalizzati e manufatti cosi' ottenuti |
CN101892452B (zh) * | 2010-08-06 | 2012-12-26 | 凌嘉科技股份有限公司 | 在塑料工件上形成电磁干扰防护层的方法 |
CN103328686A (zh) * | 2010-11-16 | 2013-09-25 | 凯普卓尼克技术公司 | 采用等离子体聚合预处理对物件的金属涂覆 |
CN102206816A (zh) * | 2011-05-04 | 2011-10-05 | 天津大学 | 石墨粉片化学依次镀铜镀锡方法及镀复的石墨粉片的应用 |
DE102012104357A1 (de) * | 2012-05-21 | 2013-11-21 | Rehau Ag + Co. | Verfahren zur Beschichtung eines Formteils |
CN102758237B (zh) * | 2012-07-31 | 2015-01-28 | 厦门建霖工业有限公司 | 一种锌合金高耐蚀仿六价铬颜色的表面处理方法 |
CN103691937B (zh) * | 2013-12-31 | 2016-03-09 | 武汉理工大学 | 一种制备镍包石墨复合粒子的方法 |
CN104174860B (zh) * | 2014-08-14 | 2017-02-15 | 华中科技大学 | 一种核壳结构合金纳米颗粒的制备方法 |
CN105734539B (zh) * | 2014-12-11 | 2018-02-27 | 中国科学院兰州化学物理研究所 | 在塑料表面可多次重复化学镀多种图案化金属的方法 |
JP6469895B2 (ja) * | 2015-06-16 | 2019-02-13 | スリーエム イノベイティブ プロパティズ カンパニー | スズ/銅の結合/シード層を含むめっきポリマー物品 |
KR20190139979A (ko) * | 2017-04-21 | 2019-12-18 | 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. | 물품 및 그의 제조 방법 |
CN108517546A (zh) * | 2018-04-25 | 2018-09-11 | 芜湖航天特种电缆厂股份有限公司 | 微孔聚四氟乙烯薄膜镀银的方法 |
CN113728475B (zh) * | 2020-12-29 | 2024-04-26 | 宁德新能源科技有限公司 | 复合集流体及其制备方法以及电化学装置 |
CN113684469B (zh) * | 2021-08-06 | 2023-08-22 | 宁波摩华科技有限公司 | 一种用于电子器件的有机防护镀层及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288541A (en) * | 1991-10-17 | 1994-02-22 | International Business Machines Corporation | Method for metallizing through holes in thin film substrates, and resulting devices |
DE4328767C2 (de) * | 1993-08-26 | 1995-08-31 | Fraunhofer Ges Forschung | Verfahren zum Herstellen von Folienverbunden und die mit diesen Verfahren hergestellten Verbunde |
US6083628A (en) * | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
-
1999
- 1999-10-04 DE DE1999614222 patent/DE69914222T2/de not_active Expired - Fee Related
- 1999-10-04 AU AU58508/99A patent/AU767139C/en not_active Ceased
- 1999-10-04 DK DK99945965T patent/DK1141443T3/da active
- 1999-10-04 WO PCT/DK1999/000523 patent/WO2000020656A1/en active IP Right Grant
- 1999-10-04 CN CNB998127493A patent/CN1167829C/zh not_active Expired - Fee Related
- 1999-10-04 JP JP2000574747A patent/JP2002526661A/ja active Pending
- 1999-10-04 AT AT99945965T patent/ATE257866T1/de not_active IP Right Cessation
- 1999-10-04 EP EP19990945965 patent/EP1141443B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1141443A1 (de) | 2001-10-10 |
AU767139B2 (en) | 2003-10-30 |
CN1324412A (zh) | 2001-11-28 |
AU5850899A (en) | 2000-04-26 |
DK1141443T3 (da) | 2004-05-03 |
DE69914222T2 (de) | 2004-11-18 |
AU767139C (en) | 2004-05-27 |
CN1167829C (zh) | 2004-09-22 |
WO2000020656A1 (en) | 2000-04-13 |
JP2002526661A (ja) | 2002-08-20 |
EP1141443B1 (de) | 2004-01-14 |
ATE257866T1 (de) | 2004-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |