DE69907061T2 - Polyimidzusammensetzung mit hohem Modul - Google Patents
Polyimidzusammensetzung mit hohem Modul Download PDFInfo
- Publication number
- DE69907061T2 DE69907061T2 DE69907061T DE69907061T DE69907061T2 DE 69907061 T2 DE69907061 T2 DE 69907061T2 DE 69907061 T DE69907061 T DE 69907061T DE 69907061 T DE69907061 T DE 69907061T DE 69907061 T2 DE69907061 T2 DE 69907061T2
- Authority
- DE
- Germany
- Prior art keywords
- high modulus
- polyimide composition
- modulus polyimide
- composition
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004642 Polyimide Substances 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/056,110 US5939498A (en) | 1998-04-07 | 1998-04-07 | High modulus polyimide blend |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69907061D1 DE69907061D1 (de) | 2003-05-28 |
| DE69907061T2 true DE69907061T2 (de) | 2004-01-29 |
Family
ID=22002213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69907061T Expired - Fee Related DE69907061T2 (de) | 1998-04-07 | 1999-02-25 | Polyimidzusammensetzung mit hohem Modul |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5939498A (enExample) |
| EP (1) | EP0949297B1 (enExample) |
| JP (1) | JP4397996B2 (enExample) |
| DE (1) | DE69907061T2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3638438B2 (ja) | 1997-12-26 | 2005-04-13 | エスエス製薬株式会社 | トリアゾール誘導体またはその塩、その製造方法及び当該化合物を有効成分とする医薬 |
| US6908685B2 (en) * | 2000-08-24 | 2005-06-21 | E. I. Du Pont De Nemours And Company | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| US6555238B2 (en) * | 2000-08-24 | 2003-04-29 | Dupont-Toray Co. Ltd. | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| US6828390B2 (en) * | 2002-06-24 | 2004-12-07 | E.I. Du Pont De Nemours And Company | Polyimide substrates having an interpenetrating network morphology and methods relating thereto |
| US20040132900A1 (en) * | 2003-01-08 | 2004-07-08 | International Business Machines Corporation | Polyimide compositions and use thereof in ceramic product defect repair |
| CN101107292B (zh) | 2005-02-28 | 2010-09-22 | 株式会社钟化 | 聚酰亚胺薄膜的制造方法 |
| US8729217B2 (en) * | 2007-03-27 | 2014-05-20 | Nitto Denko Corporation | Semi-conductive polyimide film |
| CN101274989B (zh) * | 2007-03-27 | 2012-12-26 | 日东电工株式会社 | 半导体聚酰亚胺薄膜 |
| US8053492B2 (en) * | 2007-09-07 | 2011-11-08 | Nexolve Corporation | Polymeric coating for protecting objects |
| US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US20120238045A1 (en) * | 2010-12-22 | 2012-09-20 | E. I. Du Pont De Nemours And Company | Three dimensional light emitting diode systems, and compositions and methods relating thereto |
| WO2014210278A1 (en) | 2013-06-26 | 2014-12-31 | Alcoa Inc. | Resistance welding fastener, apparatus and methods |
| JP6646679B2 (ja) | 2014-12-15 | 2020-02-14 | アーコニック インコーポレイテッドArconic Inc. | 同種材料及び異種材料を接合するための抵抗溶接ファスナ、装置及び方法 |
| CN104845367A (zh) * | 2015-01-14 | 2015-08-19 | 无锡龙舜实业有限公司 | 一种塑料农膜 |
| MX391285B (es) | 2015-09-16 | 2025-03-21 | Howmet Aerospace Inc | Aparato de alimentación de remache. |
| US10593034B2 (en) | 2016-03-25 | 2020-03-17 | Arconic Inc. | Resistance welding fasteners, apparatus and methods for joining dissimilar materials and assessing joints made thereby |
| KR101796875B1 (ko) * | 2016-09-23 | 2017-11-10 | 주식회사 엘지화학 | 폴리이미드 전구체 용액 및 이의 제조방법 |
| CA3052540C (en) | 2017-02-06 | 2020-07-14 | King Abdullah University Of Science And Technology | Polyimide blends, methods of making each and methods of use |
| CN110028788B (zh) * | 2018-01-11 | 2021-11-26 | 洛阳轴承研究所有限公司 | 一种聚酰亚胺复合材料、多孔聚酰亚胺保持架及其制备方法、轴承 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3342897A (en) * | 1964-12-09 | 1967-09-19 | Du Pont | Blends of the polypyromellitamide of bis(4-aminophenyl) ether and polypyromellitamide-acid of an aromatic diamine |
| JPH0655843B2 (ja) * | 1987-10-23 | 1994-07-27 | 宇部興産株式会社 | 粗面化ポリイミドフィルムおよびその製法 |
| US5151472A (en) * | 1990-08-10 | 1992-09-29 | General Dynamics Corporation, Convair Division | Method of preparing rigid rod polymers in thermoplastic matrices |
| JPH0655843A (ja) * | 1992-08-04 | 1994-03-01 | Seiko Epson Corp | 可逆性記録シート |
| US5525405A (en) * | 1994-12-14 | 1996-06-11 | E. I. Du Pont De Nemours And Company | Adhesiveless aromatic polyimide laminate |
-
1998
- 1998-04-07 US US09/056,110 patent/US5939498A/en not_active Expired - Lifetime
-
1999
- 1999-02-25 EP EP99103627A patent/EP0949297B1/en not_active Expired - Lifetime
- 1999-02-25 DE DE69907061T patent/DE69907061T2/de not_active Expired - Fee Related
- 1999-04-07 JP JP10054399A patent/JP4397996B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5939498A (en) | 1999-08-17 |
| EP0949297A3 (en) | 1999-12-08 |
| JPH11323127A (ja) | 1999-11-26 |
| JP4397996B2 (ja) | 2010-01-13 |
| DE69907061D1 (de) | 2003-05-28 |
| EP0949297A2 (en) | 1999-10-13 |
| EP0949297B1 (en) | 2003-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |