DE69902239D1 - Vorrichtung und verfahren zum chemischen behandlen von mikroelektronischen scheiben - Google Patents

Vorrichtung und verfahren zum chemischen behandlen von mikroelektronischen scheiben

Info

Publication number
DE69902239D1
DE69902239D1 DE69902239T DE69902239T DE69902239D1 DE 69902239 D1 DE69902239 D1 DE 69902239D1 DE 69902239 T DE69902239 T DE 69902239T DE 69902239 T DE69902239 T DE 69902239T DE 69902239 D1 DE69902239 D1 DE 69902239D1
Authority
DE
Germany
Prior art keywords
disks
chemical treating
treating microelectronic
microelectronic
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69902239T
Other languages
English (en)
Other versions
DE69902239T2 (de
Inventor
Jean-Michel Lamure
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
S O I TEC SILICON ON INSULATOR TECHNOLOGIES BERNIN
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S O I TEC SILICON ON INSULATOR TECHNOLOGIES BERNIN, Soitec SA filed Critical S O I TEC SILICON ON INSULATOR TECHNOLOGIES BERNIN
Application granted granted Critical
Publication of DE69902239D1 publication Critical patent/DE69902239D1/de
Publication of DE69902239T2 publication Critical patent/DE69902239T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
DE69902239T 1998-03-09 1999-03-09 Vorrichtung und verfahren zum chemischen behandlen von mikroelektronischen scheiben Expired - Lifetime DE69902239T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9802833A FR2775675B1 (fr) 1998-03-09 1998-03-09 Support de plaquettes pour la micro-electronique et procede d'utilisation de ce support
PCT/FR1999/000520 WO1999046802A1 (fr) 1998-03-09 1999-03-09 Installation et procede de traitement chimique de plaquettes pour la micro-electronique

Publications (2)

Publication Number Publication Date
DE69902239D1 true DE69902239D1 (de) 2002-08-29
DE69902239T2 DE69902239T2 (de) 2003-02-27

Family

ID=9523803

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69902239T Expired - Lifetime DE69902239T2 (de) 1998-03-09 1999-03-09 Vorrichtung und verfahren zum chemischen behandlen von mikroelektronischen scheiben

Country Status (7)

Country Link
US (1) US6576065B1 (de)
EP (1) EP1062686B1 (de)
JP (1) JP2002507056A (de)
KR (1) KR20010041683A (de)
DE (1) DE69902239T2 (de)
FR (1) FR2775675B1 (de)
WO (1) WO1999046802A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030048682A (ko) * 2001-12-12 2003-06-25 삼성전자주식회사 반도체 웨이퍼 가이드 및 이를 구비한 반도체 습식세정장치
FR2852142B1 (fr) * 2003-03-05 2005-12-30 Installation de traitement de tranches de materiau semiconducteur
FR2857283B1 (fr) * 2003-07-09 2005-09-02 Soitec Silicon On Insulator Dispositif de nettoyage de plaquettes disposant d'un circuit d'isolation du moniteur de concentration.
US7127367B2 (en) 2003-10-27 2006-10-24 Applied Materials, Inc. Tailored temperature uniformity
US8536492B2 (en) * 2003-10-27 2013-09-17 Applied Materials, Inc. Processing multilayer semiconductors with multiple heat sources
US8222574B2 (en) * 2007-01-15 2012-07-17 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
US8111978B2 (en) * 2008-07-11 2012-02-07 Applied Materials, Inc. Rapid thermal processing chamber with shower head
US9070730B2 (en) * 2011-10-07 2015-06-30 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for removing a vertically-oriented substrate from a cassette
US10020213B1 (en) 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
JP6971137B2 (ja) * 2017-12-04 2021-11-24 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
DE4300205A1 (de) * 1993-01-07 1994-07-14 Deutsche Bundespost Telekom Probenhalterung in Kassettenform
US5853496A (en) * 1995-08-08 1998-12-29 Tokyo Electron Limited Transfer machine, transfer method, cleaning machine, and cleaning method
TW310452B (de) * 1995-12-07 1997-07-11 Tokyo Electron Co Ltd
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
US6199564B1 (en) * 1998-11-03 2001-03-13 Tokyo Electron Limited Substrate processing method and apparatus

Also Published As

Publication number Publication date
FR2775675A1 (fr) 1999-09-10
WO1999046802A1 (fr) 1999-09-16
US6576065B1 (en) 2003-06-10
FR2775675B1 (fr) 2000-06-09
JP2002507056A (ja) 2002-03-05
EP1062686A1 (de) 2000-12-27
DE69902239T2 (de) 2003-02-27
KR20010041683A (ko) 2001-05-25
EP1062686B1 (de) 2002-07-24

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