FR2852142B1 - Installation de traitement de tranches de materiau semiconducteur - Google Patents

Installation de traitement de tranches de materiau semiconducteur

Info

Publication number
FR2852142B1
FR2852142B1 FR0302694A FR0302694A FR2852142B1 FR 2852142 B1 FR2852142 B1 FR 2852142B1 FR 0302694 A FR0302694 A FR 0302694A FR 0302694 A FR0302694 A FR 0302694A FR 2852142 B1 FR2852142 B1 FR 2852142B1
Authority
FR
France
Prior art keywords
semiconductor material
treatment facility
material slicer
slicer
facility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0302694A
Other languages
English (en)
Other versions
FR2852142A1 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to FR0302694A priority Critical patent/FR2852142B1/fr
Publication of FR2852142A1 publication Critical patent/FR2852142A1/fr
Application granted granted Critical
Publication of FR2852142B1 publication Critical patent/FR2852142B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR0302694A 2003-03-05 2003-03-05 Installation de traitement de tranches de materiau semiconducteur Expired - Fee Related FR2852142B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0302694A FR2852142B1 (fr) 2003-03-05 2003-03-05 Installation de traitement de tranches de materiau semiconducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0302694A FR2852142B1 (fr) 2003-03-05 2003-03-05 Installation de traitement de tranches de materiau semiconducteur

Publications (2)

Publication Number Publication Date
FR2852142A1 FR2852142A1 (fr) 2004-09-10
FR2852142B1 true FR2852142B1 (fr) 2005-12-30

Family

ID=32865256

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0302694A Expired - Fee Related FR2852142B1 (fr) 2003-03-05 2003-03-05 Installation de traitement de tranches de materiau semiconducteur

Country Status (1)

Country Link
FR (1) FR2852142B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3128309A1 (fr) * 2021-10-14 2023-04-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Insert pour dispositif d’immersion de plaquettes

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4653636A (en) * 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
FR2775675B1 (fr) * 1998-03-09 2000-06-09 Soitec Silicon On Insulator Support de plaquettes pour la micro-electronique et procede d'utilisation de ce support
US6318389B1 (en) * 1999-10-29 2001-11-20 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
US6455395B1 (en) * 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US20020129838A1 (en) * 2001-03-15 2002-09-19 Larry Myland Substrate aspiration assembly

Also Published As

Publication number Publication date
FR2852142A1 (fr) 2004-09-10

Similar Documents

Publication Publication Date Title
DE602004026370D1 (de) Bearbeitungsvorrichtung
NO20021526D0 (no) Anordning for kloakkbehandling
BRPI0411449A2 (pt) sistema de processamento de chamada
DE602004003254D1 (de) Plasmaverarbeitungsvorrichtung
DE602004020033D1 (de) Flachdruckverfahren
DE602004011458D1 (de) Substratverarbeitungsverfahren
FR2843061B1 (fr) Procede de polissage de tranche de materiau
FIU20030198U0 (fi) Mineraalimateriaalien prosessointilaitos
ITMI20031819A1 (it) Dispositivo per la lavorazione di pezzi sostanzialmente piatti.
DE602004013124D1 (de) Schleifverfahren
ITMI20030768A1 (it) Dispositivo per il trattamento termico di materiale plastico.
DK1518964T3 (da) Overfladedræningsindretning
GB2406511B (en) Overflow device for bathtub
DE602004025739D1 (de) Plasmaverarbeitungsvorrichtung
DE602004015703D1 (de) Bogenverarbeitungsvorrichtung
FR2852142B1 (fr) Installation de traitement de tranches de materiau semiconducteur
DE60229887D1 (de) Oberflächenbehandlungssystem
DE112005001539T5 (de) Vakuumbearbeitungsvorrichtung
MA25250A1 (fr) Installation de traitement
FR2857154B1 (fr) Procede de traitement des surfaces de semiconducteurs
FR2864076B1 (fr) Procede de fluorodesazotation
FIU20030181U0 (fi) Jätteenkäsittelylaite
ITMC20040061A1 (it) Procedimento di lavorazione per la realizzazione di calzature
ITFI20040054A1 (it) Metodo per il trattamento di materiale lapideo
ITSA20030011A0 (it) Macchina separatrice di pietre e fanghi

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20101130