DE69901281D1 - Strahlender Aufbau für Heiz-Element - Google Patents
Strahlender Aufbau für Heiz-ElementInfo
- Publication number
- DE69901281D1 DE69901281D1 DE69901281T DE69901281T DE69901281D1 DE 69901281 D1 DE69901281 D1 DE 69901281D1 DE 69901281 T DE69901281 T DE 69901281T DE 69901281 T DE69901281 T DE 69901281T DE 69901281 D1 DE69901281 D1 DE 69901281D1
- Authority
- DE
- Germany
- Prior art keywords
- heating element
- radiant structure
- radiant
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34674598A JP3677403B2 (ja) | 1998-12-07 | 1998-12-07 | 発熱素子の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69901281D1 true DE69901281D1 (de) | 2002-05-23 |
DE69901281T2 DE69901281T2 (de) | 2002-10-02 |
Family
ID=18385533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69901281T Expired - Fee Related DE69901281T2 (de) | 1998-12-07 | 1999-11-12 | Strahlender Aufbau für Heiz-Element |
Country Status (4)
Country | Link |
---|---|
US (1) | US6297959B1 (de) |
EP (1) | EP1009195B1 (de) |
JP (1) | JP3677403B2 (de) |
DE (1) | DE69901281T2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
JP4286465B2 (ja) * | 2001-02-09 | 2009-07-01 | 三菱電機株式会社 | 半導体装置とその製造方法 |
FR2833802B1 (fr) * | 2001-12-13 | 2004-03-12 | Valeo Electronique | Module de puissance et ensemble de modules de puissance |
US6580611B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Dual-sided heat removal system |
CN100352317C (zh) * | 2002-06-07 | 2007-11-28 | 松下电器产业株式会社 | 电子元件安装板、电子元件模块、制造电子元件安装板的方法及通信设备 |
US20040015158A1 (en) * | 2002-07-19 | 2004-01-22 | To-Mu Chen | Transilluminator device |
KR100625982B1 (ko) * | 2003-11-01 | 2006-09-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP4433875B2 (ja) * | 2004-05-14 | 2010-03-17 | オムロン株式会社 | 発熱部品の放熱構造と、この放熱構造における放熱部材の製造方法 |
JP2006066725A (ja) * | 2004-08-27 | 2006-03-09 | Sony Corp | 放熱構造を備える半導体装置及びその組立方法 |
EP1930942A4 (de) * | 2005-09-08 | 2011-03-09 | Neobulb Technologies Inc | Wärmeableitmodul-konstruktion für eine heizkomponente |
DE102005049872B4 (de) * | 2005-10-18 | 2010-09-23 | Continental Automotive Gmbh | IC-Bauelement mit Kühlanordnung |
US7827679B1 (en) | 2006-04-20 | 2010-11-09 | Rati M. Patel | Thermal management circuit board and methods of producing the same |
US7355854B2 (en) * | 2006-06-07 | 2008-04-08 | Harris Corporation | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards |
JP4694514B2 (ja) * | 2007-02-08 | 2011-06-08 | トヨタ自動車株式会社 | 半導体素子の冷却構造 |
WO2008099554A1 (ja) * | 2007-02-15 | 2008-08-21 | Nec Corporation | 半導体パッケージの実装構造 |
JP5312764B2 (ja) * | 2007-09-05 | 2013-10-09 | 株式会社ケーヒン | 放熱構造を有する電子装置 |
US20110163348A1 (en) * | 2008-03-25 | 2011-07-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump |
GB2461548B (en) * | 2008-07-02 | 2010-10-13 | Thales Holdings Uk Plc | Printed circuit board assembly |
US7724528B2 (en) * | 2008-07-11 | 2010-05-25 | Cisco Technology, Inc. | Thermal dissipation heat slug sandwich |
EP2321607A1 (de) * | 2008-08-04 | 2011-05-18 | Clustered Systems Company | Kontaktgekühltes elektronisches gehäuse |
JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
JP2010245174A (ja) | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
JP5515450B2 (ja) * | 2009-06-24 | 2014-06-11 | 富士通株式会社 | プリント基板の製造方法 |
JP5271886B2 (ja) * | 2009-12-08 | 2013-08-21 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5211118B2 (ja) * | 2010-07-27 | 2013-06-12 | 株式会社日立メディアエレクトロニクス | 光ピックアップ装置 |
KR101184508B1 (ko) * | 2011-02-08 | 2012-09-19 | 삼성전기주식회사 | 인쇄회로기판 |
JP2012227192A (ja) * | 2011-04-15 | 2012-11-15 | Astom Co Ltd | 基板装置 |
US20130308274A1 (en) * | 2012-05-21 | 2013-11-21 | Triquint Semiconductor, Inc. | Thermal spreader having graduated thermal expansion parameters |
US20140042657A1 (en) * | 2012-08-08 | 2014-02-13 | Makerbot Industries, Llc | Printed circuit board with integrated temperature sensing |
US10049960B2 (en) * | 2014-01-06 | 2018-08-14 | Mitsubishi Electric Corporation | Semiconductor device |
CN106489196B (zh) * | 2014-07-09 | 2019-04-12 | 三菱电机株式会社 | 半导体装置 |
JP6183314B2 (ja) | 2014-07-31 | 2017-08-23 | 株式会社デンソー | 電子装置及びそれを備えた駆動装置 |
DE102018200022A1 (de) * | 2018-01-02 | 2019-07-04 | Osram Gmbh | Anordnung und scheinwerfer |
WO2020202954A1 (ja) * | 2019-04-01 | 2020-10-08 | 住友電気工業株式会社 | 電子部品の実装構造、及び電子部品の実装構造の製造方法 |
WO2020202955A1 (ja) * | 2019-04-01 | 2020-10-08 | 住友電気工業株式会社 | 電子部品の実装構造 |
JP7178978B2 (ja) * | 2019-10-24 | 2022-11-28 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
WO2022230243A1 (ja) * | 2021-04-28 | 2022-11-03 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5386576A (en) * | 1977-01-10 | 1978-07-31 | Nec Corp | Package for semiconductor element |
US4535385A (en) * | 1983-04-22 | 1985-08-13 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
US4777434A (en) | 1985-10-03 | 1988-10-11 | Amp Incorporated | Microelectronic burn-in system |
US5208188A (en) * | 1989-10-02 | 1993-05-04 | Advanced Micro Devices, Inc. | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
US5012386A (en) * | 1989-10-27 | 1991-04-30 | Motorola, Inc. | High performance overmolded electronic package |
US5287247A (en) * | 1990-09-21 | 1994-02-15 | Lsi Logic Corporation | Computer system module assembly |
US5371386A (en) * | 1992-04-28 | 1994-12-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of assembling the same |
US5384953A (en) * | 1993-07-21 | 1995-01-31 | International Business Machines Corporation | Structure and a method for repairing electrical lines |
JP2845739B2 (ja) * | 1993-11-29 | 1999-01-13 | 三菱電機株式会社 | 圧接型半導体装置及びその製造方法 |
JPH07221218A (ja) * | 1994-02-03 | 1995-08-18 | Toshiba Corp | 半導体装置 |
JPH07335793A (ja) * | 1994-06-06 | 1995-12-22 | Fuji Electric Co Ltd | ヒートシンク |
US5625227A (en) * | 1995-01-18 | 1997-04-29 | Dell Usa, L.P. | Circuit board-mounted IC package cooling apparatus |
US5798909A (en) * | 1995-02-15 | 1998-08-25 | International Business Machines Corporation | Single-tiered organic chip carriers for wire bond-type chips |
KR19980024134A (ko) * | 1996-09-18 | 1998-07-06 | 모기 쥰이찌 | 반도체 패키지 |
-
1998
- 1998-12-07 JP JP34674598A patent/JP3677403B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-10 US US09/437,245 patent/US6297959B1/en not_active Expired - Fee Related
- 1999-11-12 EP EP99309011A patent/EP1009195B1/de not_active Expired - Lifetime
- 1999-11-12 DE DE69901281T patent/DE69901281T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69901281T2 (de) | 2002-10-02 |
EP1009195A1 (de) | 2000-06-14 |
JP2000174179A (ja) | 2000-06-23 |
JP3677403B2 (ja) | 2005-08-03 |
US6297959B1 (en) | 2001-10-02 |
EP1009195B1 (de) | 2002-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |