US20140042657A1 - Printed circuit board with integrated temperature sensing - Google Patents

Printed circuit board with integrated temperature sensing Download PDF

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Publication number
US20140042657A1
US20140042657A1 US13/961,972 US201313961972A US2014042657A1 US 20140042657 A1 US20140042657 A1 US 20140042657A1 US 201313961972 A US201313961972 A US 201313961972A US 2014042657 A1 US2014042657 A1 US 2014042657A1
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Prior art keywords
heating
conductive trace
trace
temperature
resistance
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US13/961,972
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Harry Elliot Mulliken
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MakerBot Industries LLC
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MakerBot Industries LLC
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Priority to US13/961,972 priority patent/US20140042657A1/en
Assigned to MAKERBOT INDUSTRIES, LLC reassignment MAKERBOT INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MULLIKEN, HARRY ELLIOT
Publication of US20140042657A1 publication Critical patent/US20140042657A1/en
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    • B29C67/0055
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/118Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • B29C64/393Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/00795Reading arrangements
    • H04N1/00827Arrangements for reading an image from an unusual original, e.g. 3-dimensional objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/04Constraint-based CAD
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00Details relating to CAD techniques
    • G06F2111/20Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18Manufacturability analysis or optimisation for manufacturability
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/80Technologies aiming to reduce greenhouse gasses emissions common to all road transportation technologies
    • Y02T10/82Elements for improving aerodynamics

Abstract

An extruder for a three-dimension printer uses a printed circuit board (PCB) heating element with leads having temperature-sensitive resistance. The resulting circuit can be driven at high power to heat an extruder, or at a low power with a known current to measure a resistance from which temperature can be inferred. Thus a single circuit on a printed circuit board can be driven alternately in two modes to heat and sense temperature of an extruder.

Description

    RELATED APPLICATION
  • This application claims the benefit of U.S. Prov. App. No. 61/680,989 filed on Aug. 8, 2012, the entire content of which is hereby incorporated by reference.
  • BACKGROUND
  • There remains a need for a printed circuit board that support heating and temperature sensing with a reduced part count.
  • SUMMARY
  • An extruder for a three-dimension printer uses a printed circuit board (PCB) heating element with leads having temperature-sensitive resistance. The resulting circuit can be driven at high power to heat an extruder, or at a low power with a known current to measure a resistance from which temperature can be inferred. Thus a single circuit on a printed circuit board can be driven alternately in two modes to heat and sense temperature of an extruder.
  • BRIEF DESCRIPTION OF THE FIGURES
  • The invention and the following detailed description of certain embodiments thereof may be understood by reference to the following figures:
  • FIG. 1 is a block diagram of a three-dimensional printer.
  • FIG. 2 shows a combined heater and temperature sensor integrated with a printed circuit board.
  • FIG. 3 shows a method for operating a printed circuit board with integrated temperature sensing.
  • FIG. 4 shows a method for fabricating conductive traces on a printed circuit board.
  • FIG. 5 shows a conductive trace forming a heating element.
  • DETAILED DESCRIPTION
  • All documents mentioned herein are hereby incorporated in their entirety by reference. References to items in the singular should be understood to include items in the plural, and vice versa, unless explicitly stated otherwise or clear from the text. Grammatical conjunctions are intended to express any and all disjunctive and conjunctive combinations of conjoined clauses, sentences, words, and the like, unless otherwise stated or clear from the context. Thus the term “or” should generally be understood to mean “and/or” and so forth.
  • The following description emphasizes three-dimensional printers using fused deposition modeling or similar techniques where a bead of material is extruded in a layered series of two dimensional patterns as “roads,” “paths” or the like to form a three-dimensional object from a digital model. It will be understood, however, that numerous additive fabrication techniques are known in the art including without limitation multijet printing, stereolithography, Digital Light Processor (“DLP”) three-dimensional printing, selective laser sintering, and so forth. Such techniques may benefit from the systems and methods described below, and all such printing technologies are intended to fall within the scope of this disclosure, and within the scope of terms such as “printer”, “three-dimensional printer”, “fabrication system”, and so forth, unless a more specific meaning is explicitly provided or otherwise clear from the context.
  • FIG. 1 is a block diagram of a three-dimensional printer. In general, the printer 100 may include a build platform 102, an extruder 106, an x-y-z positioning assembly 108, and a controller 110 that cooperate to fabricate an object 112 within a working volume 114 of the printer 100.
  • The build platform 102 may include a surface 116 that is rigid and substantially planar. The surface 116 may provide a fixed, dimensionally and positionally stable platform on which to build the object 112. The build platform 102 may include a thermal element 130 that controls the temperature of the build platform 102 through one or more active devices 132, such as resistive elements that convert electrical current into heat, Peltier effect devices that can create a heating or cooling affect, or any other thermoelectric heating and/or cooling devices. The thermal element 130 may be coupled in a communicating relationship with the controller 110 in order for the controller 110 to controllably impart heat to or remove heat from the surface 116 of the build platform 102.
  • The extruder 106 may include a chamber 122 in an interior thereof to receive a build material. The build material may, for example, include acrylonitrile butadiene styrene (“ABS”), high-density polyethylene (“HDPL”), polylactic acid (“PLA”), or any other suitable plastic, thermoplastic, or other material that can usefully be extruded to form a three-dimensional object. The extruder 106 may include an extrusion tip 124 or other opening that includes an exit port with a circular, oval, slotted or other cross-sectional profile that extrudes build material in a desired cross-sectional shape.
  • The extruder 106 may include a heater 126 (also referred to as a heating element) to melt thermoplastic or other meltable build materials within the chamber 122 for extrusion through an extrusion tip 124 in liquid form. While illustrated in block form, it will be understood that the heater 126 may include, e.g., coils of resistive wire wrapped about the extruder 106, one or more heating blocks with resistive elements to heat the extruder 106 with applied current, an inductive heater, or any other arrangement of heating elements suitable for creating heat within the chamber 122 sufficient to melt the build material for extrusion. The extruder 106 may also or instead include a motor 128 or the like to push the build material into the chamber 122 and/or through the extrusion tip 124.
  • In general operation (and by way of example rather than limitation), a build material such as ABS plastic in filament form may be fed into the chamber 122 from a spool or the like by the motor 128, melted by the heater 126, and extruded from the extrusion tip 124. By controlling a rate of the motor 128, the temperature of the heater 126, and/or other process parameters, the build material may be extruded at a controlled volumetric rate. It will be understood that a variety of techniques may also or instead be employed to deliver build material at a controlled volumetric rate, which may depend upon the type of build material, the volumetric rate desired, and any other factors. All such techniques that might be suitably adapted to delivery of build material for fabrication of a three-dimensional object are intended to fall within the scope of this disclosure.
  • The x-y-z positioning assembly 108 may generally be adapted to three-dimensionally position the extruder 106 and the extrusion tip 124 within the working volume 114. Thus by controlling the volumetric rate of delivery for the build material and the x, y, z position of the extrusion tip 124, the object 112 may be fabricated in three dimensions by depositing successive layers of material in two-dimensional patterns derived, for example, from cross-sections of a computer model or other computerized representation of the object 112. A variety of arrangements and techniques are known in the art to achieve controlled linear movement along one or more axes. The x-y-z positioning assembly 108 may, for example, include a number of stepper motors 109 to independently control a position of the extruder 106 within the working volume along each of an x-axis, a y-axis, and a z-axis. More generally, the x-y-z positioning assembly 108 may include without limitation various combinations of stepper motors, encoded DC motors, gears, belts, pulleys, worm gears, threads, and so forth. For example, in one aspect the build platform 102 may be coupled to one or more threaded rods by a threaded nut so that the threaded rods can be rotated to provide z-axis positioning of the build platform 102 relative to the extruder 106. This arrangement may advantageously simplify design and improve accuracy by permitting an x-y positioning mechanism for the extruder 106 to be fixed relative to a build volume. Any such arrangement suitable for controllably positioning the extruder 106 within the working volume 114 may be adapted to use with the printer 100 described herein.
  • In general, this may include moving the extruder 106, or moving the build platform 102, or some combination of these. Thus it will be appreciated that any reference to moving an extruder relative to a build platform, working volume, or object, is intended to include movement of the extruder or movement of the build platform, or both, unless a more specific meaning is explicitly provided or otherwise clear from the context. Still more generally, while an x, y, z coordinate system serves as a convenient basis for positioning within three dimensions, any other coordinate system or combination of coordinate systems may also or instead be employed, such as a positional controller and assembly that operates according to cylindrical or spherical coordinates.
  • The controller 110 may be electrically or otherwise coupled in a communicating relationship with the build platform 102, the x-y-z positioning assembly 108, and the other various components of the printer 100. In general, the controller 110 is operable to control the components of the printer 100, such as the build platform 102, the x-y-z positioning assembly 108, and any other components of the printer 100 described herein to fabricate the object 112 from the build material. The controller 110 may include any combination of software and/or processing circuitry suitable for controlling the various components of the printer 100 described herein including without limitation microprocessors, microcontrollers, application-specific integrated circuits, programmable gate arrays, and any other digital and/or analog components, as well as combinations of the foregoing, along with inputs and outputs for transceiving control signals, drive signals, power signals, sensor signals, and so forth. In one aspect, this may include circuitry directly and physically associated with the printer 100 such as an on-board processor. In another aspect, this may be a processor associated with a personal computer or other computing device coupled to the printer 100, e.g., through a wired or wireless connection. Similarly, various functions described herein may be allocated between an on-board processor for the printer 100 and a separate computer. All such computing devices and environments are intended to fall within the meaning of the term “controller” or “processor” as used herein, unless a different meaning is explicitly provided or otherwise clear from the context.
  • A variety of additional sensors and other components may be usefully incorporated into the printer 100 described above. These other components are generically depicted as other hardware 134 in FIG. 1, for which the positioning and mechanical/electrical interconnections with other elements of the printer 100 will be readily understood and appreciated by one of ordinary skill in the art. The other hardware 134 may include a temperature sensor positioned to sense a temperature of the surface of the build platform 102, the extruder 126, or any other system components. This may, for example, include a thermistor or the like embedded within or attached below the surface of the build platform 102. This may also or instead include an infrared detector or the like directed at the surface 116 of the build platform 102.
  • In another aspect, the other hardware 134 may include a sensor to detect a presence of the object 112 at a predetermined location. This may include an optical detector arranged in a beam-breaking configuration to sense the presence of the object 112 at a predetermined location. This may also or instead include an imaging device and image processing circuitry to capture an image of the working volume and to analyze the image to evaluate a position of the object 112. This sensor may be used for example to ensure that the object 112 is removed from the build platform 102 prior to beginning a new build on the working surface 116. Thus the sensor may be used to determine whether an object is present that should not be, or to detect when an object is absent. The feedback from this sensor may be used by the controller 110 to issue processing interrupts or otherwise control operation of the printer 100.
  • The other hardware 134 may also or instead include a heating element (instead of or in addition to the thermal element 130) to heat the working volume such as a radiant heater or forced hot air heater to maintain the object 112 at a fixed, elevated temperature throughout a build, or the other hardware 134 may include a cooling element to cool the working volume.
  • An extruder design of the printer 100 may use a printed circuit board (PCB) heating element that includes a through hole through which an extruder nozzle may pass. The PCB can be adhered to a metal plate that absorbs and transfers heat to the extruder nozzle. There may be one or more PCB copper traces that may be electrically coupled to the metal plate. The PCB copper traces may be manufactured to a tolerance such that their resistance changes predictably with temperature. With this known relationship, a calibrated current through the copper traces can provide a voltage indicative of the current temperature at the copper traces, from which other temperatures (metal plate, extruder nozzle) can be reliably inferred.
  • FIG. 2 shows a combined heater and temperature sensor integrated with a printed circuit board (PCB). As shown, an extrusion tool head 200 for a three-dimensional printer may generally include an extrusion nozzle 202, drive components 204 to drive a build material into and through the extrusion nozzle 202, and a PCB 206. The PCB 206 may include a hole 212 through which the extrusion nozzle 202 can pass, which may be filled after assembly with any suitable potting material or other thermal or electric insulator or conductor as desired. The PCB 206 may include a heating element 214 such as a resistive heating element that surrounds or is otherwise placed in close proximity to, and more specifically in thermal contact with, the extrusion nozzle 202 in order to create a hot zone to melt a build material in a chamber coupled to the extrusion nozzle 202 in order to extrude the build material through the extrusion nozzle 202. It will be appreciated that thermal contact may be achieved by direct physical contact or by contact through any suitable thermally conducting material(s).
  • The conductive traces 208 that may be formed of any suitably conductive material such as copper, aluminum, or the like. The conductive traces 208 may assume any suitable geometry within a plane of the PCB 206 such as spiral pattern or a series of adjacent linear runs. Where the PCB 206 has two or more layers, the conductive traces 208 may be on one or more such layers. In general, the use of longer, thinner traces provides greater resistance per unit of length and correspondingly more sensitive measurements, however no particular geometry or dimensions are required, provided that the relationship between temperature and resistance can be accurately characterized.
  • The heating element 214 may be electrically coupled to and driven through one or more conductive traces 208 on the PCB 206 that are manufactured to have a resistance that changes predictably with temperature. By applying a calibrated current to these conductive traces 208 and measuring the resulting voltage, the temperature of the traces (and by inference, the extrusion nozzle 202) can be determined. Each conductive trace 208 may have a first end 216 electrically coupled to the heating element 214 through a contact or the like, and have a predetermined relationship of resistance to temperature. Each conductive trace 208 may have a second end 218 electrically coupled to the power supply 210 through one or more wires. In general the heating element 214 may include one or more discrete heating element components coupled to or integrated into the PCB 206, such as resistive heating elements or the like. In another aspect, the heating element 214 may be a resistive heating element formed of a length of resistive material. This may advantageously be formed of a length of the conductive trace 208, eliminating the need for a separate, discrete heater.
  • Processing circuitry 220 may be coupled to the power supply 210 to control operation of the PCB 206, and more particularly to drive a heating circuit including the conductive traces 208 and the heating element 214 alternately in a heating mode and a temperature sensing mode as generally described herein. The processing circuitry 220 may also be coupled to a voltage sensing circuit 222 that provides a voltage differential across the conductive traces 208 or some portion thereof. It will be understood that while voltage sensing is depicted across the output of the power supply, voltage sensing may as a practical matter occur in a number of places. For example, voltage sensing may be performed across a single trace on the PCB 206 from a contact for the power supply 210 to a contact for the heating element 214. In another aspect the voltage sensing may be performed across the entire power circuit (e.g., from a positive to a negative contact of the power supply); however in this case, a load from the heating element might be independently measured, particularly where the load is known to be non-temperature sensitive, and calibrated out of a voltage sensing measurement across the conductive traces 208. In another aspect, the control circuitry 220 may selectively bypass the heating element 214 or otherwise isolate the lengths of conductive trace with a relay, switch or other low resistance coupling when in a temperature sensing mode in order to isolate a resistance measurement across the conductive traces 208, and then remove the bypass when returning to a heating mode. More generally, a variety of techniques may be used to isolate a voltage drop across some or all of the conductive traces 208 in order to measure resistance and calculate temperature thereof based upon the known, predetermined relationship between temperature and resistance for the conductive traces 208.
  • While FIG. 2 shows the PCB through hole approximately in the center of the PCB 206, it should be understood that the hole may be located at any location on the PCB 206 that allows for the placement of the extrusion tool head 200 components.
  • In this configuration, the traces 208 may be driven from a power supply 210 in two alternating modes. In one mode, high-current may be applied by the power supply 210 to heat the heating element 214. In a second mode, a calibrated, low-current signal may be applied by the power supply 210 to the traces 208 to determine the temperature of the heating element or the extrusion nozzle 202. In the second mode, the temperature may be determined by applying the calibrated current to the trace 208, measuring the voltage on the trace 208 that results from the calibrated current, and comparing the measured voltage to temperature data that is calibrated to the resistance of the traces 208. Additionally, there may be temperature data that relates the temperature or resistance of the traces 208 to the temperature of the heating element or extrusion nozzle 202. Therefore, once the resistance and temperature of the traces 208 is known, the temperature of the heating element or extruder nozzle may be determined.
  • In a non-limiting example of the trace and heating element configuration for temperature determination, two traces 208 may be connected in series with the heating element with a first trace 208 connected between the power supply 210 and a first heating element contact and a second trace 208 connected between a second heating element contact and the power supply 210. During the second mode of operation, while the calibrated current is applied, a first voltage across the two traces 208 and heating element may be determined as discussed above. Additionally, a second voltage may be measured across the first heating element contact and the second heating element contact to determine the voltage across the heating element. Then the second voltage can be subtracted from the first voltage to determine the voltage across only the traces 208. As stated above, once the voltage is determined for the traces 208, the temperature of the traces and heating element may be determined.
  • The high-current mode (or “heating mode”) and the low-current mode (or “sensing mode”) may usefully operate over a shared circuit to both heat the extrusion nozzle 202 and determine its temperature. In another aspect, the high-current mode and the low-current mode may be operated over parallel circuits—one coupled to the heating element 214 and one coupled to a conductive trace 208. Switching between modes may be performed periodically at any regular, varying, or random interval. In general, this approach advantageously reduces the number of wires and components required for concurrent temperature sensing and heating.
  • For meltable plastics such as PLA or ABS used in common extrusion-based three-dimensional printing, the power supply 210 may apply sufficient current to heat the extrusion nozzle 202 to at least one hundred degrees Centigrade. The amount of current required to achieve this temperature within the extruder may vary according to components used and the configuration of the physical arrangement of the heating element(s). Further, the desired operating temperature range may vary according to the build materials used in the extrusion process.
  • In the low-current mode, the processing circuitry 220 may control the power supply 210 to apply a calibrated current to the conductive traces 208. As described above, the processing circuitry 220 may be further configured to measure the voltage resulting from the applied current and, using Ohm's law and the predetermined relationship between temperature and resistance for the conductive traces 208, to calculate a temperature of the conductive traces 208. With this information, the temperature of the extrusion nozzle 202 may be inferred, or calculated directly from the measure voltage using a suitable mathematical model.
  • The processing circuitry 220 may also determine whether, based on a calculated temperature and a predetermined target temperature, additional heating is required, and the processing circuitry 220 may control the system in the high-current mode accordingly to move the calculated temperature for a subsequent measurement toward the target temperature.
  • FIG. 3 shows a method for operating a printed circuit board with integrated temperature sensing as described above.
  • The method 300 may begin with providing an assembly including the printed circuit board as shown in step 302. In general, the assembly may include the printed circuit board, an extrusion nozzle passing through a hole in the printed circuit board, a heating element mounted to the printed circuit board and thermally coupled to the extrusion nozzle, and a conductive trace on the printed circuit electrically coupled to and in series with the heating element, all as generally described above. In other embodiments, the conductive trace may be coupled in parallel with the heating element or otherwise arranged in a suitable electronic circuit on the printed circuit board with the power supply, heating element, voltage sensing circuitry, and processing circuitry. As described in the various embodiments above, the conductive trace used for measuring voltage may form a single length of trace, such as from a power supply terminal to a heating element terminal, or the conductive trace may include multiple segments completing a circuit between the positive and negative terminals of a power supply, such as by including a first lead from a first contact of the heating element and a second lead from a second contact of the heating element. More generally, any suitable circuit may be used provided that the trace has a known relationship between temperature and resistance. The conductive trace may be formed of copper, aluminum or any other suitable metal or other conductive material(s).
  • As shown in step 304, a relationship may be determined of the temperature to resistance for the conductive trace. While illustrated as occurring after the assembly is provided, it will be appreciated that this step may be performed at any time prior to calculating a temperature. For example, the relationship may be determined when the printed circuit board is fabricated, or after assembly into an extrusion system. In another aspect, the relationship may be measured using an onboard calibration circuit immediately prior to use. However determined, the relationship may be substituted into Ohm's law to permit calculation of temperature as a function of a known current and a measured voltage across the conductive trace.
  • As shown in step 306, the heating element may be powered through the conductive trace (from a power supply or the like) in a high-current or heating mode to heat the heating element.
  • As shown in step 308, the heating element may be powered through the conductive trace in a low-current or sensing mode with a known current and a voltage across the conductive trace may be measured. As noted above, the resistance of the heating element may be accounted for (either as a fixed or temperature-varying quantity), or the voltage may be measured only across the conductive trace. Accordingly, in one embodiment, the method may include determining a second voltage across a first contact and a second contact of the heating element and subtracting the second voltage from the voltage across a length of the conductive trace that includes two segments in series with the two terminals of the heating element. In other embodiments, the conductive trace may form an independent circuit in parallel with the heating element, and may be electrically isolated from or coupled to the power supply according to the desired mode. More generally, any technique for measuring voltage along a length of conductive trace that has a known relationship of temperature to resistance may be usefully employed in a temperature sensing measurement as contemplated herein.
  • As shown in step 310, the method 300 may include determining a temperature of the conductive trace based upon the voltage and the known, predetermined relationship between resistance and temperature for the conductive trace.
  • As shown in step 312, the method may include calculating a temperature of the extrusion nozzle based upon the temperature of the conductive trace. The relationship between the temperature of the conductive trace and the temperature of the extrusion nozzle may be empirically determined or estimated using physical modeling or the like based upon the structure of the extrusion nozzle, heater, circuit board, and so forth. It will be appreciated that, while illustrated as separate steps, the extrusion nozzle temperature may be calculated directly from the sensed voltage across the conductive trace using a suitably adapted mathematical model.
  • As shown in step 314, a control loop may be implemented by determining whether the temperature of the extrusion nozzle has reached a predetermined target value. If the temperature is at or above the target, then the method 300 may return to step 308 where the temperature may again be sensed. If the temperature is below the target, then the method 300 may return to step 306 where the heating element may be heated. The duration of heating in step 306 may be fixed, or may vary according to, e.g., a magnitude of the difference between the target temperature and the calculated temperature for the extrusion nozzle.
  • FIG. 4 shows a method for fabricating conductive traces on a printed circuit board. In the above techniques, it is generally advantageous to have conductive traces with known resistance/temperature characteristics. While the shape and/or amount of copper in the traces may be calculated for a desired temperature/resistance relationship based on physical properties of the copper, it may be impractical to manufacture such traces within a desired tolerance. In particular, in current manufacturing techniques the width of traces may vary significantly (e.g., 10-15%) in a manner that introduces excess variability into resulting resistance, thus making width a poor manufacturing parameter for controlling resistance; however, the height of a layer may be usefully controlled during fabrication to obtain calibrated traces notwithstanding variable width. These and similar techniques are described below for fabricating circuit boards with traces having temperature/resistance characteristics meeting desired specifications.
  • As shown in step 402, the method 400 may begin with fabricating a printed circuit board including a through-hole for an extrusion nozzle and a mounting location adjacent to the through-hole shaped for a heating element. The printed circuit board may be fabricated using any suitable techniques, the variety of which are well known to those of ordinary skill in the art, and may include one layer, two layer, or other multi-layer circuit board fabrication techniques.
  • As shown in step 404, the method 400 may include adding a copper trace to the printed circuit board extending from a contact of the mounting location (for the heating element) to a contact for a power supply, which would typically be off the printed circuit board for high-power heating applications, but is not necessarily so.
  • As shown in step 406, the method 400 may include measuring a resistance of the copper trace using any measurement circuitry amenable to use in a PCB fabrication environment.
  • As shown in step 308, the method 400 may include modifying the copper trace to adjust the resistance toward a predetermined resistance. A variety of techniques may be used to make such modifications. In one aspect, this may include layering additional copper onto a pattern of the copper trace in order to decrease resistance per unit length. By closely controlling the amount of copper added, the increased thickness and resulting change in resistance may be accurately estimated. In one aspect, this may include maintaining a substantially constant temperature—that is, a temperature that will not change in a manner that affects the resistance measurement or the resulting resistance per unit length, either within measurement limits of the testing circuitry or design limits of the resulting conductive trace—while layering additional copper. Similarly, the temperature may be varied within some range such as an intended operating range over which linear behavior is desired. By concurrently modifying the copper trace and measuring the resistance, suitable results may be achieved in a single, continuous fabrication step.
  • Other techniques may also or instead be employed. For example, modifying the copper trace may include cutting the copper trace to a length corresponding to the predetermined resistance. A suitable length for cutting may be determined, e.g., based on the aggregate resistance (as measured) and known length of the copper trace. In another aspect, the copper trace may include a number of traces having, e.g., different lengths or thicknesses, and modifying the copper trace may include selectively coupling one or more of the plurality of traces having an aggregate resistance closest to the predetermined resistance to the contact of the mounting location and the contact for the power supply. The traces may, e.g., be connected in series, in parallel, or in any combination of these to obtain a desired lump resistance parameter at a specific temperature.
  • As shown in step 410, after modifications the resistance of the copper trace may be measured again.
  • As shown in step 412, the measured resistance may be compared to a target resistance. While the relationship of resistance to temperature may be estimated or measured, this step may be simplified by comparing a single measurement at a single temperature to a discrete target. Once the scalar target is achieved, a more complete characterization may be performed as desired for accuracy of performance. If the measured resistance matches the target resistance within some predetermined tolerance, then the method 400 may proceed to step 414. If the measured resistance is outside the predetermined tolerance, then the method 400 may return to step 408 where the copper trace is once again modified to bring the actual resistance closer to the target resistance.
  • As shown in step 414, any number of finishing steps may be performed. This may for example include assembling components on the printed circuit board for use as intended. This may also include measuring or otherwise characterizing a temperature/resistance relationship over some range (such as an intended operating range for the finished product), and encoding the relationship into firmware or the like on the printed circuit board to support subsequent calibrated operation of the finished product. More generally, any additional steps for accurately capturing the temperature/resistance relationship of the copper traces, using the temperature sensing capabilities of the finished product, or otherwise shipping and deploying the finished product may be performed.
  • FIG. 5 shows a heating element formed of a conductive trace. As noted above, the heating element may advantageously be formed from the same conductive trace used to measure temperature. As shown in FIG. 5, this heating element 500 may be formed of a material such as copper on a printed circuit board. While depicted as an octagonal spiral, any suitable geometry may be employed. In general, a first end 502 may be coupled to a current source and a second end 504 may be coupled to a ground (or vice versa). The second end 504 may terminate in an opening for an extrusion nozzle to pass through. The second end 504 may also include a via to another layer of the printed circuit board for a return path to the power source. A similar spiral shape may also be provided in one or more other layers of the printed circuit board (not shown) including the other layer that provides the return path. This arrangement advantageously removes the need for a separate, discrete heating element and permits the conductive trace to serve as both a temperature sensing circuit and a heating circuit on the same printed circuit board.
  • The methods or processes described above, and steps thereof, may be realized in hardware, software, or any combination of these suitable for a particular application. The hardware may include a general-purpose computer and/or dedicated computing device. The processes may be realized in one or more microprocessors, microcontrollers, embedded microcontrollers, programmable digital signal processors, or other programmable device, along with internal and/or external memory. The processes may also, or instead, be embodied in an application specific integrated circuit, a programmable gate array, programmable array logic, or any other device or combination of devices that may be configured to process electronic signals. It will further be appreciated that one or more of the processes may be realized as computer executable code created using a structured programming language such as C, an object oriented programming language such as C++, or any other high-level or low-level programming language (including assembly languages, hardware description languages, and database programming languages and technologies) that may be stored, compiled or interpreted to run on one of the above devices, as well as heterogeneous combinations of processors, processor architectures, or combinations of different hardware and software.
  • Thus, in one aspect, each method described above and combinations thereof may be embodied in computer executable code that, when executing on one or more computing devices, performs the steps thereof. In another aspect, the methods may be embodied in systems that perform the steps thereof, and may be distributed across devices in a number of ways, or all of the functionality may be integrated into a dedicated, standalone device or other hardware. In another aspect, means for performing the steps associated with the processes described above may include any of the hardware and/or software described above. All such permutations and combinations are intended to fall within the scope of the present disclosure.
  • It should further be appreciated that the methods above are provided by way of example. Absent an explicit indication to the contrary, the disclosed steps may be modified, supplemented, omitted, and/or re-ordered without departing from the scope of this disclosure.
  • The method steps of the invention(s) described herein are intended to include any suitable method of causing such method steps to be performed, consistent with the patentability of the following claims, unless a different meaning is expressly provided or otherwise clear from the context. So for example performing the step of X includes any suitable method for causing another party such as a remote user or a remote processing resource (e.g., a server or cloud computer) to perform the step of X. Similarly, performing steps X, Y and Z may include any method of directing or controlling any combination of such other individuals or resources to perform steps X, Y and Z to obtain the benefit of such steps.
  • While particular embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that various changes and modifications in form and details may be made therein without departing from the spirit and scope of this disclosure and are intended to form a part of the invention as defined by the following claims, which are to be interpreted in the broadest sense allowable by law.

Claims (21)

What is claimed is:
1. A device comprising:
a printed circuit board;
a hole in the printed circuit board;
an extrusion nozzle passing through the hole;
a heating element on the printed circuit board, the heating element positioned in thermal contact with the extrusion nozzle; and
a conductive trace on the printed circuit board, the conductive trace having a first end coupled to a contact of the heating element, the conductive trace having a predetermined relationship of resistance to temperature.
2. The device of claim 1 wherein the conductive trace is a copper trace.
3. The device of claim 1 further comprising a second conductive trace on the printed circuit board electrically coupled to a second contact of the heating element.
4. The device of claim 1 further comprising a power supply electrically coupled to a second end of the conductive trace.
5. The device of claim 4 wherein the power supply operates in a first mode where high current is applied to the heating element to create heat in the heating element.
6. The device of claim 5 wherein the power supply operates in a second mode where a calibrated current is applied to the heating element and a voltage across the conductive trace is measured, thereby permitting a determination of the resistance of the conductive trace and, based upon the predetermined relationship of resistance to temperature, the temperature of the conductive trace.
7. The device of claim 1 further comprising processing circuitry configured to operate the power supply in a first mode where high current is applied to the heating element to create heat in the heating element.
8. The device of claim 7 wherein the power supply heats the heating element to at least one hundred degrees Centigrade.
9. The device of claim 7 wherein the processing circuitry is further configured to operate the power supply in a second mode where a calibrated current is applied to the heating element, the processing circuitry further configured to measure a voltage across the conductive trace.
10. The device of claim 9 wherein the processing circuitry is configured to calculate a temperature of the extrusion nozzle based upon the voltage.
11. The device of claim 1 wherein the heating element is a resistive element formed by a length of the conductive trace.
12. A method comprising:
providing an assembly including a printed circuit board, an extrusion nozzle passing through a hole in the printed circuit board, a heating element mounted to the printed circuit board and thermally coupled to the extrusion nozzle, and a conductive trace on the printed circuit board electrically coupled to and in series with the heating element;
determining a relationship of temperature to resistance for the conductive trace;
powering the heating element through the conductive trace in a first mode to heat the heating element;
powering the heating element through a conductive trace in a second mode with a known current and measuring a voltage across the conductive trace; and
determining a temperature of the conductive trace based upon the voltage.
13. The method of claim 12 further comprising calculating a temperature of the extrusion nozzle based upon the temperature of the conductive trace.
14. The method of claim 12 wherein the conductive trace includes a first lead from a first contact of the heating element and a second lead from a second contact of the heating element.
15. The method of claim 14 further comprising determining a second voltage across the first contact and the second contact of the heating element and subtracting the second voltage from the voltage across the conductive trace.
16. The method of claim 12 wherein the conductive trace includes a copper trace.
17. A method comprising:
fabricating a printed circuit board including a through-hole for an extrusion nozzle and a mounting location adjacent to the through-hole shaped for a heating element;
adding a copper trace to the printed circuit board from a contact of the mounting location to a contact for a power supply;
measuring a resistance of the copper trace; and
modifying the copper trace to adjust the resistance toward a predetermined resistance.
18. The method of claim 17 wherein modifying the copper trace includes layering additional copper onto a pattern of the copper trace.
19. The method of claim 18 wherein modifying the copper trace includes maintaining a substantially constant temperature of the copper while layering additional copper and concurrently measuring the resistance.
20. The method of claim 17 wherein modifying the copper trace includes cutting the copper trace to a length corresponding to the predetermined resistance.
21. The method of claim 17 wherein the copper trace includes a plurality of traces, and wherein modifying the copper trace includes selectively coupling one or more of the plurality of traces having an aggregate resistance closest to the predetermined resistance to the contact of the mounting location and the contact for the power supply.
US13/961,972 2012-08-08 2013-08-08 Printed circuit board with integrated temperature sensing Abandoned US20140042657A1 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150108922A1 (en) * 2013-10-22 2015-04-23 Kia Motors Corporation Motor driving device for vehicle
USD733196S1 (en) 2014-02-03 2015-06-30 Wolf And Associates, Inc. 3D printer enclosure
WO2016053312A1 (en) * 2014-09-30 2016-04-07 Hewlett-Packard Development Company, L.P. Generating a three-dimensional object
US20160101463A1 (en) * 2013-09-13 2016-04-14 Made In Space, Inc. Manufacturing in microgravity and varying external force environments
USD760306S1 (en) 2015-03-20 2016-06-28 Wolf & Associates, Inc. 3D printer enclosure
US20160185050A1 (en) * 2013-08-09 2016-06-30 Kimberly-Clark Worldwide, Inc. Polymeric Material for Three-Dimensional Printing
WO2016126962A1 (en) * 2015-02-04 2016-08-11 Ohio State Innovation Foundation Systems and methods for additive manufacturing
US10195778B2 (en) 2013-10-15 2019-02-05 Wolf & Associates, Inc. Three-dimensional printer systems and methods
US10586144B2 (en) 2014-09-29 2020-03-10 Avery Dennison Corporation Tire tracking RFID label
US10684603B2 (en) 2015-01-13 2020-06-16 Bucknell University Dynamically controlled screw-driven extrusion

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8241905B2 (en) 2004-02-24 2012-08-14 The Curators Of The University Of Missouri Self-assembling cell aggregates and methods of making engineered tissue using the same
WO2010008905A2 (en) 2008-06-24 2010-01-21 The Curators Of The University Of Missouri Self-assembling multicellular bodies and methods of producing a three-dimensional biological structure using the same
CA2812766A1 (en) 2010-10-21 2012-04-26 Organovo, Inc. Devices, systems, and methods for the fabrication of tissue
US9499779B2 (en) 2012-04-20 2016-11-22 Organovo, Inc. Devices, systems, and methods for the fabrication of tissue utilizing UV cross-linking
US9308690B2 (en) 2012-07-31 2016-04-12 Makerbot Industries, Llc Fabrication of objects with enhanced structural characteristics
US20140046473A1 (en) 2012-08-08 2014-02-13 Makerbot Industries, Llc Automated model customization
US9473760B2 (en) * 2012-08-08 2016-10-18 Makerbot Industries, Llc Displays for three-dimensional printers
US20140088750A1 (en) * 2012-09-21 2014-03-27 Kloneworld Pte. Ltd. Systems, methods and processes for mass and efficient production, distribution and/or customization of one or more articles
KR101823441B1 (en) * 2012-10-05 2018-01-31 에스프린팅솔루션 주식회사 Terminal and Method for Forming Video, Apparatus for Forming Image, Driving Method Thereof, and Computer-Readable Recording Medium
US9442105B2 (en) 2013-03-15 2016-09-13 Organovo, Inc. Engineered liver tissues, arrays thereof, and methods of making the same
US10259160B2 (en) * 2013-03-22 2019-04-16 Markforged, Inc. Wear resistance in 3D printing of composites
US9579851B2 (en) 2013-03-22 2017-02-28 Markforged, Inc. Apparatus for fiber reinforced additive manufacturing
US9156205B2 (en) 2013-03-22 2015-10-13 Markforged, Inc. Three dimensional printer with composite filament fabrication
US9688028B2 (en) 2013-03-22 2017-06-27 Markforged, Inc. Multilayer fiber reinforcement design for 3D printing
US10682844B2 (en) 2013-03-22 2020-06-16 Markforged, Inc. Embedding 3D printed fiber reinforcement in molded articles
CN107953572A (en) 2013-06-05 2018-04-24 马克弗巨德有限公司 Method for fiber reinforcement addition manufacture
US9149988B2 (en) 2013-03-22 2015-10-06 Markforged, Inc. Three dimensional printing
US9126365B1 (en) 2013-03-22 2015-09-08 Markforged, Inc. Methods for composite filament fabrication in three dimensional printing
US9815268B2 (en) 2013-03-22 2017-11-14 Markforged, Inc. Multiaxis fiber reinforcement for 3D printing
US9956725B2 (en) 2013-03-22 2018-05-01 Markforged, Inc. Three dimensional printer for fiber reinforced composite filament fabrication
CA2907492A1 (en) 2013-03-22 2014-09-25 Gregory Thomas Mark Three dimensional printing
US9751294B2 (en) * 2013-05-09 2017-09-05 Perkinelmer Informatics, Inc. Systems and methods for translating three dimensional graphic molecular models to computer aided design format
WO2014193406A1 (en) * 2013-05-31 2014-12-04 Hewlett-Packard Development Company, L.P. Modifying a base layer of an object
US20150037445A1 (en) 2013-07-31 2015-02-05 Organovo, Inc. Automated devices, systems, and methods for the fabrication of tissue
EP3058496A4 (en) * 2013-10-17 2017-07-12 Plethora Corporation Method for implementing design-for-manufacturability checks
US10086568B2 (en) * 2013-10-21 2018-10-02 Made In Space, Inc. Seamless scanning and production devices and methods
US10705509B2 (en) * 2013-10-21 2020-07-07 Made In Space, Inc. Digital catalog for manufacturing
US9724876B2 (en) * 2013-12-13 2017-08-08 General Electric Company Operational performance assessment of additive manufacturing
US20150177158A1 (en) * 2013-12-13 2015-06-25 General Electric Company Operational performance assessment of additive manufacturing
US20160332382A1 (en) * 2014-01-14 2016-11-17 King's College London 3D Printing of Facial Prostheses
US10052797B2 (en) 2014-01-25 2018-08-21 Made In Space, Inc. Recycling materials in various environments including reduced gravity environments
US9229674B2 (en) 2014-01-31 2016-01-05 Ebay Inc. 3D printing: marketplace with federated access to printers
CN103941768B (en) * 2014-03-19 2016-05-25 中国科学技术大学 A kind of objective table zoned temperature control system of printing for 3D
CN106536720A (en) 2014-04-04 2017-03-22 奥加诺沃公司 Engineered three-dimensional breast tissue, adipose tissue, and tumor disease model
CN104085107B (en) * 2014-06-26 2016-09-28 珠海天威飞马打印耗材有限公司 Three-dimensional printer, the Method of printing of three-dimensional printer and printing equipment thereof
KR101944737B1 (en) * 2014-08-14 2019-02-01 삼성에스디에스 주식회사 Apparatus and method for control of three-dimensional printing
US9862149B2 (en) * 2014-08-29 2018-01-09 Microsoft Technology Licensing, Llc Print bureau interface for three-dimensional printing
US20160070161A1 (en) * 2014-09-04 2016-03-10 Massachusetts Institute Of Technology Illuminated 3D Model
JP6432230B2 (en) * 2014-09-09 2018-12-05 富士ゼロックス株式会社 Modeling apparatus, method for manufacturing modeled object, and application unit
US9481868B2 (en) 2014-10-06 2016-11-01 Organovo, Inc. Engineered renal tissues, arrays thereof, and methods of making the same
CN104384612B (en) * 2014-10-20 2017-11-21 芜湖林一电子科技有限公司 A kind of recovery and processing system of 3 D-printing product
US20160167307A1 (en) * 2014-12-16 2016-06-16 Ebay Inc. Systems and methods for 3d digital printing
US9595037B2 (en) 2014-12-16 2017-03-14 Ebay Inc. Digital rights and integrity management in three-dimensional (3D) printing
KR101530631B1 (en) * 2014-12-18 2015-06-23 한국건설기술연구원 System and method for measuring density using 3d scanner
WO2016109696A1 (en) * 2015-01-02 2016-07-07 Voxei8, Inc. Electrical communication with 3d-printed objects
US9927090B2 (en) * 2015-02-03 2018-03-27 John Clifton Cobb, III Profile-shaped articles
US9878481B2 (en) * 2015-03-02 2018-01-30 Makerbot Industries, Llc Extruder for three-dimensional printers
CN104646670B (en) * 2015-03-06 2017-05-24 沈湧 High-frequency induction melting type metal 3D (three-dimensional) printing machine
WO2016187106A1 (en) * 2015-05-19 2016-11-24 President And Fellows Of Harvard College Apparatus and method for high temperature 3d printing
JP2017041169A (en) * 2015-08-21 2017-02-23 富士ゼロックス株式会社 Control device, reading device, work support system and program
US10406801B2 (en) 2015-08-21 2019-09-10 Voxel8, Inc. Calibration and alignment of 3D printing deposition heads
WO2017040615A1 (en) * 2015-09-04 2017-03-09 Restoration Robotics, Inc. Methods, systems and instruments for creating partial model of a head for use in hair transplantation
IL241219A (en) * 2015-09-06 2016-07-31 Shmuel Ur Innovation Ltd Print-head for a 3d printer
US10459430B2 (en) * 2015-09-11 2019-10-29 Xerox Corporation Method and system for variable data printing in a 3D print system
US10442118B2 (en) * 2015-09-29 2019-10-15 Iowa State University Research Foundation, Inc. Closed loop 3D printing
US20170142276A1 (en) * 2015-11-18 2017-05-18 John Lacagnina Mobile networked system for capturing and printing three dimensional images
CA3008667A1 (en) 2015-12-16 2017-06-22 Desktop Metal, Inc. Methods and systems for additive manufacturing
WO2017110375A1 (en) * 2015-12-22 2017-06-29 ローランドディー.ジー.株式会社 Three-dimensional processing apparatus
JP6572142B2 (en) 2016-01-26 2019-09-04 キヤノン株式会社 Information processing apparatus, control method, and program
NL2017016B1 (en) * 2016-06-21 2018-01-04 Ultimaker B V Nozzle for a three dimensional printing apparatus
DE102016212063A1 (en) * 2016-07-01 2018-01-04 Eos Gmbh Electro Optical Systems Apparatus and method for irradiation control in a device for producing a three-dimensional object
EP3493974A4 (en) * 2016-08-05 2020-04-15 Jabil Inc. Apparatus, system and method of providing a fff printing nozzle
CN107808417A (en) * 2016-09-08 2018-03-16 索尼公司 Message processing device and information processing method
US20180126665A1 (en) * 2016-11-04 2018-05-10 Cc3D Llc Additive manufacturing system having vibrating nozzle
US20180194076A1 (en) * 2017-01-12 2018-07-12 Voxei8, Inc. Techniques for hybrid additive and substractive manufacturing
WO2018160205A1 (en) 2017-03-03 2018-09-07 Perkinelmer Informatics, Inc. Systems and methods for searching and indexing documents comprising chemical information
WO2018194606A1 (en) * 2017-04-20 2018-10-25 Hewlett-Packard Development Company, L.P. Heating source operation for three dimensional object fabrication
CN107696499B (en) * 2017-09-27 2019-07-16 北京工业大学 The detection of 3D printing product quality and restorative procedure that threedimensional model is combined with machine vision
US10698386B2 (en) 2017-10-18 2020-06-30 General Electric Company Scan path generation for a rotary additive manufacturing machine
US20190163167A1 (en) * 2017-11-28 2019-05-30 General Electric Company Scan path correction for movements associated with an additive manufacturing machine
CN109365810A (en) * 2018-11-22 2019-02-22 华中科技大学 Laser in-situ prepares the method and product of arbitrary shape copper-based shape memory alloy

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100239789A1 (en) * 2006-08-31 2010-09-23 Konica Minolta Opto, Inc. Optical Film, Manufacturing Method for Optical Film, Polarizing Plate and Liquid Crystal Display Device

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3918867A (en) * 1969-06-28 1975-11-11 Philips Corp Device for extruding permanent magnet bodies
US4306243A (en) * 1979-09-21 1981-12-15 Dataproducts Corporation Ink jet head structure
US4334637A (en) 1980-08-25 1982-06-15 Nordson Corporation Extrusion nozzle assembly
GB9112997D0 (en) 1991-06-17 1991-08-07 Lupke Manfred Arno Alfred Extrusion die with interchangeable extrusion nozzles
US5412166A (en) * 1993-06-25 1995-05-02 United Technologies Automotive, Inc. Power window switch control apparatus
WO1995007509A1 (en) * 1993-09-10 1995-03-16 The University Of Queensland Stereolithographic anatomical modelling process
US6085957A (en) * 1996-04-08 2000-07-11 Stratasys, Inc. Volumetric feed control for flexible filament
US5733468A (en) * 1996-08-27 1998-03-31 Conway, Jr.; John W. Pattern plating method for fabricating printed circuit boards
US5793648A (en) * 1996-09-30 1998-08-11 Freightliner Corporation Method and system for automating control panel layout and wiring specifications for a vehicle manufacturing process
GB9626825D0 (en) 1996-12-24 1997-02-12 Crampton Stephen J Avatar kiosk
US20040246311A1 (en) * 1997-07-15 2004-12-09 Kia Silverbrook Inkjet printhead with heater element close to drive circuits
US7708372B2 (en) * 1997-07-15 2010-05-04 Silverbrook Research Pty Ltd Inkjet nozzle with ink feed channels etched from back of wafer
US6377865B1 (en) * 1998-02-11 2002-04-23 Raindrop Geomagic, Inc. Methods of generating three-dimensional digital models of objects by wrapping point cloud data points
JP3677403B2 (en) * 1998-12-07 2005-08-03 パイオニア株式会社 Heat dissipation structure
US6760488B1 (en) 1999-07-12 2004-07-06 Carnegie Mellon University System and method for generating a three-dimensional model from a two-dimensional image sequence
US6564112B1 (en) * 1999-11-08 2003-05-13 Eventide Inc. Method of customizing electronic systems based on user specifications
US20020085219A1 (en) * 2000-08-11 2002-07-04 Victor Ramamoorthy Method of and system for generating and viewing multi-dimensional images
US20020111707A1 (en) * 2000-12-20 2002-08-15 Zhimin Li Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers
US20020166220A1 (en) 2001-05-11 2002-11-14 United Air Lines, Inc. Process for repairing a structure
US6866807B2 (en) * 2001-09-21 2005-03-15 Stratasys, Inc. High-precision modeling filament
JP4352392B2 (en) * 2001-09-28 2009-10-28 ブラザー工業株式会社 Nozzle head, nozzle head holding device, and droplet jet patterning device
US20040043806A1 (en) * 2002-02-08 2004-03-04 Keith Kirby Online vehicle collection and play activity
US6713724B1 (en) * 2002-10-11 2004-03-30 Perfect Fit Industries, Inc. Heating element arrangement for an electric blanket or the like
US6839607B2 (en) 2003-01-09 2005-01-04 The Boeing Company System for rapid manufacturing of replacement aerospace parts
DE10319494A1 (en) 2003-04-30 2004-11-18 Mtu Aero Engines Gmbh Process for repairing and / or modifying components of a gas turbine
US7315644B2 (en) * 2003-07-31 2008-01-01 The Boeing Company Investigation of destroyed assemblies and identification of components thereof
US20050157919A1 (en) * 2003-07-31 2005-07-21 Di Santo Brenda I. Investigation of destroyed assemblies and identification of components thereof using texture mapping
US20050058573A1 (en) * 2003-09-12 2005-03-17 Frost James Dahle Use of rapid prototyping techniques for the rapid production of laboratory or workplace automation processes
US20060100934A1 (en) * 2004-11-10 2006-05-11 Janice Burr Automated customer interface and ordering system for requisitioning the manufacture of customized equipment and products
US20060293906A1 (en) * 2005-06-24 2006-12-28 The Boeing Company Method of developing a plan for replacing a product component using a scanning process
US8170302B1 (en) 2005-09-30 2012-05-01 Ut-Battelle, Llc System and method for generating motion corrected tomographic images
US7531123B2 (en) * 2005-10-27 2009-05-12 The Boeing Company Direct manufactured self-contained parts kit
US7510323B2 (en) * 2006-03-14 2009-03-31 International Business Machines Corporation Multi-layered thermal sensor for integrated circuits and other layered structures
US8050893B2 (en) * 2006-11-17 2011-11-01 Protocase Inc. Method and system for the design of an enclosure to house internal components
US20090295032A1 (en) * 2007-03-14 2009-12-03 Stratasys, Inc. Method of building three-dimensional object with modified ABS materials
US7758171B2 (en) * 2007-03-19 2010-07-20 Eastman Kodak Company Aerodynamic error reduction for liquid drop emitters
US8579671B2 (en) * 2007-06-06 2013-11-12 Rick DeRennaux Custom remote controlled vehicle kit
ES2323351B1 (en) * 2007-09-04 2010-04-23 Fundacio Privada Ascamm DEVICE AND DEVICE FOR SELECTIVE DEPOSITION OF Fused PLASTIC MATTER AND MANUFACTURING METHOD BY SELECTIVE DEPOSITION.
US8070473B2 (en) 2008-01-08 2011-12-06 Stratasys, Inc. System for building three-dimensional objects containing embedded inserts, and method of use thereof
US7897074B2 (en) * 2008-04-30 2011-03-01 Stratasys, Inc. Liquefier assembly for use in extrusion-based digital manufacturing systems
CA2755555C (en) 2009-03-20 2018-09-11 3Shape A/S System and method for effective planning, visualization, and optimization of dental restorations
US8175734B2 (en) 2009-10-08 2012-05-08 3D M. T. P. Ltd. Methods and system for enabling printing three-dimensional object models
ES2402257T3 (en) 2009-10-30 2013-04-30 Alstom Technology Ltd Method to repair a component of a gas turbine
US8647098B2 (en) * 2010-09-22 2014-02-11 Stratasys, Inc. Liquefier assembly for use in extrusion-based additive manufacturing systems
US8412588B1 (en) * 2010-09-24 2013-04-02 Amazon Technologies, Inc. Systems and methods for fabricating products on demand
US8512024B2 (en) * 2011-01-20 2013-08-20 Makerbot Industries, Llc Multi-extruder
CH704448A1 (en) 2011-02-03 2012-08-15 Alstom Technology Ltd A method of repairing or reconditioning of heavily damaged component, in particular from the hot gas area of ​​a gas turbine.
EP2739251A4 (en) * 2011-08-03 2015-07-29 Conformis Inc Automated design, selection, manufacturing and implantation of patient-adapted and improved articular implants, designs and related guide tools
US9230325B2 (en) 2011-08-19 2016-01-05 University Of Rochester Three-dimensional model acquisition using planar mirrors
EP2754128A4 (en) * 2011-09-09 2015-05-06 Barney D Pell System and method for electronic commerce and fabrication of 3d parts
US8778252B2 (en) 2012-01-20 2014-07-15 Wisconsin Alumni Research Foundation Three-dimensional printing system using dual rotation axes
US20130220570A1 (en) 2012-02-29 2013-08-29 Ford Motor Company Additive fabrication technologies for creating molds for die components
US9050753B2 (en) * 2012-03-16 2015-06-09 Stratasys, Inc. Liquefier assembly having inlet liner for use in additive manufacturing system
US20130297062A1 (en) * 2012-05-03 2013-11-07 Alberto Daniel Lacaze Field Deployable Rapid Prototypable UXVs
US20140023996A1 (en) 2012-07-18 2014-01-23 F3 & Associates, Inc. Three Dimensional Model Objects
US9308690B2 (en) 2012-07-31 2016-04-12 Makerbot Industries, Llc Fabrication of objects with enhanced structural characteristics
US20140046473A1 (en) 2012-08-08 2014-02-13 Makerbot Industries, Llc Automated model customization
US10029415B2 (en) * 2012-08-16 2018-07-24 Stratasys, Inc. Print head nozzle for use with additive manufacturing system
US9592530B2 (en) * 2012-11-21 2017-03-14 Stratasys, Inc. Additive manufacturing with polyamide consumable materials
US9233506B2 (en) * 2012-12-07 2016-01-12 Stratasys, Inc. Liquefier assembly for use in additive manufacturing system
US9378522B2 (en) * 2013-02-26 2016-06-28 W.W. Grainger, Inc. Methods and systems for the nonintrusive identification and ordering of component parts
US8827684B1 (en) * 2013-12-23 2014-09-09 Radiant Fabrication 3D printer and printhead unit with multiple filaments

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100239789A1 (en) * 2006-08-31 2010-09-23 Konica Minolta Opto, Inc. Optical Film, Manufacturing Method for Optical Film, Polarizing Plate and Liquid Crystal Display Device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160185050A1 (en) * 2013-08-09 2016-06-30 Kimberly-Clark Worldwide, Inc. Polymeric Material for Three-Dimensional Printing
US9656426B2 (en) * 2013-09-13 2017-05-23 Made In Space, Inc. Manufacturing in microgravity and varying external force environments
US20160101463A1 (en) * 2013-09-13 2016-04-14 Made In Space, Inc. Manufacturing in microgravity and varying external force environments
US10195778B2 (en) 2013-10-15 2019-02-05 Wolf & Associates, Inc. Three-dimensional printer systems and methods
US20150108922A1 (en) * 2013-10-22 2015-04-23 Kia Motors Corporation Motor driving device for vehicle
USD733196S1 (en) 2014-02-03 2015-06-30 Wolf And Associates, Inc. 3D printer enclosure
US10586144B2 (en) 2014-09-29 2020-03-10 Avery Dennison Corporation Tire tracking RFID label
WO2016053312A1 (en) * 2014-09-30 2016-04-07 Hewlett-Packard Development Company, L.P. Generating a three-dimensional object
US10684603B2 (en) 2015-01-13 2020-06-16 Bucknell University Dynamically controlled screw-driven extrusion
WO2016126962A1 (en) * 2015-02-04 2016-08-11 Ohio State Innovation Foundation Systems and methods for additive manufacturing
USD776727S1 (en) 2015-03-20 2017-01-17 Wolf & Associates, Inc. 3D printer enclosure
USD760306S1 (en) 2015-03-20 2016-06-28 Wolf & Associates, Inc. 3D printer enclosure

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